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1. 发明专利

JP2004131605A Thermoplastic resin composition 审中-公开
公开(公告)号：JP2004131605A
公开(公告)日：2004-04-30
申请号：JP2002297703
申请日：2002-10-10
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： MINEGISHI AKIO , FUJIMOTO TAKAMITSU , FUJITA AKIHIRO
IPC分类号： C08L23/10
摘要： PROBLEM TO BE SOLVED: To provide a method which makes it possible to prevent the deterioration of the physical properties of a polypropylene resin recovered from waste household electrical appliances due to inclusion of foreign matter during long-term service, recover the mechanical properties and realize material recycling, and a reclaimed polypropylene resin.
SOLUTION: The reclaimed polypropylene resin comprises a recovered polypropylene resin and a compatibilizer based on a resin having a reactive group in a polypropylene resin skeleton. It is desirable that the reactive group comprises an active silane group and that the compatibilizer has both compatibility with a recovered polypropylene resin and an interaction with foreign matters.
COPYRIGHT: (C)2004,JPO

2. 发明专利

JPH1187064A PHOTOELECTRIC CONVERSION ELEMENT 失效
公开(公告)号：JPH1187064A
公开(公告)日：1999-03-30
申请号：JP24271497
申请日：1997-09-08
申请人： MITSUBISHI ELECTRIC CORP
发明人： NAGAE ISAMU , FUJIMOTO TAKAMITSU , HIZUKA YUJI
IPC分类号： G03G5/07 , C08G77/14 , C08L101/12 , C09K19/38 , G02F1/13 , H05B33/12 , H05B33/14 , H05B33/22
摘要： PROBLEM TO BE SOLVED: To improve various characteristics of response speed, diffraction efficiency and luminous efficiency through improvement of the charge-mobility by forming a charge transfer layer of an organic compound out of a high molecular liquid crystal material, which has charge transfer ability using hopping conduction and the alignment of which is possible. SOLUTION: A positive electrode 1 of a metal such as Pt having a large work function or ITO or the like having high transparency, a charge transfer layer 2 obtained by dispersing a light emitting material in the organic compound and working as a light emitting layer, a negative electrode 3 consisting of a metal such as Ca, Li having a small work function and Ag or Al are laminated in order on a substrate 4 of transparent glass or the like so as to obtain a single-layer organic EL element as a photoelectric conversion element. At this stage, as a charge transfer layer 2, a high molecular liquid crystal material, which has charge transfer ability with hopping conduction and of which orientation is possible, is used. Degree of charge-transfer is improved by using this material in the aligned condition. As a high molecular liquid crystal material, discotic liquid crystal or rod-like liquid crystal is desirable.

3. 发明专利

JPH095754A LIQUID CRYSTAL DISPLAY ELEMENT 失效
公开(公告)号：JPH095754A
公开(公告)日：1997-01-10
申请号：JP14907395
申请日：1995-06-15
申请人： MITSUBISHI ELECTRIC CORP
发明人： TABATA SHIN , TSUMURA AKIRA , MIZUNUMA MASAYA , TAMAYA AKIRA , FUJIMOTO TAKAMITSU
IPC分类号： G02F1/1337
摘要： PURPOSE: To obtain a wide visual angle by adding an optically active compd. which gives a helical structure to the orientation of liquid crystal molecules of a liquid crystal having negative dielectric anisotropy, forming a liquid crystal layer and orienting the liquid crystal molecules perpendicular to the plane of an orienting film. CONSTITUTION: Orienting films 23, 27 are formed by applying org. silane compd. films on transparent electrodes 22, 26 formed on glass substrates 21, 25, respectively. These substrates are disposed with the orienting films 23, 27 facing each other to form a space, and a liquid crystal layer 32 is held in this space to constitute a liquid crystal cell 34. This liquid crystal layer is prepared by adding an optically active compd. which gives a helical structure to the orientation of liquid crystal molecules, for example, by adding cholesterisnonate by 2%, to a liquid crystal material having negative dielectric anisotropy. Further, polarizing plates 28, 29 with the polarization directions perpendicular to each other are disposed on the both sides of the liquid crystal cell 34 to obtain a liquid crystal element 35. The liquid crystal molecules in the liquid crystal layer 32 are oriented perpendicular to the film plane of the orienting films 23, 27. Thereby, when enough voltage is applied, the liquid crystal molecules are released from the control of the orienting films so that the orienting axes of liquid crystal molecules are randomly distributed in the plane parallel to the substrate plane.

4. 发明专利

JPH0564181B2 失效
公开(公告)号：JPH0564181B2
公开(公告)日：1993-09-14
申请号：JP19205984
申请日：1984-09-11
申请人： MITSUBISHI ELECTRIC CORP
发明人： KITA SHUICHI , FUJIMOTO TAKAMITSU , KANEGAE JUZO , MORIWAKI NORIMOTO , ANDO TORAHIKO
IPC分类号： C08G59/00 , C08G59/18 , C08K3/36 , C08L63/00 , H01L23/29 , H01L23/31

5. 发明专利

JPH05160558A MOISTURE RESISTANT STRUCTURE OF MODULE CIRCUIT 失效
公开(公告)号：JPH05160558A
公开(公告)日：1993-06-25
申请号：JP32544391
申请日：1991-12-10
申请人： MITSUBISHI ELECTRIC CORP
发明人： FUJIMOTO TAKAMITSU , YANAGIURA SATOSHI , NODA ATSUKO , FUJIWARA TAKEJI , SATO HIROYUKI , BABA FUMIAKI
IPC分类号： H01P1/30 , H01P3/08 , H01P11/00 , H05K3/28
摘要： PURPOSE:To provide the entitled moisture resistant structure of a module circuit capable of securing the moisture resistance almost without changing the electric circuit characteristics of strip line easy to form a high-frequency circuit. CONSTITUTION:Within the entitled moisture resistant structure of a module circuit, a strip line 2 of a module board 1 having a high-frequency circuit and a high-frequency device is to be covered with a water repellent porus film 3 in apparent (air bubble containing state) dielectric constant of not exceeding 2.0.

6. 发明专利

JPH0396257A RESIN-SEALED SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH0396257A
公开(公告)日：1991-04-22
申请号：JP23434089
申请日：1989-09-08
申请人： MITSUBISHI ELECTRIC CORP
发明人： FUJIMOTO TAKAMITSU , KITA SHUICHI , NODA ATSUKO , HIZUKA YUJI
IPC分类号： C08K3/08 , C08K3/36 , C08K7/14 , H01L23/29 , H01L23/31
摘要： PURPOSE:To obtain a resin-sealed semiconductor device having excellent cold impact resistance, excellent heat resistance and moisture resistance by covering a semiconductor element and outer leads connected to bonding wirings with porous silica gel, and immersing the air gaps of the gel with sealing resin. CONSTITUTION:In a resin-sealed semiconductor device having a semiconductor element 1 held on a die frame 2, bonding wirings 3 for connecting the element 1 to outer leads 7, and resin 6 for sealing the element 1, and the leads 7 connected to the wirings 3, the element 1 and the leads 7 connected to the wirings 3 are covered with porous silica gel 5, and the gel 5 is immersed in the air gaps with the resin 6. For example, the gel 5 immersed with the resin 6 is formed by forming moistened gel from porous silica gel material mixture liquid, then drying it to dry gel, then immersing it in the air gaps with the resin 6, and covering the outer periphery with the sealing epoxy resin 6.

7. 发明专利

JPH0366724A EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR 失效
公开(公告)号：JPH0366724A
公开(公告)日：1991-03-22
申请号：JP20322089
申请日：1989-08-03
申请人： MITSUBISHI ELECTRIC CORP
发明人： FUJIMOTO TAKAMITSU , KITA SHUICHI , NODA ATSUKO , HIZUKA YUJI
IPC分类号： H01L23/29 , C08G59/62 , H01L23/31
摘要： PURPOSE:To provide the subject composition comprising an epoxy resin, a phenolic resin, a specific cyclic phenol compound and an inorganic filler, capable of obtaining a cured product having high glass transition temperature and excellent heat resistance, moisture resistance and cold heat impact resistance. CONSTITUTION:The objective composition comprises (A) an epoxy resin having two or more epoxy groups in one molecule (preferably a novolak-based or triglycidylphenylmethane-based epoxy resin), (B) a phenolic resin having two or more phenolic hydroxyl groups in one molecule (preferably containing

8. 发明专利

JPH0299531A INORGANIC FILLING MATERIAL AND PRODUCTION THEREOF 失效
公开(公告)号：JPH0299531A
公开(公告)日：1990-04-11
申请号：JP25091288
申请日：1988-10-06
申请人： MITSUBISHI ELECTRIC CORP
发明人： KITA SHUICHI , SHINODA ATSUKO , KANEGAE YUZO , FUJIMOTO TAKAMITSU
IPC分类号： C08K9/04 , C08G59/00 , C08L63/00
摘要： PURPOSE:To obtain the title filling material providing a cured material having low stress, excellent cracking resistance, heat resistance, water vapor resistance, etc., by covering the surface of inorganic powder with a thermoplastic elastomer. CONSTITUTION:Inorganic powder (preferably fused silica or ferrite) is fed to a powder blender (e.g., Henschel mixer), preferably a styrene or olefin-based thermoplastic elastomer (0.1-5wt.% thermoplastic elastomer is used based on inorganic filling material) dissolved in a solvent (e.g., toluene) is dropped or sprayed while blending and further the solvent is removed while blending and introducing dried air, etc., to give the aimed filling material. When wetting between the inorganic powder and the thermoplastic elastomer is poor, the surface of the inorganic filling material is preferably treated with a coupling agent (preferably vinyltrimethoxysilane) for use.

9. 发明专利

JPS63193915A EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR 失效
公开(公告)号：JPS63193915A
公开(公告)日：1988-08-11
申请号：JP2657787
申请日：1987-02-05
申请人： MITSUBISHI ELECTRIC CORP
发明人： FUJIMOTO TAKAMITSU , KANEGAE YUZO , KITA SHUICHI , SHINODA ATSUKO , MORIWAKI NORIMOTO
IPC分类号： C08J5/04 , C08G59/00 , C08G59/18 , C08G59/62 , C08K3/00 , C08K9/02 , C08L63/00 , H01L23/29 , H01L23/31
摘要： PURPOSE:To obtain the titled novel composition, containing short fibers treated with a titanate based coupling agent, a polyfunctional epoxy compound, phenolic novolak resin, etc., and having excellent mechanical strength, crack, heat and moisture resistance. CONSTITUTION:A composition consisting of (A) short fibers (preferably aromatic polyamide fibers) treated with a titanate based coupling agent (e.g. isopropyl triisostearoyl titanate, etc.), (B) a polyfunctional epoxy compound (preferably novolak based epoxy resin), (C) a phenolic novolak resin, (D) an inorganic filler (e.g. crystalline silica powder, etc.) and (E) a curing accelerator (e.g. 2- methylimidazole, etc.). Furtheremore, the amount of the blended short fibers is preferably 1-7wt.% based on the total weight of the components (A), (B) and (C).

10. 发明专利

JPS63132923A EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR 失效
公开(公告)号：JPS63132923A
公开(公告)日：1988-06-04
申请号：JP27907486
申请日：1986-11-21
申请人： MITSUBISHI ELECTRIC CORP
发明人： FUJIMOTO TAKAMITSU , KANEGAE YUZO , KITA SHUICHI , SHINODA ATSUKO , MORIWAKI NORIMOTO
IPC分类号： H01L23/29 , C08G59/00 , C08G59/18 , C08G59/62 , C08L63/00 , H01L23/31
摘要： PURPOSE:To obtain the titled composition having excellent adhesiveness between rubber component and epoxy resin matrix, improved heat cycle resistance and heat resistance, containing a modified fluororubber obtained by modifying fluororubber with a specific surface active agent. CONSTITUTION:(A) Modified fluororubber obtained by modifying (i) fluororubber with (ii) a copolymerized surface active agent of a perfluoroalkyl group- containing acrylate compound (e.g. compound shown by formula I, etc.) and (meth)acrylate (e.g. compound shown by formula II, etc.) is blended with (B) a polyfunctional epoxy resin compound, (C) a phenolic novolak resin, (D) an inorganic filler and (E) a curing promoter to give the aimed composition. The blending ratio of the component i and ii of the component ii/i is preferably 0.002-0.03 and a terpolymer of tetra-fluoroethylene, vinylidene fluoride and hexafluoropropylene, etc., is preferably used as the component i.

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