专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JPH0563416A MANUFACTURE MICROWAVE MODULE 失效
公开(公告)号：JPH0563416A
公开(公告)日：1993-03-12
申请号：JP24697491
申请日：1991-08-30
申请人： MITSUBISHI ELECTRIC CORP
发明人： FUJIWARA TAKEJI , SHIRAHANA RIYOUJI , YAMANAKA KOUJI
IPC分类号： H01L23/04 , H01B1/22 , H01L23/02 , H01P1/00 , H01P11/00
摘要： PURPOSE:To contrive the reduction in weight of a module. CONSTITUTION:A conductive paste 7 having the characteristic of 15 to 30kg/mm elastic modulus, 3 to 10%, ductility 7X10 to 15X10 cal/cm.sec. deg.C coefficient of thermal conductivity 1.0X10 to 3.0X10 OMEGAcm specific heat resistance, and 77 to 83% content ratio of before-fastening metallic power is used for the fixing of a microwave semiconductor element 5 to a package 4 and the fixing of a microwave dielectric circuit substrate 3 to a module case 1. Therefore, the conductive paste absorbs the thermal stress so that the Al can be used as a case material of the microwave module, resulting in making the module light in weight.

2. 发明专利

JPH04242485A OBJECT RECOGNIZING DEVICE 失效
公开(公告)号：JPH04242485A
公开(公告)日：1992-08-31
申请号：JP1501391
申请日：1991-01-16
申请人： MITSUBISHI ELECTRIC CORP
发明人： HASHIMOTO MANABU , KAWATO SHINJIRO , NAKAZATO TAKESHI , SASAKURA MASAHIRO , FUJIWARA TAKEJI
IPC分类号： G06T1/00 , G06T7/00 , G06T7/60 , G06T9/20
摘要： PURPOSE:To recognize an image of an object having a large level difference with no occurrence of an out-of-focus state. CONSTITUTION:The edge extracting means 131 and 132 are provided to extract the edge parts out of plural image signals obtained by the cameras 121 and 122. The segment description generating means 141 and 142 describe the extracted edge date as plural assemblies of segments. Then a description data synthesizing means 15 synthesizes the in-focus segment description data. Thus all generated segment description data are kept in focus.

3. 发明专利

JPH0650728A WIRE BONDING INSPECTOR 失效
公开(公告)号：JPH0650728A
公开(公告)日：1994-02-25
申请号：JP22223192
申请日：1992-07-30
申请人： MITSUBISHI ELECTRIC CORP
发明人： SASAKURA MASAHIRO , NAKAZATO TAKESHI , HASHIMOTO MANABU , KAWATO SHINJIRO , FUJIWARA TAKEJI
IPC分类号： G01B11/24 , G01N21/88 , G01N21/956 , H01L21/60 , H01L21/66
摘要： PURPOSE:To obtain a wire bonding inspector which accurately recognizes the center of a bonding part and performs processing speedily. CONSTITUTION:The image of an object 1 to be inspected which is wire-bonded is picked up by an image pick-up device 3, the projection pattern of an image which is stored by an image memory 5 as a digital image signal is created by selecting a 0 deg. cutting projection circuit 11 or 45 deg. cutting projection circuit 12 according to an inspection window cutting direction which is stored in a wire direction memory 13, a center is obtained by a ball center calculation circuit 14, and conformity is judged by a criterion circuit 15. Operation regarding projection is simplified and executed by hardwares easily, and an inspection can be performed speedily.

4. 发明专利

JPH04277645A METHOD FOR TESTING SHAPE OF BOND WIRE 失效
公开(公告)号：JPH04277645A
公开(公告)日：1992-10-02
申请号：JP6560491
申请日：1991-03-05
申请人： MITSUBISHI ELECTRIC CORP
发明人： NAKAZATO TAKESHI , FUJIWARA TAKEJI , SASAKURA MASAHIRO , KAWATO SHINJIROU , HASHIMOTO MANABU
IPC分类号： H01L21/60 , G01B11/24 , H01L21/66
摘要： PURPOSE:To simplify the measurement of wire height and reduce the test time by measuring the peak height of wire and the height of wire at an edge of a chip where the wire should be out of touch to obtain the shape of bond wire. CONSTITUTION:A hybrid IC substrate 1 having a chip 2 and wiring pattern 6 is checked for the shape of a bond wire 5 on it. The shape of the wire 5 is evaluated by measuring the peak height of wire and the height of wire at an edge 21 of the chip 2 where the wire should be out of touch. For example, a reference height h0 is determined while a camera 7 is focused on the surface of a pad 3 on the chip 2. Next, the peak of wire is focused to determine the peak height h1 and the XY coordinates of the peak. Then, the camera is moved vertically, and the wire height h2 at the edge 21 of the chip is determined when the edge 21 is clearly focused.

5. 发明专利

JPH04255242A BONDING STATE INSPECTING DEVICE 失效
公开(公告)号：JPH04255242A
公开(公告)日：1992-09-10
申请号：JP3513591
申请日：1991-02-06
申请人： MITSUBISHI ELECTRIC CORP
发明人： HASHIMOTO MANABU , KAWATO SHINJIRO , NAKAZATO TAKESHI , SASAKURA MASAHIRO , FUJIWARA TAKEJI
IPC分类号： H01L21/60 , H01L21/66
摘要： PURPOSE:To make it possible to inspect the bonding state of bonding wires with high accuracy while the state is observed through a monitoring TV. CONSTITUTION:A bonding state inspecting device is provided with a TV camera 12 for imaging the part to be inspected of a hybrid IC (a hybrid integrated circuit element) 14 lightened by a lightening means 11, a bonding position data memory 17, which stores positions to be connected by a wire bonding with each other and stores the positions, and a whole control means 21 for calculating a bonding position of the IC 14 on an X-Y table 15 on the basis of data on the above positions and enables and X-Y table position control means 16 to control the position of the above X-Y table so as to move the above inspected part to a position in the field of the camera 12 on the basis of the above calculated result.

6. 发明专利

JPH04147654A BASE MATERIAL FOR MOUNTING ELECTRONIC COMPONENT 失效
公开(公告)号：JPH04147654A
公开(公告)日：1992-05-21
申请号：JP27266690
申请日：1990-10-09
申请人： MITSUBISHI ELECTRIC CORP
发明人： KOGO YASUO , ITO TAKEFUMI , OKUMURA MITSUHIRO , YOSHIZAKI KIYOSHI , FUJIWARA TAKEJI , YAMASHITA HIROBUMI
IPC分类号： C22C49/00 , C22C47/00 , C22C49/06 , C22C49/14 , H01L23/14 , H01L23/373 , H01L23/492 , H05K1/05
摘要： PURPOSE:To make the title material superior in workability and ligher and reduce its thermal stress by a method wherein a volume content rate of a carbonic fiber made of a composite metal is specified with aluminum as a mother phase, and the carbonic fiber is two-dimentionally arranged without any order in the direction of the mounting face of electronic components and in a layer- like manner in the face direction perpendicular to the mounting face of the electronic components. CONSTITUTION:Without aluminum or an aluminum alloy as a mother phase, a carbonic fiber is made of dispersed composite metals, a volume content rate of the carbonic fiber is 0.15 to 0.55, and the carbonic fiber is two-dimentionally arranged without any order in the direction of a mounting face of electronic components and in a layer-like manner in the face direction perpendicular to the mounting face of the electronic components. As a result, differences of a heat expansive coefficient of a semiconductor or a package can be made small, and a thermal stress to be loaded at a junction of a case material with the semiconductor or the package can be restrained to a small value.

7. 发明专利

JPH02188953A CIRCUIT COMPONENT FOR MICROWAVE INTEGRATED CIRCUIT 失效
公开(公告)号：JPH02188953A
公开(公告)日：1990-07-25
申请号：JP771889
申请日：1989-01-18
申请人： MITSUBISHI ELECTRIC CORP
发明人： MATSUMOTO KAYO , NAKAZATO TAKESHI , FUJIWARA TAKEJI
IPC分类号： H01L23/538 , H01P3/08
摘要： PURPOSE:To obtain a circuit component which need not be housed in a case of an airtight structure when it is used by a method wherein an insulating protective film which comes into close contact with an insulating member between connection members and with which one or one part of both of the connection members is covered is arranged between the connection members which are used to connect external circuits. CONSTITUTION:In a circuit component 1, for microwave integrated circuit use, provided with a plurality of connection members 2 to 4 which are insulated electrically from each other by using insulation members 6 and which are connected to external circuits, insulating protective films 6 which come into close contact with the insulation members 6 between the connection members 2 to 4 and which cover one or one part of both of the connection members 2 to 4 are arranged between said connection members 2 to 4. For example, an insulating protective film 6 which comes into close contact with a part, between a collector lead 3 and a base electrode 4, of an insulator 5 of a high-frequency transistor 1 and which covers one part of the base electrode 4 is installed. Thereby, a creeping distance between the individual connection members can be made longer than a field distance which is required to prevent migration corrosion and can eliminate a need for housing this transistor in a case of an airtight structure.

8. 发明专利

JPS55154189A HEATTSENSITIVE HEAD 失效
公开(公告)号：JPS55154189A
公开(公告)日：1980-12-01
申请号：JP6196779
申请日：1979-05-18
申请人： MITSUBISHI ELECTRIC CORP
发明人： FUJIWARA TAKEJI , HAMANAKA KOUICHI
IPC分类号： B41J2/335
摘要： PURPOSE:To prevent accumulating of paper dusts at a heating portion of a resistance and to improve a printed picture quality, by a method wherein a glaze layer corresponding to the heating portion of the resistance is formed in a convexity. CONSTITUTION:First, a glaze layer 2 is formed on a surface of an alumina base 1. A hot resist mask is formed at a portion of the glaze layer 2 corresponding to a heating portion 3a of a resistance. A glaze layer 2a except a section corresponding to the heating portion 3a is thinned by an etching treatment. A resistance 3, electrifying electrodes 4, an oxidation-proof layer 5, and an abrasion-proof layer 6 are then formed thereon to finish a desired thermal head. EFFECT:Printing can be performed at a low power.

9. 发明专利

JPS55154188A HEATTSENSITIVE HEAD 失效
公开(公告)号：JPS55154188A
公开(公告)日：1980-12-01
申请号：JP6196679
申请日：1979-05-18
申请人： MITSUBISHI ELECTRIC CORP
发明人： FUJIWARA TAKEJI , HAMANAKA KOUICHI
IPC分类号： B41J2/335
摘要： PURPOSE:To prevent accumulation of paper dusts at a heating portion and to improve a printed picture quality, by a format wherein only a portion corresponding to an electrifying electrode of a resistance is thinned by an etching teatment, and a resistance body serving as a heating portion is formed in a convexity. CONSTITUTION:First, a glaze layer 2 is formed on a surface of an alumina base sheet 1, and a thermit resistance 3, such as tantalum-silicon dioxide, etc., is then filmed by a FR-sputtering method. A heating portion of the resistance 3 is then masked, and a resistance 3a corresponding to an electrifying electrode 4 is thinned by a plasma etching teatment to form a resistance 3b in a convexity serving as a heating portion.The electrifying electrode 4 and an abrasion-proof layer 5 are then formed to obtain a desired heat-sensitive head. EFFECT:Printing can be performed at a low electric power.

10. 发明专利

JPS55154187A HEATTSENSITIVE HEAD 失效
公开(公告)号：JPS55154187A
公开(公告)日：1980-12-01
申请号：JP6196579
申请日：1979-05-18
申请人： MITSUBISHI ELECTRIC CORP
发明人： FUJIWARA TAKEJI , HAMANAKA KOUICHI
IPC分类号： B41J2/335
摘要： PURPOSE:To prevent a deterioration of an electric characteristic of an electrode film due to the influence of a high temperature, by a method wherein a Mo-Au film or a Ta-Au film is used as a material serving as electrodes of a heat-sensitive head. CONSTITUTION:First, a glaze layer 2 and a resistance 3 are formed on a surface of an aluminum base sheet 1. A Mo-Au film or a Ta-Au film, serving as electrifying electrodes 4, is then formed on the whole surface of the resistance 3 by an electrode beam vacuum depositing method. An oxidation-proof layer 5 and an abrasion- proof layer 6 are then filmed by a sputtering method to complete the production of a heat-sensitive head.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式