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81. 发明专利

JPS63304587A FORMING METHOD FOR ELECTRICAL CONNECTION CONTACT 失效
公开(公告)号：JPS63304587A
公开(公告)日：1988-12-12
申请号：JP14026487
申请日：1987-06-04
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： TSUDA TOSHIO , HORIO YASUHIKO , BESSHO YOSHIHIRO
IPC分类号： H01R43/00 , H01L21/60
摘要： PURPOSE:To simplify the forming method for electrical connection contact of a semiconductor chip by using a metallic thin wire gripped by a capillary, and by forming a ball by a ball bonding method, and by forming a bumpy contact of a prescribed shape. CONSTITUTION:A metallic thin wire capable of ball bonding, for example, a gold wire 5 of 25mum in diameter is gripped by a capillary 3 made of a ceramic material or the like, and thermal fusion is used to form a ball 6 on a tip of the gold wire 5. Next, thermal welding or the like is used to fix the ball 6 on an input/output electrode pad 2 of a semiconductor chip 1, so that a bottom part 7 of a bumpy contact of about 80 to 100mum in diameter and of about 35 to 45mum in height is formed. While the gold wire 5 is coupled with the bumpy contact, it is made to pass through a hole 4 of the capillary 3. Next the capillary 3 is moved in the desired direction, that is, in a looped state, so that a bumpy contact of a desired shape can be formed in such a simple process.

82. 发明专利

JPS63275127A ELECTRICAL CONNECTION CONTACT 失效
公开(公告)号：JPS63275127A
公开(公告)日：1988-11-11
申请号：JP11102287
申请日：1987-05-07
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： TSUDA TOSHIO , HORIO YASUHIKO , BESSHO YOSHIHIRO
IPC分类号： H01L21/60 , H05K3/32
摘要： PURPOSE:To prevent exudation and expansion of conductive adhesive agent, and enable a fine connection, by providing the electrode pad of a semiconductor chip with a contact region of two-step structure whose top part has a small diameter and protrudes. CONSTITUTION:The contact top part 3b of an electrical connection contact point 3 has a smaller diameter as compared with the outer diameter of a contact bottom part 3a, and protrudes step-wise. The height from the contact bottom part 3a to the contact top part 3b is several tens of microns. A conductive adhesive agent layer 4 is replicated and constituted on the electrical connection contact 3 by a stamping method and the like. The conductive adhesive agent layer 4 is positioned so as to be opposite to the conductor terminal part 6 of a circuit substrate 5, and then is hardened after a press-bonding applying a flip chip bonder and the like. Therefore, the thickness of the conductive adhesive agent layer 4 is regulated by the step-difference of the contact bottom part 3a, so that exudation and expansion of the conductive adhesive agent can be prevented. Thereby, the connection between the electrodes formed finely and densely can be formed with high reliability.

83. 发明专利

JPS63102518A LINE CONTROL METHOD 失效
公开(公告)号：JPS63102518A
公开(公告)日：1988-05-07
申请号：JP24869286
申请日：1986-10-20
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： BESSHO YOSHIHIRO , MIZUNO MASANOBU , TANABE KENZO , KAWAGUCHI KIMIO
IPC分类号： H04Q9/00 , H04L12/28 , H04L12/40
摘要： PURPOSE:To provide limitless general-purpose properties and extendability to a portable terminal equipment by setting a common communication line between the portable terminal equipment and each equipment and adding an identification code given to an equipment setting a line to data transmitted/received to/from a communication line between the portable terminal equipment and individual equipment on the communication line. CONSTITUTION:When data giving an instruction for switching between a communication line and an equipment 3 is inputted, an identification code representing an equipment 2 is added to the data by an identification code adder 18 and the data is sent to the equipment 2 via a communication controller 15. When the said data is received, the equipment 2 stops the operation, refers to a storage table of the identification codes to allow an identification code setting device 17 to generate command data changing the received data to the identification code of the equipment 3 and sends the result to the portable terminal equipment 1. The data is received by the portable terminal equipment 1, where the identification code of the equipment 3 is set. Just after the setting, the identification code setting device 17 generates data instructing the start to the equipment and sends it to a communication controller 15. Thus, the communication line with the equipment 3 is set.

84. 发明专利

JPS62135395A INTEGRATED CIRCUIT MODULE FOR INTEGRATED CIRCUIT CARD 失效
公开(公告)号：JPS62135395A
公开(公告)日：1987-06-18
申请号：JP27633685
申请日：1985-12-09
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： BESSHO YOSHIHIRO
IPC分类号： H01L23/28 , B42D15/02 , B42D15/10 , G06K19/00 , G06K19/077

85. 发明专利

JPS61286988A IC CARD 失效
公开(公告)号：JPS61286988A
公开(公告)日：1986-12-17
申请号：JP12888285
申请日：1985-06-13
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： BESSHO YOSHIHIRO , TANABE KENZO
IPC分类号： G06K19/07 , B42D15/02 , B42D15/10 , G06K19/00
摘要： PURPOSE:To improve an electrostatic resistance characteristic by connecting a depression type FET and a bias circuit between electrodes of an IC card. CONSTITUTION:Between respective electrodes 2-8 of an IC card 1 and a grounding electrode 9, depression type FET 12-15 are connected. These FET 12-14 are controlled by a bias circuit constituted by resistance 10, 15. During the card 1 being not used, the FET 12-15 are turned on to be a low impedance and a voltage between the electrodes 2-8 and the electrode 9 goes to zero, and during the IC card being used, the FET 12-15 become high impedance. Accordingly, even when an electrostatic charge is applied, a remarkable rise in an electric potential between the electrodes is not generated, but the electrostatic resistance characteristic is raised to have the IC card of high safety.

86. 发明专利

JPS61243583A INFORMATION CARD 失效
公开(公告)号：JPS61243583A
公开(公告)日：1986-10-29
申请号：JP8361885
申请日：1985-04-20
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： BESSHO YOSHIHIRO , TANABE KENZO , WATANABE HIROTOSHI
IPC分类号： G06K19/00 , B42D15/02 , G06K19/063 , G06K21/00 , G11B9/00
摘要： PURPOSE:To facilitate recording and reprocessing of information data, to check visually its contents and to rewrite them freely by disposing character informa tion corresponding to plural characters and an identification code on a card surface. CONSTITUTION:On the surface of the information card 1 plural character string 2 using KANJI (Chinese character), KANA (Japanese syllabary), alphameric and a simple mark and a code block 3 expressing each character, alphameric or the mark of the character string 2 with a two-byte code, a timing code and an error checking code are disposed. The block 3 is formed on the surface of a card basic material 13 in such a way that a unit bit available from laminating an electrolyte layer 10 on the surface of a thin film 9 made of an electrochromic material under a protective film 8 is disposed by separating a separating material 11 for preventing the mutual intervene and thereunder a common electrode 12 is laminated. Then, when the electrode 12 is set to a negative potential and a voltage is impressed between an electrode 12 and the electrode 14, the thin film 9 is colored.

87. 发明专利

JPS61195480A IC CARD 失效
公开(公告)号：JPS61195480A
公开(公告)日：1986-08-29
申请号：JP3690685
申请日：1985-02-26
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： TANABE KENZO , BESSHO YOSHIHIRO
IPC分类号： G06K19/07 , B42D15/10 , G06K19/00
摘要： PURPOSE:To prevent an IC card from being damaged due to an electrostatic charge given carelessly by connecting a depression-type FET element across the electrode and the earth of an IC chip and then connecting the gate of the FET to a DC current power source connecting electrode. CONSTITUTION:The depression-type FET elements 11, 12 and 13 are connected across the power source terminal 1 of the IC chip, terminals 2 and 3 and the earth terminal 8, and a bias available from dividing a voltage by resistances 9 and 10 is impressed on the gate of each FET element from the power source terminal 1. In the disuse of the card, an impedance between the drain and source of the FET elements 11-13 comes to a low value because a voltage between the gate and source is low. When data is written and read from the card, a bias of about 1V is given to the gate from the power source terminal 1 to raise the impedance between the drain and the source. Thus even if the electrostatic charge is carelessly given to the electrode in the disuse of the card, a sharp rise in a potential can be prevented, and the card can be protected from the damage.

88. 发明专利

JPS61192111A TONE CONTROL CIRCUIT 失效
公开(公告)号：JPS61192111A
公开(公告)日：1986-08-26
申请号：JP3209285
申请日：1985-02-20
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： BESSHO YOSHIHIRO , TANABE KENZO
IPC分类号： H03H7/01
摘要： PURPOSE:To simplify the circuit and to control electronically the characterstic by using a switching circuit controlled by a microcomputer and an R-2R ladder type resistance network for an attenuation section of a low and high frequency signal. CONSTITUTION:The input signal is fed respectively to an LPF 6, a BPF 7 and an HPF 8. The output of the LPF 6 and the HPF 8 is inputted to the next R-2R ladded type resistance network 10 from a switch element selected by a switching circuit 9 controlled by a microcomputer or the like respectively and the emphasized or attanuated output and the output of the BPF 8 are fed to an adder circuit 11. In applying respectively the weighting by K in the LPF 6 and the HPF 8, a resistor Rx is selected as a value attenuating the output of both the said filters by K.

89. 发明专利

JP2002261582A SURFACE ACOUSTIC WAVE DEVICE, ITS MANUFACTURING METHOD, AND CIRCUIT MODULE USING THE SAME 审中-公开
公开(公告)号：JP2002261582A
公开(公告)日：2002-09-13
申请号：JP2001307560
申请日：2001-10-03
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： ONISHI KEIJI , NANBA AKIHIKO , SATOU HIROTERU , MORITOKI KATSUNORI , BESSHO YOSHIHIRO , FUJII KUNIHIRO , MURAKAMI KOZO
IPC分类号： H03H9/25 , H03H3/08
摘要： PROBLEM TO BE SOLVED: To obtain an SAW device which can be made smaller than the conventional types, and to provide its manufacturing method. SOLUTION: A surface acoustic wave device is equipped with a piezoelectric board 11, a plurality of interdigital electrodes 12 arranged on the main surface 11a for exciting surface acoustic waves, a plurality of bumps 14 arranged on the main surface 11a, and an insulating sheet 15 arranged, so as to face the main surface 11a. The bumps 14 and the interdigital electrodes 12 are electrically connected together, and the bumps 15 are provided penetrating through the insulating sheet 15.

90. 发明专利

JP2001043729A CONDUCTIVE PARTICLE AND MANUFACTURE THEREOF, CONDUCTIVE ADHESIVE, MOUNTING BODY OF SEMICONDUCTOR DEVICE, MOUNTING BODY OF SEMICONDUCTOR PACKAGE AND MOUNTING BODY OF ELECTRONIC COMPONENT 失效
公开(公告)号：JP2001043729A
公开(公告)日：2001-02-16
申请号：JP21342599
申请日：1999-07-28
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： TOMURA YOSHIHIRO , ITAGAKI MINEHIRO , MITANI TSUTOMU , TAKEZAWA HIROTERU , BESSHO YOSHIHIRO
IPC分类号： H05K3/32 , C09J9/02 , C09J201/00 , H01B1/00 , H01B1/22 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide conductive particles satisfactory in corrosion resistance and oxidation resistance and superior in migration resistance, in addition to superior conductivity, and its manufacturing method, conductive adhesive made by using the conductive particles, a mounting body of a semiconductor device constituted by using the conductive adhesive, a mounting body of a semiconductor package and a mounting body of electronic components which are chip and capacitor. SOLUTION: In this conductive particle 1, a second conductive material 3 high in ionization tendency is partially disposed on a surface of a first conductive material 2 low in ionization tendency. In the conductive particle 1 at this time, a surface of the second conductive material 3 high in ionization tendency is completely coated with a coating layer made of the first conductive material 2 low in ionization tendency. In the coating layer, an opening part 4 for partially exposing the second conductive material 3 is formed.

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