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61. 发明专利

JP4737177B2 Circuit connection structure 有权
公开(公告)号：JP4737177B2
公开(公告)日：2011-07-27
申请号：JP2007280782
申请日：2007-10-29
申请人：日立化成工業株式会社
发明人：和良小島 , 宏治小林 , 征宏有福 , 日臣望月
IPC分类号： H01L21/60 , C09J9/02 , H01B1/00 , H01B1/22 , H01R11/01 , H01R12/52
CPC分类号： H01B1/22 , C08K7/16 , C08K9/02 , C09J9/02 , C09J11/02 , H01L24/05 , H01L24/16 , H01L24/29 , H01L24/81 , H01L25/0657 , H01L2224/0401 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/29399 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01067 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/0665 , H01L2924/07811 , H01L2924/10253 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H05K3/323 , H05K3/361 , H05K2201/0221 , H01L2924/00 , H01L2924/01028 , H01L2924/01026 , H01L2924/01027 , H01L2924/3512 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： There is provided a circuit connection structure that can provide satisfactory electrical connection between opposing circuit electrodes and that can sufficiently increase the long-term reliability of electrical characteristics between circuit electrodes. A circuit connection structure 1 comprising a first circuit member 30 having a first circuit electrode 32 formed on the main side 31a of a first circuit board 31, a second circuit member 40 situated opposing the first circuit member 30 and having a second circuit electrode 42 formed on the main side 41a of a second circuit board 41, and a circuit-connecting member 10 provided between the main side of the first circuit member 30 and the main side of the second circuit member 40 and electrically connecting the first and second circuit electrodes 32, 42, characterized in that the thickness of the first and second circuit electrodes 32, 42 is at least 50 nm, the circuit-connecting member 10 is obtained by curing a circuit-connecting material containing an adhesive composition and conductive particles 12 having multiple protrusions 14 on the surface side, and the outermost layer of the conductive particles 12 is composed of nickel or a nickel alloy.

62. 发明专利

JP4714451B2 A flexible printed circuit board, and a liquid crystal display device having the same 有权
公开(公告)号：JP4714451B2
公开(公告)日：2011-06-29
申请号：JP2004299612
申请日：2004-10-14
申请人：サムスンエレクトロニクスカンパニーリミテッド
发明人：允模延
IPC分类号： G02F1/1345 , H05K1/02 , G02F1/13 , G09F9/00 , H05K1/00 , H05K3/28 , H05K3/36
CPC分类号： H05K1/028 , G02F1/13452 , H05K3/281 , H05K3/361 , H05K2201/09063 , H05K2201/0989

63. 发明专利

JP2011124332A Flexible wiring substrate 有权
标题翻译：柔性布线基板
公开(公告)号：JP2011124332A
公开(公告)日：2011-06-23
申请号：JP2009279543
申请日：2009-12-09
申请人： Hosiden Corp , ホシデン株式会社
发明人： SHINODA KOJI , NAKAGAWA HIROSHI
IPC分类号： H05K1/02 , H05K1/14
CPC分类号： H05K1/118 , H05K1/028 , H05K1/147 , H05K1/189 , H05K3/361 , H05K2201/052 , H05K2201/053 , H05K2201/055 , H05K2201/09063 , H05K2203/0195 , H05K2203/1572 , H05K2203/166 , H05K2203/167
摘要： PROBLEM TO BE SOLVED: To provide a flexible wiring substrate facilitating electrical connection of all wiring terminals respectively provided on a plurality of protruded substrate parts with corresponding electrode terminals without enlarging an electrode terminal disposing region or the protruded substrate part on a substrate for electric equipment.
SOLUTION: In the flexible wiring substrate that the plurality of protruded substrate parts 12 are extended from positions spaced apart along a peripheral edge of the wiring substrate 10 and wiring terminals 15, 16 electrically connected with the plurality of electrode terminals disposed on the substrate for electric equipment are disposed on the respective protruded substrate parts, a notched part 18 that reaches the peripheral edge 13a between the protruded substrate parts is formed in the wiring substrate at a position between the protruded substrate parts.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供柔性布线基板，便于将分别设置在多个突出的基板部分上的所有布线端子与相应的电极端子进行电连接，而不会在基板上扩大电极端子布置区域或突出的基板部分电子设备。解决方案：在柔性布线基板中，多个突出的基板部分12沿着布线基板10的周缘间隔开的位置和与设置在布线基板10上的多个电极端子电连接的布线端子15,16延伸电子设备用基板配置在各突出的基板部上，在突出的基板部之间的位置，在布线基板上形成到突出的基板部之间的周缘13a的切口部18。版权所有（C）2011，JPO＆INPIT

65. 发明专利

JP4708401B2 A method of forming a flexible interface of the semiconductor chip 有权
公开(公告)号：JP4708401B2
公开(公告)日：2011-06-22
申请号：JP2007239062
申请日：2007-09-14
申请人：テセラ・インコーポレーテッド
发明人：コヴァック，ズラク , ディステファノ，トーマス , ミッチェル，クレイグ
IPC分类号： H01L21/60 , H01L23/12 , H01L21/56 , H01L23/28 , H01L23/32 , H01L23/48 , H01L23/498 , H05K1/11 , H05K3/36 , H05K3/40
CPC分类号： H01L24/81 , H01L21/56 , H01L21/563 , H01L23/49811 , H01L23/49827 , H01L23/4985 , H01L24/72 , H01L24/75 , H01L2224/16 , H01L2224/73203 , H01L2224/73204 , H01L2224/75 , H01L2224/75301 , H01L2224/81801 , H01L2224/83136 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01033 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/15311 , H01L2924/1532 , H01L2924/16152 , H01L2924/19041 , H01L2924/19043 , H05K1/118 , H05K3/361 , H05K3/4084 , H05K2201/0133 , H05K2201/0394 , H05K2201/0397 , H05K2201/09081 , H05K2201/091 , H05K2203/063 , Y10T29/4913 , Y10T29/49144 , Y10T29/49174 , H01L2924/00014
摘要： A method of making a microelectronic assembly including a compliant interface includes providing a first support structure, such as a flexible dielectric sheet, having a first surface and a porous resilient layer on the first surface of the first support structure, stretching the first support structure and bonding the stretched first support structure to a ring structure. The first surface of a second support structure, such as a semiconductor wafer, is then abutted against the porous layer and, desirably after the abutting step, a first curable liquid is disposed between the first and second support structures and within the porous layer. The first curable liquid may then be at least partially cured.

66. 发明专利

JP4701069B2 Display-integrated type position detecting device 有权
公开(公告)号：JP4701069B2
公开(公告)日：2011-06-15
申请号：JP2005307888
申请日：2005-10-21
申请人：キヤノン株式会社
发明人：紀之識名
IPC分类号： G06F3/041 , G06F3/046 , G09G3/20 , G09G3/34
CPC分类号： H05K1/147 , G02F1/13338 , G02F1/13452 , G06F3/0412 , G06F3/046 , H05K1/117 , H05K3/361 , H05K2201/09781

67. 发明专利

JPWO2009057628A1 電子機器表示窓のタッチ入力機能付き保護パネル及び電子機器有权
公开(公告)号：JPWO2009057628A1
公开(公告)日：2011-03-10
申请号：JP2008558987
申请日：2008-10-29
申请人：日本写真印刷株式会社
发明人：楠田　康次 , 康次楠田 , 朝倉　剛 , 剛朝倉 , 好司岡本 , 好司岡本 , 岩井　俊之 , 俊之岩井
IPC分类号： G06F3/041 , B32B7/02
CPC分类号： G06F3/041 , G02F1/13338 , G06F1/1626 , G06F1/1643 , H05K3/361
摘要：透明板からなる保護パネル本体(7)と、保護パネル本体の上面に貼り合わされた下部電極シート(1)と、下部電極シートと電極(2,4)間に間隙(20)を形成して周縁部で接着された上部電極シート(3)と、上部電極シートの上面に貼り合わされた加飾シート(8)と、端部が下部電極シートと上部電極シートとの間に挿入され、熱圧着により上部回路及び下部回路の出力端と接続されたFPC(18)とを備え、さらに保護パネル本体の、FPC熱圧着部分に対応する部分に、熱圧着ヘッド挿入用空間(50)を有して下部電極シートに熱圧着用ヒーター(30)が近接可能としている。

68. 发明专利

JP2011035401A Multilayer microwave corrugated printed circuit board and method 有权
标题翻译：多层微波校正印刷电路板及方法
公开(公告)号：JP2011035401A
公开(公告)日：2011-02-17
申请号：JP2010171363
申请日：2010-07-30
申请人： Raytheon Co , レイセオンカンパニー
发明人： QUAN CLIFTON , KIM HEE KYUNG , YANG FANGCHOU , ROLSTON KEVIN C , JACKSON EDWARD MARSH
IPC分类号： H05K3/36 , H05K1/11 , H05K1/14 , H05K3/40
CPC分类号： H05K1/028 , H05K1/024 , H05K1/144 , H05K1/147 , H05K3/361 , H05K3/4069 , H05K3/4614 , H05K3/4635 , H05K2201/055 , H05K2201/058 , H05K2201/09109 , H05K2201/09318 , H05K2201/10378 , H05K2203/063 , Y10T29/49126 , Y10T29/49155
摘要： PROBLEM TO BE SOLVED: To provide a lightweight PCB assembly which provides a robust structural feature in order to satisfy a request for weight reduction. SOLUTION: In this multilayer microwave corrugated printed circuit board, a corrugated printed circuit board 100 includes an assembly 102 of a level 1, an assembly 104 of a level 2, and an assembly 106 of a level 3. The assembly 102 of the level 1 can include one or more openings, a radio frequency (RF) feed, an electronic component, and a power and communication signal. The assembly 104 of the level 2 can include an RF feed, an electronic component, and a power and communication signal. The assembly 106 of the level 3 can also includes an RF feed, an electronic component, and a power and communication signal. This method includes a step of connecting a first flexible layer and a second flexible layer to each other by a non-conductive adhesive layer arranged therebetween, and filling a first hole and a second hole with conductive paste for electrically connecting a first signal line to a second signal line. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种轻质的PCB组件，其提供了坚固的结构特征以便满足重量减轻的要求。解决方案：在这种多层微波波纹印刷电路板中，波纹印刷电路板100包括级别1的组件102，级别2的组件104和级别3的组件106.组件102 级别1可以包括一个或多个开口，射频（RF）馈送，电子组件以及电力和通信信号。级别2的组件104可以包括RF馈送，电子部件以及电力和通信信号。级别3的组件106还可以包括RF馈送，电子部件以及电力和通信信号。该方法包括通过布置在其间的非导电粘合剂层将第一柔性层和第二柔性层彼此连接的步骤，并且用导电浆料填充第一孔和第二孔，以将第一信号线电连接到第二信号线。版权所有（C）2011，JPO＆INPIT

69. 发明专利

JP4622249B2 Transparent touch panel 有权
公开(公告)号：JP4622249B2
公开(公告)日：2011-02-02
申请号：JP2004010095
申请日：2004-01-19
申请人：パナソニック株式会社
发明人：哲郎村上 , 俊晴福井 , 彰二藤井
IPC分类号： G06F3/041 , G06F3/045 , G06F3/033 , H01H13/712 , H05K3/24 , H05K3/32 , H05K3/36
CPC分类号： G06F3/041 , H05K3/245 , H05K3/323 , H05K3/361 , H05K2201/023 , H05K2201/035

70. 发明专利

JP2010272806A Electrode structure, wiring body, adhesive connection structure, electronic apparatus, and method for assembling the electronic apparatus 有权
标题翻译：电极结构，接线体，粘合连接结构，电子装置和组装电子装置的方法
公开(公告)号：JP2010272806A
公开(公告)日：2010-12-02
申请号：JP2009125462
申请日：2009-05-25
申请人： Sumitomo Electric Ind Ltd , Sumitomo Electric Printed Circuit Inc , 住友電工プリントサーキット株式会社 , 住友電気工業株式会社
发明人： YAMAMOTO MASAMICHI , NAKATSUGI KYOICHIRO , YAMAGUCHI TAKASHI , KAWAKAMI SHIGEKI , KIMURA MICHIHIRO
IPC分类号： H05K1/14 , H05K3/34 , H05K3/36
CPC分类号： H05K3/282 , H01L2924/0002 , H05K1/148 , H05K3/305 , H05K3/323 , H05K3/361 , H05K3/363 , H05K2201/0248 , H05K2201/0373 , H05K2201/083 , H05K2201/10977 , H05K2203/104 , Y10T29/49213 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an electrode structure achieving an adhesive connection structure inexpensively while simplifying a manufacturing process, and to provide a wiring body, an adhesive connection structure, etc. SOLUTION: In a connection structure C, a mother board 20 includes a rigid board 21 and an adhesive connecting electrode 22 formed on the rigid board 21. The surface of each of an electrode 12 and the electrode 22 is covered with organic films 15 and 25. The adhesive 30 includes conductive particles 36 dispersed in a resin composition 31 consisting essentially of a thermosetting resin. Electrodes 12 and 22 are in an electrical conduction state via the conductive particles 36. The organic films 15 and 25 are an antioxidation film formed by an OSP treatment and have a thermal decomposition temperature higher than the temperature in a solder reflow process. Since the organic films remain after the solder reflow, the solder connection structure and the adhesive connection structure can be formed smoothly. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决方案：提供一种廉价地实现粘合剂连接结构的电极结构，同时简化制造工艺，并提供布线体，粘合剂连接结构等。解决方案：在连接结构C中，母板20包括刚性板21和形成在刚性板21上的粘合剂连接电极22.电极12和电极22的表面被有机膜15和25覆盖。粘合剂30包括导电颗粒36 分散在基本上由热固性树脂组成的树脂组合物31中。电极12和22通过导电颗粒36处于导电状态。有机膜15和25是通过OSP处理形成的抗氧化膜，并且其热分解温度高于焊料回流工艺中的温度。由于有机膜在焊料回流之后保留，因此可以平滑地形成焊料连接结构和粘合剂连接结构。版权所有（C）2011，JPO＆INPIT

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