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81. 发明专利

JP2003008215A Method of manufacturing ceramic multilayer board 审中-公开
标题翻译：制造陶瓷多层板的方法
公开(公告)号：JP2003008215A
公开(公告)日：2003-01-10
申请号：JP2001183142
申请日：2001-06-18
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： MIZUNO YOSHIO
IPC分类号： B28B11/00 , H01L23/12 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a ceramic multilayer board which is kept uniform in thickness after baking, by eliminating irregularities on the end of a laminate to improve the ceramic multilayer board in external appearance and by preventing cracks from occurring. SOLUTION: Ceramic green sheets 11a to 11e are stacked, heated and pressed into a laminated 16. The laminate 16 is baked into a ceramic multilayer board in a ceramic multilayer board manufacturing method. At least, one side end 17a of the laminate 16 is cut off.
摘要翻译：要解决的问题：提供一种制造陶瓷多层板的方法，其通过消除层压体的端部上的不规则性而在外观上保持均匀的厚度，从而改善外观上的陶瓷多层板并防止产生裂纹。解决方案：将陶瓷生片11a至11e堆叠，加热并压制成层压体16.在陶瓷多层板制造方法中将层压体16烘烤成陶瓷多层板。至少，层压体16的一个侧端部17a被切断。

82. 发明专利

JP2002368423A Ceramic board 有权
标题翻译：陶瓷板
公开(公告)号：JP2002368423A
公开(公告)日：2002-12-20
申请号：JP2001169951
申请日：2001-06-05
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： SHIBATA KOJI , NAKAI TOSHIHIRO
IPC分类号： H05K1/09 , H01L23/13 , H05K1/11 , H05K3/24 , H05K3/34 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To allow an invasion of a plating solution into an interior of a via conductor to be prevented even when a dense cover conductor is not printed on a surface of the via conductor of a front layer of the ceramic board. SOLUTION: A surface of the via conductor 13a of the front layer of a low- temperature baked ceramic board is densified by mechanical working such as blasting or the like to form a dense layer 16. Thus, a hermetical sealability of the surface of the conductor 13a is assured. A surface of the layer 16 of the conductor 13a is Ni/Au plated 19 to form a pad 18. At least one of the conductors 13a of the front layer of the board is linearly connected to the via conductor of its lower layer. In this case, even when the conductor 13a of the front layer of the board and the via conductor of its lower layer are not deviated and disposed in a lateral direction like a prior art, since the sealability of the conductor 13a of the front layer of the board can be assured, the invasion of a moisture from the conductor 13a of the front layer into the board can be prevented.
摘要翻译：要解决的问题：即使在陶瓷板的前层的通孔导体的表面上未印刷致密的覆盖导体的情况下，也能够防止电镀液侵入通孔导体的内部。解决方案：低温烘烤陶瓷板的前层通孔导体13a的表面通过诸如喷砂等的机械加工致密化，以形成致密层16.因此，导体表面的密封性 13a保证。导体13a的层16的表面被镀覆/镀覆19以形成焊盘18.板的前层的至少一个导体13a与其下层的通路导体线性连接。在这种情况下，即使当板的前层的导体13a和其下层的通孔导体不像现有技术那样沿横向方向偏离并设置时，由于前层的导体13a的密封性可以确保板可以防止从前层的导体13a侵入板中的水分。

83. 发明专利

JP5075493B2 Package light emitting element housing and a manufacturing method thereof and a light emitting device using the same 有权
公开(公告)号：JP5075493B2
公开(公告)日：2012-11-21
申请号：JP2007156174
申请日：2007-06-13
申请人：株式会社住友金属エレクトロデバイス , スタンレー電気株式会社
发明人：芳和三原 , 和香子新野
IPC分类号： H01L33/56 , H01L33/60 , H01L33/58 , H01L33/62

84. 发明专利

JP2012184491A Device for mounting ceramic substrate to inner set rack 审中-公开
标题翻译：将陶瓷衬底安装到内置机架上的装置
公开(公告)号：JP2012184491A
公开(公告)日：2012-09-27
申请号：JP2011050034
申请日：2011-03-08
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： YAMADA HIROSHI
IPC分类号： C25D17/08
摘要： PROBLEM TO BE SOLVED: To provide a device for mounting a ceramic substrate to an inner set rack, capable of accurately attaching a pair of pins in which the bend of pins is corrected while preventing the destruction of the ceramic substrate.SOLUTION: The device 10 for mounting the ceramic substrate to the inner set rack includes: a support 11 for mounting the inner set rack 20 in a horizontal state; a table 12 for mounting the ceramic substrate 30; a projection part 13 for clamping a vertical member 21 in it; a pressurizing body 14 for opening the pin 23; a guide groove 15 for correcting the bend of the pin 23; a means for mounting the inner set rack 20 to the support 11, then clamping the vertical member 21 by the projection part 13 and fixing it; a means for opening the pin 23 while correcting the bend; and a means for mounting the ceramic substrate 30, clamping a notched part 35 of the ceramic substrate 30 by a pawl part 24 by releasing pressurization of the pressurizing body 14, and then releasing pressurization by the projection part 13.
摘要翻译：要解决的问题：为了提供一种用于将陶瓷基板安装到内部固定架上的装置，能够精确地安装一对销，其中销的弯曲被校正，同时防止陶瓷基板的破坏。＆lt; P＆gt;解决方案：用于将陶瓷基板安装到内置架上的装置10包括：用于将内置架20安装在水平状态的支撑件11; 用于安装陶瓷基板30的工作台12; 用于将垂直构件21夹紧在其中的突出部13; 用于打开销23的加压体14; 用于校正销23的弯曲的引导槽15; 用于将内部固定架20安装到支撑件11上的装置，然后通过突出部分13夹紧垂直构件21并将其固定; 用于在校正弯头的同时打开销23的装置; 以及用于安装陶瓷基板30的装置，通过释放加压体14的加压，通过棘爪部分24夹持陶瓷基板30的切口部分35，然后通过突出部分13释放加压。 C）2012，JPO＆INPIT

85. 发明专利

JP2012138437A Electronic component housing package 审中-公开
标题翻译：电子元件封装
公开(公告)号：JP2012138437A
公开(公告)日：2012-07-19
申请号：JP2010289079
申请日：2010-12-27
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： YAMAMOTO TOMOYASU
IPC分类号： H01L23/14 , H01L23/34 , H01L23/373 , H01S5/022
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an inexpensive electronic component housing package capable of efficiently radiating heat from electronic components.SOLUTION: In an electronic component housing package 10 including a rectangular plate-shaped substrate 11 for mounting electronic components for optical communication on the upper surface and a frame body 13 which is vertically erected against the upper surface to produce a cavity part 12 for housing the electronic components, the substrate 11 is made of clad material about which a first Cu plate 15 on one main surface on the side where the frame body 13 of a Fe-Ni-Co-based alloy metal plate is arranged is bonded with a second Cu plate 15a thinner than the first Cu plate 15 on the other main surface; and the frame body 13 consists of a joint body of a rectangular cylindrical metallic sidewall body 16 made of Fe-Ni-Co-based alloy or Fe-Ni-based alloy, and ceramic sidewall body 18 made of a ceramic feedthrough substrate provided in a notch 17 made by removing a part of the upper part of the sidewall body 16.
摘要翻译：要解决的问题：提供能够有效地散发来自电子部件的热量的便宜的电子部件壳体封装。解决方案：在包括用于安装在上表面上用于光通信的电子部件的矩形板状基板11和在上表面垂直竖立以制造空腔部分12的框体13的电子部件收纳包装10中为了容纳电子部件，基板11由包覆材料制成，在该包覆材料上，配置有Fe-Ni-Co系合金金属板的框体13的一侧的一个主面上的第一Cu板15与比另一个主表面上的第一Cu板15薄的第二Cu板15a; 框架体13由以Fe-Ni-Co系合金或Fe-Ni系合金构成的矩形圆筒状的金属侧壁体16的接合体，陶瓷侧壁体18，陶瓷侧壁体18 通过去除侧壁体16的上部的一部分制成的凹口17.版权所有（C）2012，JPO＆INPIT

86. 发明专利

JP2012052827A Warpage inspection apparatus for ceramic substrate 审中-公开
标题翻译：陶瓷基板的检验检验装置
公开(公告)号：JP2012052827A
公开(公告)日：2012-03-15
申请号：JP2010193383
申请日：2010-08-31
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： FUJITA SUMIO , YAMADA TOMOAKI
IPC分类号： G01B11/24
摘要： PROBLEM TO BE SOLVED: To provide a warpage inspection apparatus for ceramic substrates capable of accurately and efficiently measuring the amount of warpage in a mid-course of conveying and preventing an occurrence of defect.SOLUTION: This warpage inspection apparatus includes: conveying means for conveying ceramic substrates to prescribed positions; detecting means for inspecting a ceramic substrate 11 in being conveyed by a two-dimensional laser displacement meter 12 while letting it pass therethrough with the full width of the ceramic substrate 11 defined as a measuring object; and calculating means for calculating the amount of warpage acquired by processing the inspection value through a filter. The conveying means includes: a rotary actuator 13 adsorbing the ceramic substrates 11 with adsorption heads 17 and consecutively mounting them on the upper faces of a plurality of measuring tables 18 respectively; index tables 14, while horizontally and intermittently indexing and rotating the measuring tables 18, allowing the detecting means and the calculating means to measure the amount of warpage of the ceramic substrates 11 mounted on the measuring tables; and scraping bodies 15 located near the measuring tables 18 and discharging the ceramic substrates 11 after measuring the amount of warpage according to ranks of the amount of warpage from the measuring tables 18.
摘要翻译：要解决的问题：提供一种用于陶瓷基板的翘曲检查装置，其能够准确有效地测量输送中期的翘曲量并防止缺陷的发生。该翘曲检查装置包括：输送装置，用于将陶瓷基板输送到规定位置; 检测装置，用于检查由二维激光位移计12输送的陶瓷基板11，同时使其被定义为测量对象的陶瓷基板11的整个宽度通过; 以及计算装置，用于计算通过过滤器处理检查值所获得的翘曲量。传送装置包括：旋转致动器13，其吸附陶瓷基板11与吸附头17分别连续地安装在多个测量台18的上表面上; 索引表14，同时水平和间歇地分度和旋转测量台18，允许检测装置和计算装置测量安装在测量台上的陶瓷基板11的翘曲量; 以及位于测量台18附近的刮削体15，并根据测量台18的翘曲量的度量测量翘曲量后排出陶瓷基板11.（C）2012年，JPO＆INPIT

87. 发明专利

JP4880524B2 Multi-piece wiring substrate and the electrolytic treatment method 有权
公开(公告)号：JP4880524B2
公开(公告)日：2012-02-22
申请号：JP2007156900
申请日：2007-06-13
申请人：株式会社住友金属エレクトロデバイス
发明人：芳和三原
IPC分类号： H05K3/00 , H05K3/22

89. 发明专利

JP2011228319A Package for housing electronic component element 有权
标题翻译：外壳电子元件元件包装
公开(公告)号：JP2011228319A
公开(公告)日：2011-11-10
申请号：JP2010093636
申请日：2010-04-15
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： NISHIKAWA KATSUHIRO , KIMURA YUKIO , KUMURA NORIFUMI , KAWAGUCHI HIDEYO
IPC分类号： H01L23/04 , H01L23/02 , H01L23/12
摘要： PROBLEM TO BE SOLVED: To provide a package for housing an electronic component element which can improve packing density of an electronic component, has high reliability of air tightness and is inexpensive.SOLUTION: A package for housing an electronic component element 10 comprises: an assembly formed by laminating a ceramic substrate 11 having a shape of a rectangular plate with a first metalized film 14 on a lower surface and a second metalized film 16 on an upper surface and, on an upper periphery of the ceramic substrate 11, a ceramic frame body 12 having a shape of a rectangular frame with a third metalized film 18 on an upper surface; cutout portions 19 at the corners of the assembly; forth metalized films 21 and 21a formed on wall surfaces of the cutout portions 19 to electrically connect the first metalized film 14 and the second metalized film 16 or the first metalized film 14 and the third metalized film 18; and a ceramic insulation film 22 formed on the superior surfaces of the forth metalized films 21 and 21a with cladding extended upward from a connection portion with the first metalized film 14 to cross the forth metalized films 21 and 21a.
摘要翻译：要解决的问题：提供一种用于容纳能够提高电子部件的包装密度的电子元件的包装，具有高可靠性的气密性并且便宜。解决方案：用于容纳电子元件10的包装件包括：通过将具有矩形板形状的陶瓷基板11与下表面上的第一金属化膜14层叠在第一金属化膜16上而形成的组件在陶瓷基板11的上表面上形成具有矩形框架形状的陶瓷框体12，上表面具有第三金属化膜18; 在组件的角部处的切口部分19; 形成在切口部分19的壁表面上的第一金属化膜21和21a，以将第一金属化膜14和第二金属化膜16或第一金属化膜14和第三金属化膜18电连接; 以及形成在第四金属化膜21和21a的上表面上的陶瓷绝缘膜22，其中包层从与第一金属化膜14的连接部分向上延伸以与第四金属化膜21和21a交叉。版权所有（C）2012，JPO＆INPIT

90. 发明专利

JP2011077063A Ceramic package for housing semiconductor element 审中-公开
标题翻译：用于住宅半导体元件的陶瓷包装
公开(公告)号：JP2011077063A
公开(公告)日：2011-04-14
申请号：JP2009223596
申请日：2009-09-29
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： NAKASU KOICHI
IPC分类号： H01L23/04 , H01L23/12
摘要： PROBLEM TO BE SOLVED: To provide a ceramic package for housing a semiconductor element that can prevent the occurrence of the sulfidization discoloration of Ag on a cut surface of a lead terminal where a tie bar is cut away.
SOLUTION: In the ceramic package 10 for semiconductor element storage having a lead terminal 12 whose one end is brazed to a metallized film 14 formed on a surface of a ceramic base 11 through a brazing material 13, and the other end protrudes from the ceramic base 11, the ceramic package has notches 17 on both side faces of a part which protrudes from the ceramic base 11 at the lead terminal 12, and a wax pool 18 which has a wax passage of a brazing material 13 spread to the other end side at the lead terminal 12, and in which the thickness of wax generated by the flow of the wax to the notches 17 is thicker than that of the surface of the lead terminal 12, and also thicker than those of both side faces of the lead terminal 12 other than the notches 17.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决的问题：提供一种用于容纳半导体元件的陶瓷封装，其能够防止在切断连接条的引线端子的切割表面上发生Ag的硫化变色。解决方案：在用于半导体元件存储的陶瓷封装10中，具有引线端子12，引线端子12的一端钎焊到通过钎焊材料13形成在陶瓷基体11的表面上的金属化膜14，另一端从陶瓷基体11，在引线端子12处从陶瓷基体11突出的部分的两个侧面上的陶瓷封装体具有切口17，并且具有扩散到另一个的钎焊材料13的蜡通道的蜡池18 末端侧在引线端子12处，并且其中由蜡流到凹口17产生的蜡的厚度比引线端子12的表面的厚度厚，并且还比第二端面的两个侧面的厚度厚导线端子12除了凹口17.版权所有（C）2011，JPO＆INPIT

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