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61. 发明专利

JP2014110083A Light-emitting unit and lighting fixture 有权
标题翻译：发光单元和照明设备
公开(公告)号：JP2014110083A
公开(公告)日：2014-06-12
申请号：JP2012262378
申请日：2012-11-30
申请人： Panasonic Corp , パナソニック株式会社
发明人： MATSUMOTO HIROYUKI , SAKURADA TAKAHISA , OKADA TOSHIZUMI , YAMAMOTO TETSUO
IPC分类号： F21S2/00 , F21Y101/02 , H01L33/48
CPC分类号： F21S8/04 , F21Y2105/10 , F21Y2115/10 , H05K1/142 , H05K2201/09027 , H05K2201/09145 , H05K2201/10522
摘要： PROBLEM TO BE SOLVED: To provide a light-emitting unit which is constituted by arranging a first sub-unit and a second sub-unit side by side and has its luminance unevenness suppressed.SOLUTION: A light-emitting unit 10 is constituted by arranging first sub-units 13a and second sub-units 13b each of which includes a substrate 11, and a first linear light source 12a and a second linear light source 12b such that one end of the first sub-unit 13a and one end of the second sub-unit 13b are made to abut on each other. The first sub-unit 13a has, on one end edge of the substrate, a projection part 11a which projects outward more. The second sub-unit 13b has, at one end edge of the substrate 11 made to abut against on the first sub-unit 13a, a projection part 11a and a housing part 11b set back inward by a length corresponding to an extension length of the projection part 11a. Further, a first linear light source 12a is arranged on the projection part 11a of the substrate 11 of the first sub-unit 13a.
摘要翻译：要解决的问题：提供一种并排设置第一子单元和第二子单元并且抑制其亮度不均匀性的发光单元。解决方案：发光单元10通过布置第一子单元13a和第二子单元13b各自包括基板11，以及第一线性光源12a和第二线性光源12b，使得第一子单元13a的一端和第二子单元13a的一端子单元13b彼此抵接。第一子单元13a在基板的一端边缘处具有更向外突出的突出部11a。第二子单元13b在与第一子单元13a抵接的基板11的一端缘处具有向内设置的突起部11a和壳体部11b，该突起部11a和壳体部11b相对于第一子单元13a的延伸长度突出部11a。此外，在第一子单元13a的基板11的突起部11a上配置有第一线状光源12a。

62. 发明专利

JP5475135B2 Flexible printed wiring board and a method of manufacturing the same 有权
公开(公告)号：JP5475135B2
公开(公告)日：2014-04-16
申请号：JP2012526270
申请日：2010-12-07
申请人：日本メクトロン株式会社
发明人：田文彦松
IPC分类号： H05K3/00 , H05K1/02 , H05K3/46
CPC分类号： H05K1/11 , H05K1/028 , H05K1/0346 , H05K1/118 , H05K1/142 , H05K3/0097 , H05K3/36 , H05K3/361 , H05K2201/052

63. 发明专利

JP5414676B2 Multiple hf micro-contact structure 有权
公开(公告)号：JP5414676B2
公开(公告)日：2014-02-12
申请号：JP2010524368
申请日：2008-08-11
申请人：ローゼンベルガーホーフフレクベンツテクニークゲーエムベーハーウントツェーオーカーゲー
发明人：ローゼンベルガーベルント
IPC分类号： H05K1/14 , H01R12/52
CPC分类号： H01P5/08 , H01R12/7082 , H01R13/112 , H01R13/6658 , H01R24/50 , H05K1/142

64. 发明专利

JP5366688B2 Socket, the substrate assembly and the apparatus including the same 有权
标题翻译：空值
公开(公告)号：JP5366688B2
公开(公告)日：2013-12-11
申请号：JP2009167598
申请日：2009-07-16
申请人：日本航空電子工業株式会社
发明人：秀千菅野 , 善明石山
IPC分类号： H01R33/76 , H01L33/00 , H01R27/00 , H01R33/74
CPC分类号： H05K1/142 , F21V23/06 , F21Y2103/10 , F21Y2115/10 , H01R13/6658 , H01R27/02 , H05K1/182 , H05K3/222 , H05K3/368 , H05K2201/10106 , H05K2201/10189 , H05K2201/10325
摘要： An apparatus has a plurality of types of plugs used for different purposes and a plurality of circuit board assemblies. Each of the plurality of the circuit board assemblies includes a circuit board having a plurality of wiring portions formed thereon, an electrical and electronic part mounted on the circuit board, and a plurality of sockets attached to the circuit board and connected to the electrical and electronic part via the plurality of wiring portions. The sockets included in all of the plurality of circuit board assemblies have the same shape and are configured to receive any of the plurality of types of plugs,
摘要翻译：一种装置具有用于不同目的的多种类型的插头和多个电路板组件。多个电路板组件中的每一个包括电路板，其上形成有多个布线部分，安装在电路板上的电气和电子部件以及连接到电路板并连接到电气和电子部件的多个插座部分经由多个布线部分。包括在所有多个电路板组件中的插座具有相同的形状，并且被配置为接收多种类型的插头中的任何一种，

65. 发明专利

JP2013229276A Relay connector, module, and lighting apparatus 审中-公开
标题翻译：继电器连接器，模块和照明设备
公开(公告)号：JP2013229276A
公开(公告)日：2013-11-07
申请号：JP2012137652
申请日：2012-06-19
申请人： Toshiba Lighting & Technology Corp , 東芝ライテック株式会社
发明人： WATANABE HIROYUKI , OSADA TAKESHI
IPC分类号： H01R12/52 , F21S2/00 , F21S8/04 , F21V19/00 , F21V23/06 , F21Y101/02 , F21Y105/00 , H01R31/06 , H01R33/06
CPC分类号： F21V23/06 , F21V21/005 , F21Y2115/10 , H01R31/06 , H05K1/142 , H05K3/325 , H05K3/368 , H05K2201/10106 , H05K2201/10189
摘要： PROBLEM TO BE SOLVED: To provide a relay connector that can position a location toward a direction in which two circuit boards come close, and can connect between input connectors without inflicting a burden on the input connectors even if there is dimensional tolerance of the circuit boards and a variation of implementation positions of the input connectors.SOLUTION: A relay connector 23 connects between two input connectors 22 mounted on respective implementation surfaces 21a of two circuit boards 21 ends of which are placed facing each other. The relay connector 23 includes a relay connector body 41 and a relay terminal 42. The relay connector body 41 includes a circuit board regulation unit 45 which is interposed between the two circuit boards 21 to make contact with the ends of the two circuit boards 21, and forms a gap between the ends of the two circuit boards 21. The relay terminal 42 projects from both ends of the relay connector body 41, and is connected with the input connectors 22.
摘要翻译：要解决的问题：提供一种可以将位置朝向两个电路板接近的方向定位的中继连接器，并且可以在输入连接器之间连接，而不会对输入连接器造成负担，即使电路板的尺寸公差以及输入连接器的实施位置的变化。解决方案：中继连接器23连接在两个输入连接器22之间，两个输入连接器22安装在两个彼此相对放置的电路板21的相应的实施表面21a上。继电器连接器23包括中继连接器主体41和中继端子42.中继连接器主体41包括电路板调节单元45，该电路板调节单元45插入在两个电路板21之间以与两个电路板21的端部接触，并且在两个电路板21的端部之间形成间隙。继电器端子42从中继连接器主体41的两端突出，并与输入连接器22连接。

66. 发明专利

JP5310743B2 Method of manufacturing electronic components 有权
公开(公告)号：JP5310743B2
公开(公告)日：2013-10-09
申请号：JP2010543960
申请日：2009-10-15
申请人：富士通株式会社
发明人：正孝水越 , 義克石月
IPC分类号： H05K3/46 , H05K3/20 , H05K3/22
CPC分类号： H05K3/20 , H01L24/16 , H01L24/32 , H01L24/81 , H01L24/83 , H01L2224/10175 , H01L2224/131 , H01L2224/16237 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/81001 , H01L2224/81191 , H01L2224/81192 , H01L2224/81193 , H01L2224/83193 , H01L2224/838 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01073 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/12042 , H01L2924/1517 , H01L2924/15788 , H01L2924/1579 , H05K1/142 , H05K3/4658 , H05K3/4694 , H05K2201/0108 , H05K2201/0352 , H05K2201/09972 , H05K2203/025 , H05K2203/1189 , Y10T29/49117 , Y10T156/1052 , Y10T428/24917 , H01L2924/00 , H01L2924/01047 , H01L2924/01083 , H01L2924/3512 , H01L2924/00014 , H01L2224/16225
摘要： [Problems] In an electronic component and a method of manufacturing the same, forming a finer conductive pattern than conventional counterpart [Means of Solving] A method of manufacturing an electronic component includes the steps of forming a resin layer over an underlying layer, pressing a conductor plate including a pattern formed on one major surface thereof against the resin layer, and embedding the pattern in the resin layer, and performing polishing, Chemical Mechanical Polishing, or cutting by the use of a diamond bit on another major surface of the conductor plate until the resin layer appears, and leaving the pattern in the resin layer as a conductor pattern.

67. 发明专利

JP2013122757A Solid state drive assembly 审中-公开
标题翻译：固态驱动装置
公开(公告)号：JP2013122757A
公开(公告)日：2013-06-20
申请号：JP2012265045
申请日：2012-12-04
申请人： Kofukin Seimitsu Kogyo (Shenzhen) Yugenkoshi , 鴻富錦精密工業(深▲セン▼)有限公司 , Hon Hai Precision Industry Co Ltd , 鴻海精密工業股▲ふん▼有限公司
发明人： YIN XIAO-GANG , HA WUI-MIN , CHEN GUO-YI
IPC分类号： G06F3/00
CPC分类号： G06F1/185 , G06F1/189 , H01R12/716 , H01R12/721 , H01R12/732 , H05K1/117 , H05K1/142 , H05K3/3405 , H05K3/366 , H05K2201/10159 , H05K2201/10189
摘要： PROBLEM TO BE SOLVED: To provide a solid state drive assembly that can expand a storage memory at low cost.SOLUTION: In a solid state drive assembly, a first storage device interface is connected to a second storage device interface and a control chip, a mother board transmits a hard disk control signal to the control chip, the control chip is connected to a first storage chip and controls and stores the first storage chip with the hard disk control signal, a bottom of a first plate body has a first edge connector, a first power source pin is connected to the control chip and the first storage chip, a top of the first plate body has a second edge connector, a second power source pin is connected to the first power source pin, a first signal pin is connected to the control chip, a bottom of a second plate body has a third edge connector, and a third power source pin and a second signal pin are connected to a second storage chip.
摘要翻译：要解决的问题：提供可以以低成本扩展存储存储器的固态驱动组件。解决方案：在固态驱动器组件中，第一存储设备接口连接到第二存储设备接口和控制芯片，母板向控制芯片发送硬盘控制信号，控制芯片连接到第一存储芯片，并且控制并存储具有硬盘控制信号的第一存储芯片，第一板体的底部具有第一边缘连接器，第一电源引脚连接到控制芯片和第一存储芯片，第一板体的顶部具有第二边缘连接器，第二电源引脚连接到第一电源引脚，第一信号引脚连接到控制芯片，第二板体的底部具有第三边缘连接器，并且第三电源引脚和第二信号引脚连接到第二存储芯片。版权所有（C）2013，JPO＆INPIT

68. 发明专利

JP2013098526A Package substrate in which via hole intermediate layer is embedded and manufacturing method thereof 审中-公开
标题翻译：通过孔中间层的封装基板被嵌入并制造其方法
公开(公告)号：JP2013098526A
公开(公告)日：2013-05-20
申请号：JP2012011761
申请日：2012-01-24
申请人： Kinko Denshi Kofun Yugenkoshi , 欣興電子股▲フン▼有限公司
发明人： KO TEKIGUN , SO SHISHO
IPC分类号： H01L23/12
CPC分类号： H05K3/4038 , H01L21/4846 , H01L21/76898 , H01L23/147 , H01L23/15 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L2224/131 , H01L2224/16225 , H01L2224/16237 , H01L2224/32225 , H01L2224/73204 , H01L2924/00014 , H01L2924/014 , H01L2924/15311 , H05K1/11 , H05K1/112 , H05K1/142 , H05K1/183 , H05K2201/10674 , Y10T29/4913 , Y10T29/49146 , Y10T29/49165
摘要： PROBLEM TO BE SOLVED: To provide a package substrate in which a via hole intermediate layer is embedded and a manufacturing method thereof.SOLUTION: A package substrate in which a via hole intermediate layer is embedded comprises: a mold seal layer 22; a via hole intermediate layer 20 embedded in the mold seal layer and having a plurality of conductive via holes 200; a re-wiring layer 21 embedded in the mold seal layer, provided in the via hole intermediate layer, and electrically connected to one end surface of the conductive via hole; and a build-up structure 23 provided in the mold seal layer and the via hole intermediate layer and electrically connected to the other end surface of the conductive via hole. Embedding the via hole intermediate layer in the mold seal layer causes the re-wiring layer to be electrically connected to an electrode pad of a relatively small semiconductor chip and the other end to be electrically connected to a conductive blind via hole of a relatively large build-up structure. This connection also causes a package substrate 2 to be connected to a semiconductor chip having a high wiring density.
摘要翻译：要解决的问题：提供嵌入通孔中间层的封装基板及其制造方法。解决方案：嵌入通孔中间层的封装基板包括：模具密封层22; 通孔中间层20，其嵌入在模密封层中并具有多个导电通孔200; 嵌入到所述模具密封层中的再布线层21，设置在所述通孔中间层中，并且电连接到所述导电通孔的一个端面; 以及设置在模具密封层和通孔中间层中并且电连接到导电通孔的另一端面的堆积结构23。将通孔中间层嵌入到模具密封层中使得再布线层电连接到相对较小的半导体芯片的电极焊盘，并且另一端电连接到具有较大构造的导电盲孔结构。该连接还使得封装基板2连接到具有高布线密度的半导体芯片。版权所有（C）2013，JPO＆INPIT

69. 发明专利

JPWO2011067989A1 照明装置および表示装置有权
公开(公告)号：JPWO2011067989A1
公开(公告)日：2013-04-18
申请号：JP2011544218
申请日：2010-10-18
申请人：シャープ株式会社
发明人：真之助野澤 , 真之助野澤
IPC分类号： F21S2/00 , F21V23/06 , G02F1/133 , G02F1/13357
CPC分类号： G09F19/22 , G02F1/1336 , G02F1/133603 , G02F1/133608 , G09F9/33 , H05K1/029 , H05K1/142
摘要： LEDのような光源を搭載する部材の変位を押さえるとともに、その部材を小型にし、ひいては小型化を達成した照明装置等を提供するために、バックライトユニット49にて、少なくとも1つの実装基板11が、基板面にて交差する2方向に移動させられる場合、隣り合う別の1つの実装基板11に接触して制止されるように、隣り合う両方の実装基板11の形状を形成して、その形状の種類を複数設けた。【選択図】図1

70. 发明专利

JP5183436B2 Functional panel and the joining method that 有权
公开(公告)号：JP5183436B2
公开(公告)日：2013-04-17
申请号：JP2008297609
申请日：2008-11-21
申请人：株式会社日立製作所
发明人：貴彦澤田 , 博青山
IPC分类号： B60R16/02
CPC分类号： H05K1/0366 , B29C70/202 , B29C70/865 , B29K2707/04 , H05K1/142 , H05K3/403 , H05K2201/0323 , H05K2201/09118 , H05K2201/10287

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