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1. 发明专利

JP2006297602A Material for forming circuit, circuit board using it and manufacturing method of circuit board 有权
标题翻译：使用电路板的电路，电路板的制造方法和电路板的制造方法
公开(公告)号：JP2006297602A
公开(公告)日：2006-11-02
申请号：JP2005117799
申请日：2005-04-15
申请人： Tatsuta System Electronics Kk , タツタシステム・エレクトロニクス株式会社
发明人： TERADA TSUNEHIKO , MORIMOTO SHOHEI , NOBORITOUGE MASAYUKI , KINOSHITA JUNICHI , HASHIMOTO KAZUHIRO
IPC分类号： B32B15/08 , B32B27/18 , H05K1/02 , H05K1/14 , H05K3/36
摘要： PROBLEM TO BE SOLVED: To provide a material for forming a circuit used for simplifying a manufacturing process, a circuit board using it and a manufacturing method of the circuit board.
SOLUTION: A wiring pattern layer 7, an insulating layer 8 having a hole 8a, an anisotropic conductive adhesive layer 3, a metal layer 2 and an insulating layer 9 are formed on the surface of an insulating layer 6 in this order. The anisotropic conductive adhesive layer 3 is turned toward the surface of the insulating layer 8 to bond the material 1 for forming the circuit composed of a reinforcing film 4, the metal layer 2 and the anisotropic conductive adhesive layer 3 under heating and pressure and a part of the anisotropic conductive adhesive layer 3 is penetrated in the hole 8a to electrically connect the metal layer 2 and the wiring pattern layer 7.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供用于形成用于简化制造工艺的电路的材料，使用该电路的电路板和电路板的制造方法。解决方案：在绝缘层6的表面上依次形成布线图案层7，具有孔8a的绝缘层8，各向异性导电粘合剂层3，金属层2和绝缘层9。各向异性导电粘合剂层3朝向绝缘层8的表面转动，以在加热和压力下将用于形成由增强膜4，金属层2和各向异性导电粘合剂层3组成的电路的材料1接合在一起的各向异性导电粘合剂层3穿透在孔8a中以电连接金属层2和布线图案层7.版权所有：（C）2007，JPO＆INPIT

2. 发明专利

JP2007189091A Isotropic conductive bonding sheet and circuit substrate 审中-公开
标题翻译：等电导体粘结片和电路基板
公开(公告)号：JP2007189091A
公开(公告)日：2007-07-26
申请号：JP2006006404
申请日：2006-01-13
申请人： Tatsuta System Electronics Kk , タツタシステム・エレクトロニクス株式会社
发明人： TERADA TSUNEHIKO , NOBORITOUGE MASAYUKI , MORIMOTO SHOHEI
IPC分类号： H05K9/00 , B32B27/00 , C09J7/02 , C09J9/02 , C09J11/04 , C09J201/00 , H01B1/20 , H05K1/02
CPC分类号： H05K3/321 , C09J7/10 , C09J2201/602 , H05K2203/0338
摘要： PROBLEM TO BE SOLVED: To provide: an isotropic conductive bonding sheet simplifying a bonding process of a metallic reinforcing sheet to a circuit substrate body, and providing the circuit substrate with continuity reliability as well as electromagnetic shield effect; and the circuit substrate obtained by employing the isotropic conductive bonding sheet. SOLUTION: The isotropic conductive bonding sheet 1 is provided with a parting film 2, and an isotropic conductive bonding agent layer 3 formed on the surface of the parting film 2. Part number 5 shows the circuit substrate body (only bonding part is shown in a figure), part number 6 shows an insulating layer, part number 7 shows an electrode consisting of copper or the like, and part number 8 shows the reinforcing sheet. The isotropic conductive bonding agent layer 3 consists of a binder comprising conductive particles 4. The conductive particles 4 are metal powder or low melting point metal powder having the average particle size of 5-50 μm and 150-250 pts.wt. of the same is blended into 100 pts.wt. of the binder. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供：各向同性导电接合片，简化金属加强片与电路基板本体的接合工艺，并为电路基板提供连续可靠性以及电磁屏蔽效果; 以及通过使用各向同性导电接合片获得的电路基板。各向同性导电接合片1具有分型膜2和形成在分型膜2的表面上的各向同性导电接合剂层3.部件号5表示电路基板主体（仅接合部为部件号6表示绝缘层，部件号7表示由铜等构成的电极，部件号8表示加强片。各向同性导电性接合剂层3由包含导电性粒子4的粘合剂构成。导电性粒子4为平均粒径为5-50μm，150〜250重量份的金属粉末或低熔点金属粉末。的相同混合成100重量份的粘合剂。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2006298954A Electroconductive adhesive sheet and circuit board 有权
标题翻译：电磁粘合片和电路板
公开(公告)号：JP2006298954A
公开(公告)日：2006-11-02
申请号：JP2005117800
申请日：2005-04-15
申请人： Tatsuta System Electronics Kk , タツタシステム・エレクトロニクス株式会社
发明人： TERADA TSUNEHIKO , MORIMOTO SHOHEI , NOBORITOUGE MASAYUKI
IPC分类号： C09J7/02 , C09J9/02 , C09J11/04 , C09J201/00 , H05K3/32 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide an electroconductive adhesive sheet which is used for electrically connecting a substrate with components and a circuit board in which the substrate and the components are electrically connected.
SOLUTION: The adhesive sheet is provided with an electroconductive adhesive layer containing a low-melting metal powder and a metal powder having a higher melting point than the low-melting metal powder. The average particle sizes of the low-melting metal powder and the higher-melting metal powder are 10-100 μm. In the circuit board, the substrate having electrodes on the surface and the components are bonded and electrically connected on the surface side of the substrate with the electroconductive adhesive layer containing the low-melting metal powder having an average particle size of 10-100 μm and the metal powder having a higher melting point than the low-melting metal powder and an average particle size of 10-100 μm.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于将基板与部件电连接的导电粘合片和其中基板和部件电连接的电路板。解决方案：粘合片设置有含有低熔点金属粉末和熔点高于低熔点金属粉末的金属粉末的导电粘合剂层。低熔点金属粉末和高熔点金属粉末的平均粒径为10〜100μm。在电路板中，表面上具有电极的基板和部件在基板的表面侧上粘合并电连接，其中导电粘合剂层含有平均粒度为10-100μm的低熔点金属粉末，金属粉末的熔点高于低熔点金属粉末，平均粒径为10〜100μm。版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2009038278A Shielding film for printed wiring board and printed wiring board 有权
标题翻译：印刷电路板和印刷电路板的屏蔽膜
公开(公告)号：JP2009038278A
公开(公告)日：2009-02-19
申请号：JP2007202709
申请日：2007-08-03
申请人： Tatsuta System Electronics Kk , タツタシステム・エレクトロニクス株式会社
发明人： NOBORITOUGE MASAYUKI , UENO KENJI , MORIMOTO SHOHEI , KAWAKAMI TOKINORI
IPC分类号： H05K9/00 , B32B3/28 , B32B15/04 , H05K1/02
CPC分类号： H05K9/0084 , H05K1/0218 , H05K1/0393 , H05K3/281 , H05K2201/0715
摘要： PROBLEM TO BE SOLVED: To obtain a shielding film for a printed wiring board and a printed wiring board, in which the destruction of a metal layer is hard to occur against repeated bending/sliding from a large bending radius to a small bending radius (1.0 mm). SOLUTION: A shielding film for a printed wiring board 10 is equipped with a metal layer 2 formed in one side of an insulating layer 1, wherein the arithmetic mean roughness (JIS B 0601(1994)) of the one side of the insulating layer 1 is 0.5-5.0 μm, and at the same time, the metal layer 2 is formed so as to be a bellows structure along the one side surface of the insulating layer 1. The printed wiring board is made by pasting the shielding film 10 for printed wiring board to a substrate film. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了获得印刷线路板和印刷电路板的屏蔽膜，其中金属层的破坏难以发生，从而从大的弯曲半径反复弯曲/滑动到小的弯曲半径（1.0mm）。解决方案：印刷电路板10的屏蔽膜配备有形成在绝缘层1的一侧的金属层2，其中，所述绝缘层1的一侧的算术平均粗糙度（JIS B 0601（1994））绝缘层1为0.5〜5.0μm，同时金属层2形成为沿着绝缘层1的一个侧面的波纹管结构。印刷电路板通过将屏蔽膜 10用于印刷线路板到基底膜。版权所有（C）2009，JPO＆INPIT

5. 发明专利

JP2006040806A Extra-fine coaxial cable and its manufacturing method 有权
标题翻译：超小型同轴电缆及其制造方法
公开(公告)号：JP2006040806A
公开(公告)日：2006-02-09
申请号：JP2004222032
申请日：2004-07-29
申请人： Tatsuta System Electronics Kk , タツタシステム・エレクトロニクス株式会社
发明人： NOBORITOUGE MASAYUKI , TERADA TSUNEHIKO , HASHIMOTO KAZUHIRO , MORIMOTO SHOHEI
IPC分类号： H01B11/18 , H01B13/016
摘要： PROBLEM TO BE SOLVED: To provide an extra-fine coaxial cable which is superior in performance of electromagnetic wave shield, and provide a manufacturing method of the extra-fine coaxial cable of which the productivity can be improved even if thickness of the shield is thin. SOLUTION: This extra-fine coaxial cable is provided with at least one center conductor, an insulating layer to cover the surrounding of the center conductor, and a metal layer which is made to be dried by vapor-depositing the metal or by applying a metal organic compound, and which is covered so that atoms are densely arranged in a row at the surrounding of the insulating layer. Furthermore, this manufacturing method of the extra-fine coaxial cable includes a process to form a fluorine-based resin layer by forming a fluorine-based resin coated on the surrounding of the center conductor, a process to plasma-treat the outer surface of the fluorine-based resin layer, and a process in which the outer surface of the fluorine-based resin layer is vapor-deposited by the metal, plated by the metal, or coated by the metal organic compound on the plasma-treated outer surface of the fluorine-based resin layer, and dried. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种超声波同轴电缆的超细同轴电缆，其特征在于电磁波屏蔽性能优异，并且提供了超细同轴电缆的制造方法，即使在盾薄解决方案：该超细同轴电缆设置有至少一个中心导体，绝缘层以覆盖中心导体的周围，以及金属层，其通过气相沉积金属或通过涂覆金属有机化合物，其被覆盖，使得原子在绝缘层的周围密集地排列成一行。此外，该超细同轴电缆的制造方法包括通过形成涂布在中心导体的周围的氟系树脂来形成氟系树脂层的工序，等离子体处理氟系树脂层，以及通过金属气相沉积氟基树脂层的外表面，由金属电镀或被金属有机化合物涂覆在等离子体处理过的外表面上的方法氟类树脂层，干燥。版权所有（C）2006，JPO＆NCIPI

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