专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

71. 发明专利

JP4969717B2 Method of manufacturing composite parts to receive a strong stress 有权
公开(公告)号：JP4969717B2
公开(公告)日：2012-07-04
申请号：JP2000231044
申请日：2000-07-31
申请人：ミシュランルシェルシュエテクニークソシエテアノニム
发明人：アンクアンリ , ムスティエルヴェ , トルナルマルセル , ミュリロジェ
IPC分类号： B29B11/16 , B29C70/06 , B29B11/02 , B29C35/08 , B29C35/10 , B29C43/02 , B29C70/20 , B29K31/00 , B29K63/00 , B29K67/00 , B29K105/08 , B29L9/00 , B32B5/00 , B32B5/28 , B32B25/10 , B32B37/10 , B32B37/16 , C08F2/44 , C08F2/50 , C08F283/10 , C08F290/06 , H05K1/03 , H05K3/00
CPC分类号： B29C70/20 , B29C35/08 , B29C35/10 , H05K1/0366 , H05K3/0014 , Y10T156/1043
摘要： Composite articles are produced by impregnating a parallel array of reinforcing fibers with a resin, partially polymerizing the resin with ionizing radiation, cutting the resulting precomposite into lengths, stacking the lengths on a nonplanar support so that they conform to the shape of the support, and molding the stack under pressure to complete the polymerization of the resin. Independent claims are also included for the following: (1) a nonplanar multilayer composite material comprising parallel reinforcing fibers in a matrix of radiation-curable resin, where: each fiber is contained within a single layer; each layer is less than 0.3 mm thick; the matrix has a glass transition temperature (Tg) above 150 degrees C; and the material has a Shore D hardness of more than 80; (2) a precomposite of great length with a thickness of less than 0.3 mm comprising parallel reinforcing fibers in a matrix of radiation-curable resin and coated with a protective film that is opaque to ultraviolet-visible radiation, where the matrix has a Tg of 40-130 degrees C and the precomposite has a Shore D hardness of 50-65.

72. 发明专利

JP2012124460A Insulating substrate, metal-clad laminate, printed wiring board, and semiconductor device 有权
标题翻译：绝缘基板，金属层压板，印刷电路板和半导体器件
公开(公告)号：JP2012124460A
公开(公告)日：2012-06-28
申请号：JP2011209540
申请日：2011-09-26
申请人： Sumitomo Bakelite Co Ltd , 住友ベークライト株式会社
发明人： ONOZUKA TAKESHI
IPC分类号： H01L23/12 , H05K1/03
CPC分类号： H05K1/038 , B32B5/02 , B32B2307/734 , B32B2457/08 , H01L23/49822 , H01L23/49827 , H01L2224/16225 , H01L2224/16227 , H01L2224/73204 , H01L2924/00014 , H01L2924/01322 , H01L2924/15311 , H05K1/036 , H05K1/0366 , H05K3/4602 , H05K2201/029 , Y10T428/2495 , Y10T428/24967 , H01L2924/00 , H01L2224/0401
摘要： PROBLEM TO BE SOLVED: To provide an insulating substrate or a metal-clad laminate capable of sufficiently reducing or preventing minus deflection of a semiconductor device, and to provide a printed wiring board and a semiconductor device using the insulating substrate or metal-clad laminate.SOLUTION: A printed wiring board is manufactured by using an insulating substrate, or a metal-clad laminate containing the insulating substrate as a core substrate. The insulating substrate contains at least one fabric base material layer C1 or two or more resin layers r1 and r2, and is made from a cured substance of the laminate whose outermost layers on both surfaces are resin layers, with at least one fabric base material layer being deviated to one surface side or the other surface side than a reference position, in other word, the position obtained by equally dividing the total thickness of the insulating substrate with the number of fabric base material layers, and then bisecting the resulting thickness of each region, with no deviation in different direction. A semiconductor element is mounted on the printed wiring board to manufacture a semiconductor device.
摘要翻译：要解决的问题：提供能够充分降低或防止半导体器件的负偏转的绝缘衬底或覆金属层压板，并且提供使用绝缘衬底或金属箔的印刷线路板和半导体器件，覆盖层压板。解决方案：通过使用绝缘基板或包含绝缘基板作为芯基板的覆金属层压板制造印刷线路板。绝缘基板包含至少一个织物基材层C1或两个或更多个树脂层r1和r2，并且由两个表面的最外层是树脂层的层压体的固化物制成，至少一个织物基材层偏离参考位置的一个表面侧或另一个表面侧，换句话说，通过将绝缘基板的总厚度等分成具有织物基材层的数量而获得的位置，然后将每个区域，不同方向没有偏差。半导体元件安装在印刷电路板上以制造半导体器件。版权所有（C）2012，JPO＆INPIT

73. 发明专利

JP2012094563A Print circuit board, manufacturing method of print circuit board, and electronic device 有权
标题翻译：打印电路板，印刷电路板的制造方法和电子设备
公开(公告)号：JP2012094563A
公开(公告)日：2012-05-17
申请号：JP2010237990
申请日：2010-10-22
申请人： Fujitsu Ltd , 富士通株式会社
发明人： YOSHIMURA HIDEAKI , IIDA KENJI , MAEHARA YASUTOMO
IPC分类号： H05K1/02 , H05K1/03 , H05K3/00 , H05K3/28
CPC分类号： H05K1/0366 , B29C70/46 , B29C70/545 , B29L2031/3425 , H01L23/145 , H01L23/49827 , H01L2924/0002 , H05K1/115 , H05K3/0097 , H05K2201/029 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a print circuit board in which anisotropy is minimized, a manufacturing method of the print circuit board, and an electronic device.SOLUTION: The print circuit board includes: a base material 2 that is formed by a fiber material oriented in a fiber direction D1; a cell 3 that corresponds to the outer shape of a circuit chip mounted on the surface of the base material 2 and is periodically sectioned into a plurality of cells on the surface of the base material 2; a plurality of through holes 4 that correspond to each connection terminal of the circuit chip and are formed in the cell 3. The imposition of the cell 3 is performed on base material 2 in an oblique direction that has a substantially 45 degrees with respect to the fiber direction D1.
摘要翻译：要解决的问题：提供各向异性最小化的印刷电路板，印刷电路板的制造方法和电子设备。解决方案：印刷电路板包括：基材2，其由沿纤维方向D1取向的纤维材料形成; 对应于安装在基材2的表面上的电路芯片的外形的电池3，并且在基材2的表面上周期性地分割成多个电池; 多个通孔4，其对应于电路芯片的每个连接端子并且形成在电池单元3中。电池3的施加对基材2施加在相对于该电池芯片的大致45度的倾斜方向上纤维方向D1。版权所有（C）2012，JPO＆INPIT

74. 发明专利

JP2012052110A Thermosetting resin composition, and prepreg using the same, laminate 有权
标题翻译：热固性树脂组合物，以及使用它们的复合层压板
公开(公告)号：JP2012052110A
公开(公告)日：2012-03-15
申请号：JP2011172362
申请日：2011-08-05
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TSUCHIKAWA SHINJI , IZUMI HIROYUKI , ISHIKURA KUMIKO , MURAI AKIRA
IPC分类号： C08G73/06 , C08J5/24 , C08K9/06 , C08L79/04 , H05K1/03
CPC分类号： C08L83/06 , B32B5/022 , B32B5/024 , B32B5/08 , B32B7/06 , B32B15/14 , B32B15/20 , B32B2260/023 , B32B2260/046 , B32B2262/0276 , B32B2262/101 , B32B2307/306 , B32B2307/3065 , B32B2307/51 , B32B2307/714 , B32B2307/734 , B32B2307/748 , B32B2457/00 , C08G73/0644 , C08G73/0655 , C08G77/16 , C08G77/452 , C08J5/24 , C08J2383/10 , C08K9/06 , H05K1/0326 , H05K1/0366 , H05K1/0373 , H05K2201/0209 , H05K2201/029 , C08L83/10
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting resin composition whose adhesiveness with a conductor layer, heat resistance, flame retardancy, low thermal expansibility, low dielectric properties, low dielectric dissipation factor, drillability or the like each satisfies both standards corresponding to a product and an environment using the composition.SOLUTION: The thermosetting resin composition comprises: a thermosetting resin (A); and fused silica (B). The thermosetting resin (A) is obtained by reacting a siloxane resin (a) having a hydroxy group at its terminal and a compound (b) having at least two cyanate groups in one molecule. The siloxane resin (a) and the compound (b) are contained in amounts of 10-70 pts.mass and 30-90 pts.mass, respectively, to 100 pts.mass of the total of the siloxane resin (a) and the compound (b). The reaction rate of the compound (b) is 40-70 mol%. The surface of the fused silica is treated with a trimethoxysilane compound.
摘要翻译：要解决的问题：提供一种与导体层的粘合性，耐热性，阻燃性，低热膨胀性，低介电性，低介电损耗因数，可钻性等的热固性树脂组合物都满足对应于使用该组合物的产品和环境。热固性树脂组合物包含：热固性树脂（A）; 和二氧化硅（B）。热固性树脂（A）通过在其末端具有羟基的硅氧烷树脂（a）和在一个分子中具有至少两个氰酸酯基的化合物（b）反应而获得。硅氧烷树脂（a）和化合物（b）的含量分别为10-70质量份和30-90质量分数，相对于硅氧烷树脂（a）和化合物（b）。化合物（b）的反应速度为40〜70摩尔％。熔融二氧化硅的表面用三甲氧基硅烷化合物处理。版权所有（C）2012，JPO＆INPIT

75. 发明专利

JP4816459B2 Flexible laminate for a printed wiring board 有权
公开(公告)号：JP4816459B2
公开(公告)日：2011-11-16
申请号：JP2006548791
申请日：2005-12-07
申请人：旭硝子株式会社
发明人：毅岩佐 , 義明樋口 , 篤船木
IPC分类号： B32B15/082 , B32B15/08 , B32B15/088 , H05K1/03
CPC分类号： H05K1/036 , B32B15/08 , B32B27/06 , C08F214/18 , C08F214/245 , C08F214/265 , H05K1/034 , H05K1/0366 , H05K1/0393 , H05K2201/0141 , H05K2201/015 , H05K2201/0154 , H05K2201/0278 , Y10T428/24355 , Y10T428/264 , Y10T428/265 , Y10T428/3154 , Y10T428/31544 , Y10T428/31721

76. 发明专利

JP2011518429A Manufacturing method of a multilayer circuit board 有权
公开(公告)号：JP2011518429A
公开(公告)日：2011-06-23
申请号：JP2011501257
申请日：2009-03-25
申请人：テクノマル・オサケユキテュアTecnomar Oy
发明人：トム・マルッティラ
IPC分类号： H05K3/06 , G06K19/07 , G06K19/077
CPC分类号： H05K1/115 , B32B37/1292 , B32B38/10 , B32B2310/0843 , B32B2457/08 , G08B13/244 , H05K1/0366 , H05K1/0386 , H05K3/027 , H05K3/046 , H05K3/386 , H05K3/4046 , H05K3/4084 , H05K2201/0284 , H05K2201/0355 , H05K2201/0382 , H05K2201/0394 , H05K2201/09563 , H05K2203/0522 , H05K2203/1388 , H05K2203/1394 , H05K2203/1545 , Y10T29/49156
摘要：導電パターンを特徴とする回路基板の製造方法であって、i）最終生産物のための所望領域（３ａ）と最終生産物における導電性領域間の狭小領域（３ｃ）とを備える金属箔（３）などの導電層の一部は、ボンド（２）によって基板物質（１）に接着され、
例えば金属箔（３）などの導電層において後に除去されるさらに広範囲の領域（３ｂ）は、基板物質と実質的に非接着状態で残っており、除去領域（３ｂ）は、続く工程ii）でパターン化される予定の縁部分よりも小さい部分、可能であれば、続く工程iii）の前に除去領域が解放されるのを防ぐ領域にて、基板物質と接着するように、金属箔（３）などの導電層を基板物質（１）へ選択的に接着する工程と、ii）導電パターンを確立するために、所望の導電性領域（３ａ）間の微小ギャップと、固体状態で除去可能な領域（３ｂ）の外側周囲から、材料を除去することにより、金属箔（３）などの導電層をパターン化する工程と、iii）工程ii）において除去領域の外側周囲から除去された導電層の縁領域が、基板物質と縁が接着している除去領域（３ｂ）をもはや保持しなくなった後に、基板物質（１）に付加されていない除去領域（３ｂ）を金属箔（３）などの導電層から除去する工程、とを備える回路基板の製造方法。

77. 发明专利

JP2011091351A Trench substrate, and method of manufacturing the same 有权
标题翻译： TRENCH基板及其制造方法
公开(公告)号：JP2011091351A
公开(公告)日：2011-05-06
申请号：JP2009267354
申请日：2009-11-25
申请人： Samsung Electro-Mechanics Co Ltd , サムソンエレクトロ−メカニックスカンパニーリミテッド.
发明人： HONG JONG KUK , CHO SOON JIN , HWANG SUN UK
IPC分类号： H05K3/10 , H05K3/00
CPC分类号： H05K3/0032 , H05K1/036 , H05K1/0366 , H05K3/045 , H05K3/107 , H05K2201/0209 , H05K2201/029 , Y10T428/2462
摘要： PROBLEM TO BE SOLVED: To provide a trench substrate capable of achieving a fine and uniform circuit pattern by performing the processing so that the trenches have the same shape, and a method of manufacturing the same. SOLUTION: This trench substrate 100a includes: a first insulation layer 120a formed with trenches 140; a second insulation layer 120b arranged under the first insulation layer 120a and low in laser processibility relative to that of the first insulation layer 120a; and a negative pattern 300 formed in the trenches 140. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供能够通过进行处理以使得沟槽具有相同形状而实现精细且均匀的电路图案的沟槽衬底及其制造方法。解决方案：该沟槽衬底100a包括：形成有沟槽140的第一绝缘层120a; 布置在第一绝缘层120a下方的第二绝缘层120b，相对于第一绝缘层120a的激光加工性低; 以及形成在沟槽140中的负图案300.版权所有（C）2011，JPO＆INPIT

78. 发明专利

JP2011513965A Printed circuit board and a method of manufacturing the same 有权
公开(公告)号：JP2011513965A
公开(公告)日：2011-04-28
申请号：JP2010548626
申请日：2009-03-02
申请人：エルジーイノテックカンパニー,リミティド
发明人：ボンチョイ，ジェ , ウクハン，ジュン , ホファン，ジュン , スンユン，ヒェ , ジュンリ，ウン
IPC分类号： H05K3/00
CPC分类号： H05K3/0097 , H05K1/036 , H05K1/0366 , H05K3/0052 , H05K3/06 , H05K3/107 , H05K3/244 , H05K3/3452 , H05K2201/0209 , H05K2201/0355 , H05K2201/068 , H05K2203/0278 , H05K2203/0315 , H05K2203/1536
摘要：本発明によるプリント回路基板の製造方法は分離部材の両側に第１，２絶縁部材と第１，２導電フィルムを配置し熱圧着して、前記分離部材を挟んで前記第１絶縁部材と第２絶縁部材を付着させ、前記第１絶縁部材と第１導電フィルム、及び前記第２絶縁部材と第２導電フィルムをそれぞれ付着させる段階と、前記第１，２導電フィルムを選択的に除去して第１，２回路パターンを形成する段階と、前記分離部材及び前記第１，２絶縁部材を切断して前記分離部材から前記第１，２回路パターンが形成された第１，２絶縁部材を分離する段階と、を含む。
【選択図】図４

79. 发明专利

JP2011082271A Manufacturing method and design method for wiring board 有权
标题翻译：接线板的制造方法和设计方法
公开(公告)号：JP2011082271A
公开(公告)日：2011-04-21
申请号：JP2009231856
申请日：2009-10-05
申请人： Fujitsu Ltd , 富士通株式会社
发明人： SUWADA MAKOTO
IPC分类号： H05K1/02 , H05K3/46
CPC分类号： H05K3/0008 , H05K1/0245 , H05K1/0248 , H05K1/0269 , H05K1/0298 , H05K1/0366 , H05K3/0005 , H05K3/0082 , H05K3/064 , H05K2201/029 , H05K2201/09236 , H05K2201/09272 , Y10T29/49004 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155
摘要： PROBLEM TO BE SOLVED: To sufficiently reduce impedance fluctuation, propagation delay time fluctuation, and insertion losses that arise when a current flows through a wiring pattern. SOLUTION: A method for manufacturing a wiring board includes a first step of forming a conductive layer on an insulating layer having a glass cloth, a second step of forming a photosensitive resist layer on the conductive layer, a third step of recognizing an origin position of the insulating layer, a fourth step of positioning a mask relative to the origin position, which id so formed as to arrange a wiring pattern only at a position at which the wiring pattern overlaps the glass cloth in a plan view, and disposing the mask on the resist layer, and a fifth step of exposing the resist layer to light via the mask to form the wiring pattern only at the position at which the wiring pattern overlaps the glass cloth in a plan view. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：充分减少电流流过布线图形时产生的阻抗波动，传播延迟时间波动和插入损耗。解决方案：一种用于制造布线板的方法包括在具有玻璃布的绝缘层上形成导电层的第一步骤，在导电层上形成光敏抗蚀剂层的第二步骤，第三步骤，绝缘层的起始位置，第四步骤，将掩模相对于原点位置定位，该第一步形成为仅在布置图案与玻璃布重叠的位置在平面图中布置布线图案，并且布置抗蚀剂层上的掩模，以及通过掩模将抗蚀剂层曝光以形成布线图案的第五步骤，仅在布置图案在平面图中与玻璃布重叠的位置处形成。版权所有（C）2011，JPO＆INPIT

80. 发明专利

JP2011029452A Coupon board, and method of manufacturing printed circuit board 有权
标题翻译： COUPON板和制造印刷电路板的方法
公开(公告)号：JP2011029452A
公开(公告)日：2011-02-10
申请号：JP2009174570
申请日：2009-07-27
申请人： Fujitsu Ltd , 富士通株式会社
发明人： SUGIMOTO KAORU , KOBAYASHI KATSUHIKO
IPC分类号： H05K1/02 , H05K3/00
CPC分类号： H05K1/0269 , H05K1/024 , H05K1/0366 , H05K3/0052 , H05K3/28 , H05K2201/029 , H05K2201/0989 , Y10T29/4922 , Y10T428/24124 , Y10T428/24273
摘要： PROBLEM TO BE SOLVED: To provide a coupon board for evaluating characteristics of a printed circuit board, which facilitates inspecting the direction of fibers buried in the printed circuit board. SOLUTION: The coupon board for evaluating characteristics of the printed circuit board which is used as a base for cutting the printed circuit board is cut out together with the printed circuit board from a plate material containing a plurality of fibers extending in a predetermined direction. The coupon board has a region on which the solder resist film is not formed, and which extends parallel with one side of the printed circuit board or fibers. COPYRIGHT: (C)2011,JPO&INPIT

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式