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71. 发明专利

JPH1197176A ORGANIC ELECTROLUMINESCENCE ELEMENT 失效
公开(公告)号：JPH1197176A
公开(公告)日：1999-04-09
申请号：JP25348497
申请日：1997-09-18
申请人： MITSUBISHI ELECTRIC CORP
发明人： NAGAE ISAMU , FUJIMOTO TAKAMITSU , HIZUKA YUJI
IPC分类号： H05B33/14 , C09K11/06 , H01L51/50 , H01L51/52 , H05B33/12 , H05B33/22
摘要： PROBLEM TO BE SOLVED: To ensure the light emission of high luminosity, high efficiency, and high output while maintaining a stable emission characteristic over a long period of time by providing a light emission layer having a charge transport function made by bopping transmission and being composed of a molecular aggregate capable of orientation in which luminous elements showing electroluminescence are dispersed, and electrodes facing each other through the light emission layer. SOLUTION: As a molecular aggregate, for example, a discotic liquid crystal or a rod-like liquid crystal is used. The discotic liquid crystal is a macro molecular liquid crystal as represented by formulae I-III. With the liquid crystal characteristic, the molecular aggregate has large orientation formation capability and a further improved electric charge movement. With the use of macro molecular liquid crystal for the molecular aggregate, there is no necessity of dispersion in binding resin and no hoppin site is dilluted, thereby providing an excellent electric charge transport layer function. The molecular aggregate has a structure showing asymmetrical characteristic and provides polarized light emission.

72. 发明专利

JPH0632982A HIGHLY DIELECTRIC RESIN COMPOSITION, AND PRESSURE SENSOR AND MULTICHIP MODULE PRODUCED USING THE SAME 失效
公开(公告)号：JPH0632982A
公开(公告)日：1994-02-08
申请号：JP21558892
申请日：1992-07-20
申请人： MITSUBISHI ELECTRIC CORP
发明人： TOYOSHIMA TOSHIYUKI , FUJIMOTO TAKAMITSU , BABA FUMIAKI
IPC分类号： C08K5/56 , C08L79/08 , G01L9/04 , H01L25/04 , H01L25/18 , H01L29/84
摘要： PURPOSE:To obtain the subject compsn. excellent in heat resistance and also in moldability and high-temp. mechanical characteristics by thermally curing a soln. obtd. by mixing a polyamic acid compd. with a titanium compd., a zirconium compd., and a lead compd. CONSTITUTION:This compsn. is obtd. by thermally curing a soln. obtd. by mixing a polyamic acid compd. of formula I (wherein R is a tetravalent org. group; R is a divalent org. group; and n>=2) with an org.-solvent- or water-sol. titanium alkoxide compd. or titanium compd. of formula II (wherein R and R are each a monovalent hydrocarbon group; (n) is 1-4; and m+m=4), an org.-solvent- or water-sol. zirconium alkoxide compd. of formula III (wherein R and R are each a monovalent hydrocarbon group; (n) is 1-4; and n+m=4), etc. A heat-resistant pressure sensor is produced by using the compsn. as a strain gage, and a highly reliable multichip module is produced from the compsn.

73. 发明专利

JPH05251592A 失效
公开(公告)号：JPH05251592A
公开(公告)日：1993-09-28
申请号：JP4938292
申请日：1992-03-06
申请人： MITSUBISHI ELECTRIC CORP
发明人： FUJIMOTO TAKAMITSU , YANAGIURA SATOSHI , FUJIWARA TAKEJI , SATO HIROYUKI , BABA FUMIAKI
IPC分类号： H01L21/56 , H01L23/29 , H01L23/31 , H05K3/28
摘要： PURPOSE:To improve reliability against corrosion without adversely effecting electrical characteristics by ensuring humidity resistance of a module circuit which consists of a high frequency circuit and a high frequency device formed on a substrate. CONSTITUTION:A humidity resistance structure of a module circuit wherein a porous film 3 which is manufactured to have apparent dielectric constant of 2.0 or below is applied on a strip line and a high frequency device formed on a substrate and a resin coating material 4 is further applied thereon.

74. 发明专利

JPH05198953A MULTILAYER INTERCONNECTION BOARD AND ITS MANUFACTURE 失效
公开(公告)号：JPH05198953A
公开(公告)日：1993-08-06
申请号：JP5131492
申请日：1992-03-10
申请人： MITSUBISHI ELECTRIC CORP
发明人： FURUHASHI YASUO , TOYOSHIMA TOSHIYUKI , FUJIMOTO TAKAMITSU , BABA FUMIAKI
IPC分类号： H05K3/46
摘要： PURPOSE:To provide a multilayer interconnection board wherein its continuity reliability is high, its surface smoothness is good and its hardening temperature is comparatively low and to provide its manufacturing method. CONSTITUTION:At least an insulating layer 7 on a first conductor layer 2 formed on a substrate 1 is constituted of a polymer composition; an insulating layer 8 at the outermost layer is constituted of a fiber-reinforced resin; openings 4 which expose the surface of a conductor interconnection in parts constituting the first conductor layer 2 or a second conductor layer 6 are formed in the insulating layers 7, 8; the individual conductor layers are connected by plated conductors formed on wall faces of the openings 4. It is possible to provide a multilayer interconnection board in which the difference in a coefficient of thermal expansion between the second conductor layer 6 at the outermost layer, a mounted component and the insulating layers 7, 8 is made, small, whose continuity reliability is enhanced, whose surface smoothness is good and in which the insulating layers 7, 8 can be made easily thick, and it is possible to provide its manufacturing method.

75. 发明专利

JPH0551541A INORGANIC FILLER COATED WITH POLYIMIDE RESIN, RESIN COMPOSITION CONTAINING THE FILLER, AND SEMICONDUCTOR DEVICE SEALED WITH THE COMPOSITION 失效
公开(公告)号：JPH0551541A
公开(公告)日：1993-03-02
申请号：JP21335091
申请日：1991-08-26
申请人： MITSUBISHI ELECTRIC CORP
发明人： TOYOSHIMA TOSHIYUKI , FUJIMOTO TAKAMITSU , BABA FUMIAKI , YAMAMOTO YASUSHI
IPC分类号： C08G73/10 , C08G59/00 , C08K9/04 , C08L63/00 , C09C3/12 , H01L23/29 , H01L23/31
摘要： PURPOSE:To obtain an inorganic filler which has high heat resistance and makes it possible to relax the thermal stress caused by thermal shock, by providing an inorganic filler with a coating layer imidized after coating with a specified polyamic acid compound having terminal silicon groups. CONSTITUTION:An inorganic filler having a coating layer imidized after coating with a polyamic acid compound having terminal silicon groups, shown by the formula. In this inorganic filler coated with the polyimide resin, the resin itself withstands heat at a temperature as high as 300 to 400 deg.C, and the adhesion between the resin and the surface of the filler is good since functional groups having high affinity for inorganic substance are present in the molecular chain of the polyimide. Therefore, the incorporation of the coated filler into one or more resins will give a resin composition which has high heat resistance, can sufficiently relax the thermal stress caused by thermal shock, and is most suitable for sealing a semiconductor device.

76. 发明专利

JPH01132651A EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR SEALING 失效
公开(公告)号：JPH01132651A
公开(公告)日：1989-05-25
申请号：JP29135587
申请日：1987-11-17
申请人： MITSUBISHI ELECTRIC CORP
发明人： FUJIMOTO TAKAMITSU , KANEGAE YUZO , KITA SHUICHI , SHINODA ATSUKO , MORIWAKI NORIMOTO
IPC分类号： C08L61/10 , C08G59/00 , C08L61/04 , C08L63/00 , H01L23/29 , H01L23/31
摘要： PURPOSE:To obtain the title composition excellent in thermal cycling shock resistance, heat resistance and moisture resistance, by mixing a polyepoxy compound with a novolac phenolic resin, an inorganic filler, a polyether sulfone and a cure accelerator. CONSTITUTION:100 pts.wt. polyfunctional epoxy compound (A) (e.g., novolac epoxy resin) is mixed with a novolac phenolic resin (B) of an unreacted monomer content

77. 发明专利

JPS6438428A EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR SEALING 失效
公开(公告)号：JPS6438428A
公开(公告)日：1989-02-08
申请号：JP19569787
申请日：1987-08-04
申请人： MITSUBISHI ELECTRIC CORP
发明人： FUJIMOTO TAKAMITSU , KANEGAE YUZO , SHINODA ATSUKO , KITA SHUICHI , MORIWAKI NORIMOTO
IPC分类号： C08L63/00 , C08G59/00 , C08G59/62 , C08L101/00 , H01L23/29 , H01L23/31
摘要： PURPOSE:To obtain a resin composition excellent in heat resistance, moisture resistance and thermal cycling resistance, by mixing an epoxy resin composition with a thermoplastic liquid crystal polymer treated with a titanate coupling agent at a specified mixing ratio. CONSTITUTION:A resin composition comprising a thermoplastic liquid crystal polymer treated with 0.2-10pts.wt., per 100pts.wt. said polymer, titanate coupling agent, a polyepoxy compound, a phenol novolac resin and an inorganic filler, wherein said polymer is contained in an amount of 0.1-25wt.% based on the resin composition. When the amount of the titanate coupling agent used to treat the polymer is below 0.2pt.wt., the effect of improving the mechanical strengths of the obtained resin composition is not sufficient, while when this amount is above 10pts.wt., the moisture resistance of the sealing resin is decreased. When the amount of said polymer is below 0.1wt.%, the effect of improving the mechanical strengths is not sufficient. When this amount is above 25%, the obtained composition is decreased in flow and workability and is not suitable for practical use.

78. 发明专利

JPS6426624A EPOXY POLYMER COMPOSITION FOR SEALING SEMICONDUCTOR 失效
公开(公告)号：JPS6426624A
公开(公告)日：1989-01-27
申请号：JP18417087
申请日：1987-07-22
申请人： MITSUBISHI ELECTRIC CORP
发明人： FUJIMOTO TAKAMITSU , KANEGAE YUZO , KITA SHUICHI , SHINODA ATSUKO , MORIWAKI NORIMOTO
IPC分类号： C08G59/40 , C08G59/00 , C08G59/62 , C08L63/00 , H01L23/29 , H01L23/31
摘要： PURPOSE:To provide the titled composition containing a polyfunctional epoxy compound, a phenolic novolak polymer, an inorganic filler, a specific amount of a polysulfone and a cure accelerator and having excellent thermal shock resistance, heat-resistance and moisture resistance. CONSTITUTION:The objective composition contains (A) a polyfunctional epoxy compound (preferably novolak epoxy polymer), (B) a phenolic novolak polymer (preferably having an unreacted monomer content of

79. 发明专利

JPS6231724B2 失效
公开(公告)号：JPS6231724B2
公开(公告)日：1987-07-10
申请号：JP4143681
申请日：1981-03-19
申请人： MITSUBISHI ELECTRIC CORP
发明人： FUJIMOTO TAKAMITSU , SUZUKI YASUHIRO
IPC分类号： C08F2/00 , C08F2/50 , C08F290/00 , C08F299/00 , C08F299/06

80. 发明专利

JPS6241218A EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR 失效
公开(公告)号：JPS6241218A
公开(公告)日：1987-02-23
申请号：JP18198585
申请日：1985-08-19
申请人： MITSUBISHI ELECTRIC CORP
发明人： FUJIMOTO TAKAMITSU , KANEGAE YUZO , KITA SHUICHI , MORIWAKI NORIMOTO , ANDO TORAHIKO
IPC分类号： C08G59/00 , C08G59/62 , C08L1/00 , C08L27/00 , C08L63/00 , H01L23/29 , H01L23/31
摘要： PURPOSE:The titled composition excellent in heat cycling resistance, heat resistance and moisture resistance, comprising a polyfunctional epoxy compound, a phenol novolak resin, an inorganic filler, a cure accelerator and a fluorocarbon resin. CONSTITUTION:A polyfunctional epoxy compound (A) (e.g., novolak epoxy resin) is mixed with a phenol novolak resin (B) of an unreacted monomer content

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