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81. 发明专利

JPH11214334A BLADE SET-UP SYSTEM 失效
公开(公告)号：JPH11214334A
公开(公告)日：1999-08-06
申请号：JP1674298
申请日：1998-01-29
申请人： DISCO ABRASIVE SYSTEMS LTD
发明人： WAKITA NOBUHIKO
IPC分类号： B28D5/02 , H01L21/301
摘要： PROBLEM TO BE SOLVED: To avoid detection errors due to a reference position detection sensor for detecting the reference position of a blade based on a threshold in a blade set-up system for a precision cutting apparatus, in which the sensor is formed of a light-emitting element and a light-receiving element. SOLUTION: A blade set-up system 25 is for setting up a blade 3 of a precision cutting apparatus such as a dicing equipment. The system 25 is constituted of a light-emitting section and a light-receiving section. The light-emitting section emits a laser beam having a diameter of 0.01 mm or smaller. Thus, the system 25 allows the reference position of the blade 3 to be detected at the instance when the light is completely blucked. As a result, even if contaminants and water droplets are deposited on the blade, mis-detections such as detection of thresholds can be eliminated, and thus the reference position can be detected with high accuracy.

82. 发明专利

JPH11204461A DEVICE AND METHOD FOR FRAME POSITIONING 失效
公开(公告)号：JPH11204461A
公开(公告)日：1999-07-30
申请号：JP289198
申请日：1998-01-09
申请人： DISCO ABRASIVE SYSTEMS LTD
发明人： YOSHII MASAHIRO
IPC分类号： H01L21/301 , H01L21/78
摘要： PROBLEM TO BE SOLVED: To enable alignment of a frame before housing in an cassette even after dicing, by providing frame guide rails located between a holding state for holding the frame and a release state for releasing the frame in a temporary frame setting region. SOLUTION: When a frame F is set in a temporary frame setting region 12, frame guide rails 13a and 13b move in the directions toward each other and then contact linear portions to be held 16a and 16b formed at left and right ends of the frame F, thus generating a state where the frame F is held between the frame guide rails 16a and 16b. Next, while the holding state is maintained, a frame transport means 11 moves in the direction toward a cassette 22 by a predetermined distance and pushes an end portion of the frame F by an abutment portion 17, thereby slightly moving the frame F toward the side of the cassette 22. Thus, alignment of the frame F in the Y-axis direction in the temporary frame setting region 12 is carried out.

83. 发明专利

JPH11176772A PRECUT METHOD 失效
公开(公告)号：JPH11176772A
公开(公告)日：1999-07-02
申请号：JP33601197
申请日：1997-12-05
申请人： DISCO ABRASIVE SYSTEMS LTD
发明人： KAMIGAKI MASAYOSHI
IPC分类号： H01L21/301
摘要： PROBLEM TO BE SOLVED: To reduce a load applied on a rotary blade at a stage of starting cutting, by a method wherein a cut-in depth of the rotary blade is gradually increased and a precut substrate is cut and precutting is performed. SOLUTION: A rotary blade 1 is mounted on cubing means 2, and a precut substrate 7 chucked and held on a chuck table 6 is precut. In this method, a cut-in depth of the rotary blade is gradually increased, or a cut feeding speed is gradually accelerated. When the cut-in depth of the rotary blade 1 is gradually increased, when a cut-in depth of the rotary blade 1 at a time of actually cutting an object to be processed is D, a cut-in depth of the rotary blade 1 is gradually increased to D from shallower than D. At this time, a cut feeding speed of the rotary blade 1, namely a feeding speed of a turn table 6, is constant.

84. 发明专利

JPH11176771A DICING METHOD AND DICING DEVICE 失效
公开(公告)号：JPH11176771A
公开(公告)日：1999-07-02
申请号：JP33600697
申请日：1997-12-05
申请人： DISCO ABRASIVE SYSTEMS LTD
发明人： YOSHII MASAHIRO
IPC分类号： H01L21/301
摘要： PROBLEM TO BE SOLVED: To keep contamination unadhesive to a semiconductor wafer or a semiconductor chip and a blade, by a method wherein a coolant in which at least ultrasonic waves are applied is supplied to a cutting region, while dicing is performed. SOLUTION: A rotary blade 2 is mounted at a distal end of cutting means 1 of a dicing device, and also a blade cover 3 is fitted thereon so as to cover the blade 2. The blade cover 3 is arranged with a cutting water supply nozzle 4 substantially in parallel with a face of the blade 2 and on both sides interposing the blade 2, and further first, second and third coolant supply nozzles 5, 6, 7 are respectively attached to specified positions. An ultrasonic vibrator is arranged outside the blade cover 3, and a coolant in which ultrasonic waves are applied is supplied to both faces of a cutting part of the blade 2. Cutting water is supplied from the cutting water supply nozzle 4, while being cut by the blade 2 of the cutting means 1.

85. 发明专利

JPH11132232A INCLINATION ADJUSTING MECHANISM OF AIR SPINDLE 失效
公开(公告)号：JPH11132232A
公开(公告)日：1999-05-18
申请号：JP29816597
申请日：1997-10-30
申请人： DISCO ABRASIVE SYSTEMS LTD
发明人： WATANABE HIROYUKI
IPC分类号： B24B47/10 , F16C32/06
摘要： PROBLEM TO BE SOLVED: To easily adjust the inclination of a spindle by individually adjusting air supply pressure to air blowoff areas divided into at least three areas. SOLUTION: A large number of blowoff ports arranged in a circular arc shape in an upper thrust bearing 28 and a lower thrust bearing 29, are divided into four air blowoff areas 38, 39, 40 and 41 in the upper thrust bearing 28, and are divided into four air blowoff areas 42, 43, 44 and 45 in the lower thrust bearing 29. The same number of blowoff ports are arranged in air blowoff areas of the upper thrust bearing 28 and the lower thrust bearing 29, respectively, and the whole spindle main body 17 including a thrust plate 21 is supported by air blown off from the respective blowoff ports. Therefore, a fine adjustment of an inclination of the spindle main body 17 can be done by individually adjusting air blown off from the blowoff ports with every blowoff area.

86. 发明专利

JPH11102956A UV IRRADIATION APPARATUS AND DICING EQUIPMENT MOUNTED THEREWITH 失效
公开(公告)号：JPH11102956A
公开(公告)日：1999-04-13
申请号：JP26144897
申请日：1997-09-26
申请人： DISCO ABRASIVE SYSTEMS LTD
发明人： ISHIWATA SOICHI , INOUE TAKAAKI
IPC分类号： C08J7/00 , H01L21/301 , H01L21/68 , H01L21/683
摘要： PROBLEM TO BE SOLVED: To uniformly irradiate a semiconductor wafer with ultraviolet rays, by a method wherein a wafer holder which holds the semiconductor wafer making its UV tape side confront a UV irradiation means and swinging and/or rotating it relatively to the UV irradiation means is provided. SOLUTION: A holding means 8 is attached to a transfer means 12 such as a rail or the like mounted like an arch on a base 11 and set movable back and forth between a wafer mounting region A and a UV irradiation region B by the transfer means 12. Furthermore, the holding means 8 is possessed of a shaft 14 which is capable of reciprocating or contracting in a vertical direction and rotating in an optional direction. When a semiconductor wafer 1 is irradiated with UV, the wafer 1 is positioned just over an irradiation means 4, and the wafer 1 is irradiated with UV in this position rotating the shaft 14 in a prescribed direction. By this setup, a UV tape 2 is uniformly irradiated with UV. The holding means 8 is reciprocated by the transfer means 12 in a short stroke, so that the UV tape 2 is uniformly irradiated with ultraviolet rays by the swinging movement of the holding means 8.

87. 发明专利

JPH1177529A SPINDLE UNIT 失效
公开(公告)号：JPH1177529A
公开(公告)日：1999-03-23
申请号：JP24252397
申请日：1997-09-08
申请人： DISCO ABRASIVE SYSTEMS LTD
发明人： TAKAZAWA TORU
IPC分类号： B24B47/10
摘要： PROBLEM TO BE SOLVED: To prevent cutting water from ingressing into a bearing area, and eliminate non-conformity due to the generation of rust or the like in a spindle unit composed of a housing, and of a rotation axis mounted to the housing by way of bearings in such a way as to be freely rotated. SOLUTION: A spindle unit 1 is incorporated in a cutting device cutting and grooving a work piece while cutting water is being fed and the like, and has a blade mounted onto the tip end of it. The spindle unit 1 includes at least a housing 3, a rotation axis 2 to be mounted onto the housing 3 in such a way as to be freely rotated by way of bearings 4, an inner ring holding member 20 which is threadedly adhered to the rotation axis 2 to hold the inner ring 4a of the bearings 4, and an outer ring holding member 21 which is fixed to the housing 3 to hold the outer ring 4b of the bearings 4. And a water proof cover 22 is formed, which covers the outer ring holding member 21 in a non- contact manner to allow the water proof cover 22 to prevent cutting water from ingressing into a space between the outer ring holding member 21 and the inner ring holding member 20, that is, a bearing area, for eliminating the generation of rust.

88. 发明专利

JPH1177461A CUTTING DEVICE 失效
公开(公告)号：JPH1177461A
公开(公告)日：1999-03-23
申请号：JP24511297
申请日：1997-09-10
申请人： DISCO ABRASIVE SYSTEMS LTD
发明人： OSHIDA KUNIO
IPC分类号： B23Q1/00 , B23Q1/56 , B23Q1/70 , H01L21/301
摘要： PROBLEM TO BE SOLVED: To dispense with lengthening a spindle even if the bore of a semiconductor wafer becomes large by enabling a cutting means to move over a chuck table holding a workpiece such as a semiconductor wafer. SOLUTION: When a semiconductor wafer held with a chuck table 27 is cut in the X-axis direction, a blade 22 is positioned on a position in the Y-axis direction of a territory to be cut. At this time, a hanging part 18 is moved along a first guide rail 15 in the Y-axis direction. Accompanying this, the blade 22 constituting a cutting means 13 hung from the hanging part 18 is also moved in the Y-axis direction. At this time, the position of the blade 22 in the Y-axis direction is measured by a linear scale 14, and it is positioned on the position to be cut. A second pulse motor 19 is driven to bring down the cutting means 13, in addition the chuck table 27 is moved along a second guide rail 25 in the X-axis direction, and hence the semiconductor wafer is cut in the X-axis direction.

89. 发明专利

JPH1133907A FLANGE MECHANISM 失效
公开(公告)号：JPH1133907A
公开(公告)日：1999-02-09
申请号：JP19561997
申请日：1997-07-22
申请人： DISCO ABRASIVE SYSTEMS LTD
发明人： KADOSAWA EIJI
IPC分类号： B23Q3/12 , B24B45/00 , H01L21/301
摘要： PROBLEM TO BE SOLVED: To prevent the movement of a mount flange in the depth direction of a spindle at the time of high speed rotation of the spindle by providing a cap nut, which envelopes a fixed nut for fixing a mount flange to a spindle and which threads the fixed nut with a screw part formed in a mount flange. SOLUTION: A washer blade 24 is installed in a mount flange 23, and fixed by a hub 25 and a blade support nut 28. Movement of the mount flange 23 in the tip direction (direction A) of the spindle 21 is restricted by a fixed nut 30, which is threaded with a fixed nut threading part provided in a tip of the spindle 21. A cap nut 31 is threaded with a screw part 27 so as to envelope the fixed nut 30. With this structure, movement of the mount flange 23 in the depth direction (direction B) of the spindle 21 is restricted. Even in the case where the inner diameter of the mount flange 23 is increased, movement of the mount flange 23 in the depth direction of the spindle 21 is prevented.

90. 发明专利

JPH10286750A WAFER GRINDING METHOD 失效
公开(公告)号：JPH10286750A
公开(公告)日：1998-10-27
申请号：JP9577597
申请日：1997-04-14
申请人： DISCO ABRASIVE SYSTEMS LTD
发明人： KOMA YUTAKA , ARAI KAZUNAO , NANJO MASATOSHI
IPC分类号： B24B7/22 , B24B1/00
摘要： PROBLEM TO BE SOLVED: To grind a surface flat by absorbing the waviness of a wafer by a waviness absorber which is installed between a chuck table and the wafer. SOLUTION: A surface 10b is grinded by lowering a grinding means while rotating an abrasive grinder 29. On this occasion, a face at a side to be absorbed to a chuck table 30, of a waviness absorber 11, is flat, and is not deformed by the suction force from the chuck table 30. On the other hand, a face on which a wafer immediately after the slicing, is affixed, is kept in a condition that it absorbs the waviness of the wafer immediately after the slicing as it is. Accordingly by grinding the surface 10b of the wafer 10 immediately after the slicing by the abrasive grinder 29 under this condition, the surface 10b side can be flattened.

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