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71. 发明专利

JPH09198489A METHOD AND DEVICE FOR PROCESSING PICTURE 失效
公开(公告)号：JPH09198489A
公开(公告)日：1997-07-31
申请号：JP716496
申请日：1996-01-19
申请人： HITACHI LTD , HITACHI TOKYO ELECTRONICS
发明人： ENDO FUMIAKI , NAGAISHI HIROSHI , WATANABE KENJI , SOEDA HIDEKI
IPC分类号： G06T1/00 , G06T3/00 , G06T7/00
摘要： PROBLEM TO BE SOLVED: To improve the inspection sensitivity and picture quality by eliminating the invalid area of pictures in a picture processor and eliminating the break of a valid area halfway. SOLUTION: The picture data of a channel Ch2 are stored in a memory 7 by the picture selectors 6 and 9 of the channel Ch1 by supplying addresses from the address M-3W of a first picture element of the channel Ch2 to M-1 one by one by a write address generation part 13. The picture data of the channel Ch1 selected by the picture selector 6 are stored in the memory 7 by the addresses from O to M-3W-1 generated by the write address generation part 13, the picture data of a second line are stored in the memory 8 and the contents of the memory 7 are read based on the address of a read address generation part 14. The fetching and the read of the memories 7 and 8 are alternately performed and the pictures are edited. The memory 7 is read in the order of the addresses of 0-M-1, the adjacent channels are overlapped each other and the pictures from which the invalid area is eliminated are edited.

72. 发明专利

JPH09191032A MONITORING OF PROCESS ABNORMALITY AND APPARATUS THEREOF 失效
公开(公告)号：JPH09191032A
公开(公告)日：1997-07-22
申请号：JP273696
申请日：1996-01-11
申请人： HITACHI LTD
发明人： YOSHITAKE YASUHIRO , NAGAISHI HIROSHI , WATANABE KENJI
IPC分类号： H01L21/66 , G01N21/88 , G01N21/93 , G01N21/94 , G01N21/956 , G06T1/00 , G06T7/00
摘要： PROBLEM TO BE SOLVED: To automatically judge an abnormality in processes of a semiconductor wafer and judge the necessity or non-necessity of its review. SOLUTION: The apparatus stores defect/foreign matter coordinate data in a data storage means DB through a network Nt from an appearance detector GK and a foreign matter detector, converts the data in an X-Y coordinate system to divided elements in an rθ coordinate system, computes a defect density in each of the divided elements at an operating part 9, and judges distribution abnormality based on a chi-square distribution. In the case of the distribution abnormality, the operating part 9 groups the distribution and computes an average value and a standard deviation for each of in defect density distributions in the groups, and compares these values with a preset conditional expression. A main controller 12, on the basis of an output received from the operating part 9, judges the necessity or non-necessity of its review. When judging the necessity of the review, the main controller 12 issues a signal to an alarm generator 10 to issue an alarm therefrom. The defect coordinate data is automatically transmitted to a review station, and the standard deviation and average are stored in the data storage means DB.

73. 发明专利

JPH08241844A RELATIVE POSITION DETECTING DEVICE AND METHOD, AND EXPOSURE METHOD 失效
公开(公告)号：JPH08241844A
公开(公告)日：1996-09-17
申请号：JP4512395
申请日：1995-03-06
申请人： HITACHI LTD
发明人： YOSHITAKE YASUHIRO , IRIKITA NOBUYUKI , WATANABE KENJI
IPC分类号： G03F9/00 , H01L21/027
摘要： PURPOSE: To enable a relative position of a reference mark to a measurement mark on a wafer to be accurately detected by a method wherein a measurement mark and a reference mark illuminated by the reflected light from a semiconductor wafer are imaged through imaging optical paths different from each other in focal distance respectively. CONSTITUTION: A reflected light C2 from a semiconductor wafer 2 illuminated by an illuminating light C1 is made to branch into reflected lights C2a and C2b by a half mirror 11 passing through an object lens 9, a beam splitter 8, and an imaging lens 10. At this point, an X stage 6a, a Y stage 6b, and a Z stage 6c are moved so as to make a measurement mark and a reference mark on the wafer 2 located in the fields of view of a first and a second image sensing device, 12 and 13, and the measurement mark optimally focused on the first image sensing device 12. By this setup, an optical image formed by the reflected light C2a which passes through the half mirror 11 is formed on the first image sensing device 12, and another optical image formed by the reflected light C2b , reflected from the half mirror 11 is formed on the second image sensing device 13.

74. 发明专利

JPH07141005A MANUFACTURE OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND THE DEVICE FOR THE SAME 失效
公开(公告)号：JPH07141005A
公开(公告)日：1995-06-02
申请号：JP14889293
申请日：1993-06-21
申请人： HITACHI LTD
发明人： IRIKITA NOBUYUKI , OKABE TSUTOMU , WATANABE KENJI , MAEJIMA HIROSHI , KUNIYOSHI SHINJI
IPC分类号： H01L21/677 , G05B13/02 , H01L21/02 , H01L21/027 , H01L21/30 , H01L21/66 , H01L21/68
摘要： PURPOSE:To provide the manufacture technique for semiconductor integrated circuit device so as to improve production efficiency by improving the accuracy of element quality and the predictive accuracy of product yield while considering influences caused by the mutual operations of element quality parameters when managing the quality of semiconductor manufacture processes. CONSTITUTION:Concerning the semiconductor manufacturing device for automating the manufacture by connecting a computer, various measuring instruments and processors through a communicating means, first of all, the initial value of a membership function is set 401, and the quality parameters combined with plural element quality parameters are expressed by membership functions for fuzzy control. Further, fuzzy inference is performed to the combined quality parameters from the element quality parameters while using these membership functions 402, the control of inference rules is performed corresponding to the data of real processes 403, the membership functions of the provided element quality parameters are converted to the managing standards of element quality 404 and by using these standards, the manufacturing processes of the semiconductor integrated circuit device are controlled.

75. 发明专利

JPH06216289A FORMATION OF PLASTIC SEALED SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH06216289A
公开(公告)日：1994-08-05
申请号：JP404893
申请日：1993-01-13
申请人： HITACHI LTD , HITACHI MICOM SYST KK
发明人： TAGUCHI ATSUHIKO , FUJISHIMA ATSUSHI , WATANABE KENJI , NAITO TAKAHIRO , HAGIWARA YASUHISA , HAGIWARA TAKATOSHI , TAKASHIMA KAZUHISA
IPC分类号： H01L21/66 , H01L23/50 , H05K3/30 , H05K3/34
摘要： PURPOSE:To obtain a high positioning accuracy at a cutting step, an electrical characteristic inspection step or a mounting step in assembly processes. CONSTITUTION:In the assembly processes of a plastic sealed semiconductor device 1, after a plastic sealed body 6 has been molded by the transfer molding method, a positioning section 351 is formed. The separation, inspection and mounting of outer leads 34 are carried out using this positioning section 351.

76. 发明专利

JPH01162521A LEAD FORMING DEVICE 失效
公开(公告)号：JPH01162521A
公开(公告)日：1989-06-27
申请号：JP31880287
申请日：1987-12-18
申请人： HITACHI LTD
发明人： WATANABE KENJI , HAGIWARA TAKATOSHI
IPC分类号： H01L23/50 , B21D5/01
摘要： PURPOSE:To prevent a group of leads from being constrained and to release the external force by putting one of 1st and 2nd group of leads between a supporting base and a pressure member and performing a bending step by a forming tool at its external end part separately to every group of leads. CONSTITUTION:A ramp 4 is lifted and the pressure member 3 is separated from the supporting base 2. Then, a root part to a package 1a of the 1st group 1d of leads and the 2nd group 1e of leads which are projected respectively, is positioned on supporting pieces 2a, 2b of a supporting base 2. Then, when the ramp 4 is lowered, a pressure piece 3a of the pressure member 3 comes into contact with the root part of the 1st group 1d of leads and the 1st group 1d of leads is put by the energizing force of a spring 6 between the supporting piece 2a and the pressure piece 3a. When the ramp 4 falls further, the external end part of the 1st group of leads is bent downward by a forming tool 7 falling with the ramp 4. Then, the 2nd group 1e of leads are bent in the same way by reversing the direction of the semiconductor device 1.

77. 发明专利

JPS62150836A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS62150836A
公开(公告)日：1987-07-04
申请号：JP29064085
申请日：1985-12-25
申请人： HITACHI LTD
发明人： YAMAZAKI ISAMU , HINO SHUNICHI , WATANABE KENJI , OKAMOTO MICHIO
IPC分类号： H01L21/60
摘要： PURPOSE:To conduct wire bonding of a pellet with high bonding strength by interposing a metal layer between one end of a wire and a bonding portion of the pellet with a pad to prevent the base of the pad from damaging. CONSTITUTION:A pellet 3 is sealed in a package body 2 of a semiconductor device 1. The peripheral portion of a lead 4 of the body 2 sealed with epoxy resin is formed as an inner lead 4a. The connection of the lead 4a with a wire 10 made of copper with a pad 8 formed on the surface of the pellet 3 is performed, for example, as follows. The end of the wire 10 is heated to form a melted ball, and a ball portion 10b is pressed on a gold bump 9 on the pad 8. At this time, the bump 9 becomes a cushion to absorb the pressing force, thereby preventing the pad 8 from damaging.

78. 发明专利

JPS6147646A Semiconductor manufacturing apparatus 失效
标题翻译：半导体制造设备
公开(公告)号：JPS6147646A
公开(公告)日：1986-03-08
申请号：JP16782484
申请日：1984-08-13
申请人： Hitachi Ltd
发明人： WATANABE KENJI , YAMAZAKI ISAMU
IPC分类号： H01L21/50
摘要： PURPOSE: To obtain an apparatus which ensures high efficiency as the through- system by making it possible to replace a part of a variety of conveyors which are capable of transferring the materials to be processed with a cassette for loader or unloader.
CONSTITUTION: A loader side flame transfer conveyor 18 is provided in the front-to-rear direction between a loading conveyor 15 and a frame supply conveyor 9. The conveyor 18 transfers lead frame on the frame supply conveyor 9 when it is a little moved by a frame 19. The conveyors 15 and 18 can be separated from a base 2 and after these are separated, a loader side cassette B accommodating the lead frame can be loaded to the position of loading conveyor 15. In the same way, when the unloading conveyor 22 is separated, a cassette C for unloader can be loaded. Thereby, an apparatus can be used as a through- system providing a plurality of wire bonders and it can also be used as a single wire bonder which improves working efficiency of apparatus.
COPYRIGHT: (C)1986,JPO&Japio
摘要翻译：目的：为了获得一种确保通过系统高效率的设备，可以通过使用能够用装载机或卸载机的盒子传送待处理材料的各种输送机的一部分进行更换。构成：装载机侧火焰传送输送机18沿着前后方向设置在装载输送机15和框架供给输送机9之间。输送机18在框架供给传送带9稍微移动时将引导框架传送到框架供给传送带9上输送机15和18可以与基座2分离，并且在它们分离之后，容纳引线框架的装载机侧盒B可以被装载到装载传送器15的位置。以相同的方式，当卸载输送机22被分离，可以装载用于卸载机的盒C。因此，可以将装置用作提供多个引线接合器的通孔，并且其也可以用作提高装置的工作效率的单线焊接机。

79. 发明专利

JPS5966198A Method of continuously supplying magazine 失效
标题翻译：连续供应杂志的方法
公开(公告)号：JPS5966198A
公开(公告)日：1984-04-14
申请号：JP17615482
申请日：1982-10-08
申请人： Hitachi Ltd
发明人： WATANABE KENJI
IPC分类号： B65D85/86 , B65D85/30 , H05K13/02

80. 发明专利

JPS57159034A WIRE CLAMPING DEVICE 失效
公开(公告)号：JPS57159034A
公开(公告)日：1982-10-01
申请号：JP4403981
申请日：1981-03-27
申请人： HITACHI LTD , HITACHI OME ELECTRONIC CO
发明人： WATANABE KENJI , YAMAZAKI ISAMU , ISHII YASUSHI
IPC分类号： H01L21/60
摘要： PURPOSE:To accelerate a wire bonding method by clamping a wire with a piezoelectric element, thereby reducing the weight of a bonding mechanism. CONSTITUTION:The clamping arm 10 of a wire clamping device is branched at the end side into fork shape, a piezoelectric element 12 is provided in the vicinity of the end of one branch 10A, and a clamping plate 14 is mounted at the position faced with the element 12 at the other branch 10B. When an electric field or a magnetic field is applied to the element 12, the element 12 rapidly responds thereto, and elongates longitudinally at a high speed by the electrostrictive or magnetostrictive characteristic, with the result that a wire 16 is rapidly clamped between the element 12 and the plate 14.

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