基本信息:
- 专利标题： Printed circuit board and a method of manufacturing the same
- 申请号：JP2010548626 申请日：2009-03-02
- 公开(公告)号：JP2011513965A 公开(公告)日：2011-04-28
- 发明人： ボン チョイ，ジェ , ウク ハン，ジュン , ホ ファン，ジュン , スン ユン，ヒェ , ジュン リ，ウン
- 申请人： エルジー イノテック カンパニー,リミティド
- 专利权人： エルジー イノテック カンパニー,リミティド
- 当前专利权人： エルジー イノテック カンパニー，リミティド
- 优先权： KR20080019337 2008-02-29; KR20080136022 2008-12-29
- 主分类号： H05K3/00
- IPC分类号： H05K3/00
【選択図】図４
Method of manufacturing a printed circuit board according to the present invention the first and second insulating members and by thermal bonding by arranging the first and second conductive films on both sides of the separating member, wherein across the isolation member first insulating member and the second depositing a dielectric member, the first insulating member and the first conductive film, and a step of depositing each of said second insulating member and the second conductive film, first and selectively removing the first and second conductive films 1,2 forming a circuit pattern, separating the first and second insulating members said first and second circuit patterns are formed by the separating member and the separating member by cutting the first and second insulating members including a stage, a.
.FIELD 4
公开/授权文献:
- JP5221682B2 Printed circuit board and a method of manufacturing the same 公开/授权日：2013-06-26
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K3/00 | 用于制造印刷电路的设备或方法 |