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2. 发明专利

JP2007294918A Shielding film and shielding printed wiring board 有权
标题翻译：屏蔽薄膜和屏蔽印刷线路板
公开(公告)号：JP2007294918A
公开(公告)日：2007-11-08
申请号：JP2007078806
申请日：2007-03-26
申请人： Tatsuta System Electronics Kk , タツタシステム・エレクトロニクス株式会社
发明人： UENO KENJI , KAWAKAMI TOKINORI , MORIMOTO SHOHEI , HASHIMOTO KAZUHIRO
IPC分类号： H05K1/02
摘要： PROBLEM TO BE SOLVED: To provide a fire-resistant shielding film that can be used under an environment resulting in the case where the shielding film is heated in a post-process, such as in the case of reflow process. SOLUTION: The shielding film 1 includes an insulating layer 2, and a metal layer 3 and an adhesive layer 4 that are overlaid in increasing order on one surface of the insulating layer 2. The adhesive layer 4 contains a main component of a thermosetting resin or preferably a fire-resistant thermosetting resin loaded with a conductive filler. It is preferable that a flame retardant of 10 to 180 pts.wt. be blended with the resistant thermosetting resin of 100 pts.wt. in the adhesive layer 4. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种耐火屏蔽膜，其可以在导致在后处理中（例如在回流处理的情况下）屏蔽膜被加热的情况下使用的环境。解决方案：屏蔽膜1包括在绝缘层2的一个表面上以增加的顺序重叠的绝缘层2和金属层3和粘合剂层4.粘合剂层4包含主要成分热固性树脂或优选具有负载导电填料的耐火热固性树脂。阻燃剂优选为10〜180重量份与100重量份的耐热性热固性树脂混合在粘合层4中。（C）2008，JPO＆INPIT

3. 发明专利

JP2007189091A Isotropic conductive bonding sheet and circuit substrate 审中-公开
标题翻译：等电导体粘结片和电路基板
公开(公告)号：JP2007189091A
公开(公告)日：2007-07-26
申请号：JP2006006404
申请日：2006-01-13
申请人： Tatsuta System Electronics Kk , タツタシステム・エレクトロニクス株式会社
发明人： TERADA TSUNEHIKO , NOBORITOUGE MASAYUKI , MORIMOTO SHOHEI
IPC分类号： H05K9/00 , B32B27/00 , C09J7/02 , C09J9/02 , C09J11/04 , C09J201/00 , H01B1/20 , H05K1/02
CPC分类号： H05K3/321 , C09J7/10 , C09J2201/602 , H05K2203/0338
摘要： PROBLEM TO BE SOLVED: To provide: an isotropic conductive bonding sheet simplifying a bonding process of a metallic reinforcing sheet to a circuit substrate body, and providing the circuit substrate with continuity reliability as well as electromagnetic shield effect; and the circuit substrate obtained by employing the isotropic conductive bonding sheet. SOLUTION: The isotropic conductive bonding sheet 1 is provided with a parting film 2, and an isotropic conductive bonding agent layer 3 formed on the surface of the parting film 2. Part number 5 shows the circuit substrate body (only bonding part is shown in a figure), part number 6 shows an insulating layer, part number 7 shows an electrode consisting of copper or the like, and part number 8 shows the reinforcing sheet. The isotropic conductive bonding agent layer 3 consists of a binder comprising conductive particles 4. The conductive particles 4 are metal powder or low melting point metal powder having the average particle size of 5-50 μm and 150-250 pts.wt. of the same is blended into 100 pts.wt. of the binder. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供：各向同性导电接合片，简化金属加强片与电路基板本体的接合工艺，并为电路基板提供连续可靠性以及电磁屏蔽效果; 以及通过使用各向同性导电接合片获得的电路基板。各向同性导电接合片1具有分型膜2和形成在分型膜2的表面上的各向同性导电接合剂层3.部件号5表示电路基板主体（仅接合部为部件号6表示绝缘层，部件号7表示由铜等构成的电极，部件号8表示加强片。各向同性导电性接合剂层3由包含导电性粒子4的粘合剂构成。导电性粒子4为平均粒径为5-50μm，150〜250重量份的金属粉末或低熔点金属粉末。的相同混合成100重量份的粘合剂。版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2006298954A Electroconductive adhesive sheet and circuit board 有权
标题翻译：电磁粘合片和电路板
公开(公告)号：JP2006298954A
公开(公告)日：2006-11-02
申请号：JP2005117800
申请日：2005-04-15
申请人： Tatsuta System Electronics Kk , タツタシステム・エレクトロニクス株式会社
发明人： TERADA TSUNEHIKO , MORIMOTO SHOHEI , NOBORITOUGE MASAYUKI
IPC分类号： C09J7/02 , C09J9/02 , C09J11/04 , C09J201/00 , H05K3/32 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide an electroconductive adhesive sheet which is used for electrically connecting a substrate with components and a circuit board in which the substrate and the components are electrically connected.
SOLUTION: The adhesive sheet is provided with an electroconductive adhesive layer containing a low-melting metal powder and a metal powder having a higher melting point than the low-melting metal powder. The average particle sizes of the low-melting metal powder and the higher-melting metal powder are 10-100 μm. In the circuit board, the substrate having electrodes on the surface and the components are bonded and electrically connected on the surface side of the substrate with the electroconductive adhesive layer containing the low-melting metal powder having an average particle size of 10-100 μm and the metal powder having a higher melting point than the low-melting metal powder and an average particle size of 10-100 μm.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于将基板与部件电连接的导电粘合片和其中基板和部件电连接的电路板。解决方案：粘合片设置有含有低熔点金属粉末和熔点高于低熔点金属粉末的金属粉末的导电粘合剂层。低熔点金属粉末和高熔点金属粉末的平均粒径为10〜100μm。在电路板中，表面上具有电极的基板和部件在基板的表面侧上粘合并电连接，其中导电粘合剂层含有平均粒度为10-100μm的低熔点金属粉末，金属粉末的熔点高于低熔点金属粉末，平均粒径为10〜100μm。版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP2005276873A Shielding film for printed wiring board and its manufacturing method 有权
标题翻译：印刷电路板屏蔽膜及其制造方法
公开(公告)号：JP2005276873A
公开(公告)日：2005-10-06
申请号：JP2004083846
申请日：2004-03-23
申请人： Tatsuta System Electronics Kk , タツタシステム・エレクトロニクス株式会社
发明人： UENO KENJI , KAWAKAMI TOKINORI , TERADA TSUNEHIKO , HASHIMOTO KAZUHIRO
IPC分类号： B32B15/04 , H05K1/02 , H05K9/00
摘要： PROBLEM TO BE SOLVED: To provide a shielding film for printed wiring board and its manufacturing method capable of preventing a metal thin-film layer and an adhesive layer from peeling, even if come gas is produced from adhesive and if water contained in the film is evaporated.
SOLUTION: The shielding film 1 for printed wiring board includes the metal thin-film layer 3 comprising an air permeable metal foil and the adhesive layer 4 both provided sequentially on one surface of an insulating layer 2.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种能够防止金属薄膜层和粘合剂层剥离的用于印刷电路板的屏蔽膜及其制造方法，即使由粘合剂产生气体，并且如果水包含在该膜被蒸发。解决方案：用于印刷线路板的屏蔽膜1包括金属薄膜层3，该金属薄膜层3包括透气金属箔和粘合层4，二者均依次设置在绝缘层2的一个表面上。 C）2006，JPO＆NCIPI

6. 发明专利

JP2008108629A Conductive paste and multilayer board using this 有权
标题翻译：导电胶和多层板使用此
公开(公告)号：JP2008108629A
公开(公告)日：2008-05-08
申请号：JP2006291568
申请日：2006-10-26
申请人： Tatsuta System Electronics Kk , タツタシステム・エレクトロニクス株式会社
发明人： MIYAMOTO MASANORI , UMEDA HIROAKI
IPC分类号： H01B1/22 , C09J9/02 , C09J11/04 , C09J11/06 , C09J163/00 , H01B1/00 , H05K1/09 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a conductive paste excellent in moisture resistance, heat cycle characteristics, and thermal shock resistance, with superb conductivity expected to be maintained for a long period of time, in forming a multilayer board with one having viscosity suited for hole filling and with a long pot life, as well as a multilayer board with long-period reliability using the above. SOLUTION: The conductive paste is made by containing (B) 200 to 1,800 weight parts of metal powder consisting of two kinds or more of metal containing at least a kind of low-melting-point metal with a melting point of 180°C or less and at least a kind of high-melting-point metal with a melting point of 800°C or more, (C) 3 to 20 weight parts of curing agents, and (D) 3 to 15 weight parts of flux, in (A) 100 weight parts of resin components with a total hydrolytic chlorine density of less than 1,000 ppm consisting of 20 weight parts or more of epoxy resin with an epoxy equivalent within the range of 200 to 600 with a hydrolytic chlorine density of less than 200 ppm and less than 80 weight parts of other resin. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有优异的耐湿性，热循环特性和耐热冲击性的导电浆料，具有预期长时间保持的极好的导电性，在形成具有粘度的多层板的多层板中适用于孔填充，使用寿命长，以及使用上述长期可靠性的多层板。解决方案：导电性浆料是通过含有（B）200〜1,800重量份的金属粉末制成的，所述金属粉末由两种或更多种含有至少一种熔点为180°的低熔点金属的金属组成至少一种熔点为800℃以上的高熔点金属，（C）3〜20重量份的固化剂，（D）3〜15重量份的助熔剂，在（A）100重量份树脂组分中，总水解氯密度小于1,000ppm，由20重量份或更多环氧树脂组成，环氧当量在200-600范围内，水解氯密度小于 200ppm和小于80重量份的其它树脂。版权所有（C）2008，JPO＆INPIT

7. 发明专利

JP2007328485A Personal identification device 有权
标题翻译：个人识别装置
公开(公告)号：JP2007328485A
公开(公告)日：2007-12-20
申请号：JP2006158136
申请日：2006-06-07
申请人： Tatsuta System Electronics Kk , タツタシステム・エレクトロニクス株式会社
发明人： MORITA TAKASHI , MIYATA YASUSHI
IPC分类号： G06T7/00 , A61B5/117
摘要： PROBLEM TO BE SOLVED: To provide a personal identification device where the accuracy of identification is more improved than before by generating data for identification which requires a larger amount of data. SOLUTION: A personal identification device includes a finger insertion section 1, a control device for controlling cameras 2 and 3 described below and light sources 4, 5, and a management device to which the results from the control device is output. The control device performs a step of generating identification data by making the light source 4 and 5 emit near infrared rays, capturing the vein pattern of a finger 6 imaged by the cameras 2 and 3, and combining these data; a step of verifying the identification data with the registration data of a person to be identified who is already registered; a step of registering the generated identification data in a storage section as this person's registration data; a step of assigning a registration ID number to the registration step; a step of determining whether the finger 6 is inserted into the finger insertion section 1; and a display control to a display output section and the like. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种个人识别装置，其中通过生成需要更大量数据的识别数据，识别精度比以前更加改善。解决方案：个人识别装置包括手指插入部分1，用于控制下面描述的照相机2和3的控制装置和光源4,5以及输出来自控制装置的结果的管理装置。控制装置执行通过使光源4和5发射近红外线产生识别数据的步骤，捕获由照相机2和3成像的手指6的静脉图案，并组合这些数据; 使用已经登记的被识别人的登记数据验证识别数据的步骤; 将生成的识别数据登记在存储部中作为该人的登记数据的步骤; 向注册步骤分配注册ID号码的步骤; 确定手指6是否插入到手指插入部分1中的步骤; 以及对显示输出部等的显示控制。版权所有（C）2008，JPO＆INPIT

8. 发明专利

JP2007294996A Shielding film, shielding printed wiring board, shielding flexible printed circuit board, and method of manufacturing shielding film and shielding printed wiring board 有权
标题翻译：保护膜，屏蔽印刷线路板，屏蔽柔性印刷电路板及其制造方法和屏蔽印刷线路板
公开(公告)号：JP2007294996A
公开(公告)日：2007-11-08
申请号：JP2007178041
申请日：2007-07-06
申请人： Nippon Mektron Ltd , Tatsuta System Electronics Kk , タツタシステム・エレクトロニクス株式会社 , 日本メクトロン株式会社
发明人： HASHIMOTO KAZUHIRO , MORIMOTO SHOHEI , KAWAKAMI TOKINORI , UENO KENJI , EBIHARA SATOSHI , TANAKA HIDEAKI , AKATSUKA TAKATOSHI
IPC分类号： H05K9/00 , H05K1/02 , H05K3/28
摘要： PROBLEM TO BE SOLVED: To provide a shielding film which does not generate breakage of a metal layer, is excellent in wear resistance and blocking resistance, and does not break.
SOLUTION: A cover film 7 is provided on one surface of a separate film 6a. An adhesive layer 8a is formed through the metal layer 8b on a surface of the cover film 7 opposite to the one surface contacting with the separate film 6a. The cover film 7 comprises at least one layer of a hard layer 7a and at least one layer of a soft layer 7b. The surface of the cover film 7 contacting with the separate film 6a is the hard layer 7a.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供不产生金属层破裂的屏蔽膜，耐磨性和抗粘连性优异，不破裂。解决方案：在单独的膜6a的一个表面上设置覆盖膜7。在覆盖膜7的与分开的膜6a接触的一个表面相对的表面上通过金属层8b形成粘合剂层8a。覆盖膜7包括至少一层硬层7a和至少一层软层7b。与分离膜6a接触的覆盖膜7的表面是硬质层7a。版权所有（C）2008，JPO＆INPIT

9. 发明专利

JP2006297602A Material for forming circuit, circuit board using it and manufacturing method of circuit board 有权
标题翻译：使用电路板的电路，电路板的制造方法和电路板的制造方法
公开(公告)号：JP2006297602A
公开(公告)日：2006-11-02
申请号：JP2005117799
申请日：2005-04-15
申请人： Tatsuta System Electronics Kk , タツタシステム・エレクトロニクス株式会社
发明人： TERADA TSUNEHIKO , MORIMOTO SHOHEI , NOBORITOUGE MASAYUKI , KINOSHITA JUNICHI , HASHIMOTO KAZUHIRO
IPC分类号： B32B15/08 , B32B27/18 , H05K1/02 , H05K1/14 , H05K3/36
摘要： PROBLEM TO BE SOLVED: To provide a material for forming a circuit used for simplifying a manufacturing process, a circuit board using it and a manufacturing method of the circuit board.
SOLUTION: A wiring pattern layer 7, an insulating layer 8 having a hole 8a, an anisotropic conductive adhesive layer 3, a metal layer 2 and an insulating layer 9 are formed on the surface of an insulating layer 6 in this order. The anisotropic conductive adhesive layer 3 is turned toward the surface of the insulating layer 8 to bond the material 1 for forming the circuit composed of a reinforcing film 4, the metal layer 2 and the anisotropic conductive adhesive layer 3 under heating and pressure and a part of the anisotropic conductive adhesive layer 3 is penetrated in the hole 8a to electrically connect the metal layer 2 and the wiring pattern layer 7.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供用于形成用于简化制造工艺的电路的材料，使用该电路的电路板和电路板的制造方法。解决方案：在绝缘层6的表面上依次形成布线图案层7，具有孔8a的绝缘层8，各向异性导电粘合剂层3，金属层2和绝缘层9。各向异性导电粘合剂层3朝向绝缘层8的表面转动，以在加热和压力下将用于形成由增强膜4，金属层2和各向异性导电粘合剂层3组成的电路的材料1接合在一起的各向异性导电粘合剂层3穿透在孔8a中以电连接金属层2和布线图案层7.版权所有：（C）2007，JPO＆INPIT

10. 发明专利

JP2010199528A Bonding wire 审中-公开
标题翻译：绑线
公开(公告)号：JP2010199528A
公开(公告)日：2010-09-09
申请号：JP2009094065
申请日：2009-04-08
申请人： Tatsuta System Electronics Kk , タツタシステム・エレクトロニクス株式会社
发明人： HASEGAWA TAKESHI
IPC分类号： H01L21/60
CPC分类号： H01L24/85 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/43 , H01L2224/4321 , H01L2224/43848 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45639 , H01L2224/45644 , H01L2224/45664 , H01L2224/45669 , H01L2224/45673 , H01L2224/4809 , H01L2224/48091 , H01L2224/48095 , H01L2224/4847 , H01L2224/78301 , H01L2224/85045 , H01L2224/85181 , H01L2224/85205 , H01L2924/00011 , H01L2924/00015 , H01L2924/01005 , H01L2924/01007 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01204 , H01L2924/10253 , H01L2924/14 , H01L2924/15787 , H01L2924/20105 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/00014 , H01L2924/00 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , H01L2924/20109 , H01L2924/2011 , H01L2924/20111 , H01L2924/01006
摘要： PROBLEM TO BE SOLVED: To improve bonding strength in conjunction with an increase of operation speed even when a work stage temperature is as low as approximately 150°C. SOLUTION: The bonding wire P connects an electrode (a) of an integrated circuit element to a conductor wiring c of a circuit wiring board by a ball bonding method. A coating layer 2 formed of one or more selected from gold, platinum. palladium and silver is formed on an entire outer circumference of a core material 1 formed of 99.99 mass% or more copper. The coating wire is subjected to diffusion heat treatment to improve adhesion of the core material 1 and coating layer 2. Then, the coating wire is drawn to have a wire diameter L of 12-50.8 μm. Furthermore, thermal refining treatment is carried out to have tensile elongation 8% or more to obtain the bonding wire having the coating layer 2 with a thickness 0.04-0.09 μm. The bonding wire of this structure is connected to the electrode and conductor wiring with sufficient bonding strength, and even in high-speed operation at a low temperature, the operation does not stop. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决的问题：即使在工作台温度低至约150℃时，也可以结合操作速度的提高来提高接合强度。解决方案：接合线P通过球接法将集成电路元件的电极（a）与电路布线板的导体布线c连接。由选自金，铂中的一种或多种形成的涂层2。在由99.99质量％以上的铜形成的芯材1的整个外周上形成有钯和银。对涂层线进行扩散热处理，以提高芯材1和涂层2的粘附性。然后，将涂敷线拉伸成具有12-50.8μm的线径L. 此外，进行热精炼处理以具有8％以上的拉伸伸长率，以获得具有厚度为0.04-0.09μm的涂层2的接合线。这种结构的接合线以足够的接合强度连接到电极和导体布线，并且即使在低温下的高速操作中，操作也不会停止。版权所有（C）2010，JPO＆INPIT

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