专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

61. 发明专利

JP2013531689A Mobile phone antenna pattern printing ink, cell phone synthetic resin component in which the method and the antenna pattern is printed antenna pattern to produce a printed mobile phone synthetic resin component by use of the ink 审中-公开
公开(公告)号：JP2013531689A
公开(公告)日：2013-08-08
申请号：JP2013502443
申请日：2010-07-05
申请人：ヨンアンテクノロジーカンパニーリミテッド , モビテークコーポレーション
发明人：イ，キュン−スク , パク，セ−ヨン , イム，チョル−アン , キム，ビョン−ナム
IPC分类号： C09D11/00 , H01B1/22 , H05K3/12
CPC分类号： H01Q1/38 , C08K3/08 , C09D5/24 , C09D7/61 , C09D11/102 , H01B1/02 , H01Q1/243 , H05K1/092 , H05K1/165 , H05K3/1275 , H05K2203/0534
摘要： The ink for printing an antenna pattern for a mobile phone according to an embodiment of the present invention includes a mixture of one of silver (Ag) powder, nickel (Ni) powder, copper (Cu) powder, and gold (Au) powder, liquid acrylonitrile, liquid polystyrene, liquid butadiene, and methyl ethyl ketone (MEK) as a diluent. The present invention does not include a plating process, and thus allows a significant improvement in productivity.

62. 发明专利

JP2013153121A Multilayer wiring board and method of manufacturing the same 有权
标题翻译：多层接线板及其制造方法
公开(公告)号：JP2013153121A
公开(公告)日：2013-08-08
申请号：JP2012128574
申请日：2012-06-06
申请人： Panasonic Corp , パナソニック株式会社
发明人： IWASAKI AKIHITO , NAKAMURA SADASHI , HIMORI GOJI , HONJO KAZUHIKO
IPC分类号： H05K3/46 , H05K1/11 , H05K3/40
CPC分类号： H05K1/115 , H05K1/036 , H05K1/0366 , H05K1/092 , H05K3/00 , H05K3/0047 , H05K3/4069 , H05K3/4614 , H05K2201/0141 , H05K2201/0154 , H05K2201/0269 , H05K2201/0272 , H05K2201/0305 , H05K2203/0214 , H05K2203/0278 , H05K2203/1461 , Y10T29/49162
摘要： PROBLEM TO BE SOLVED: To reduce a via-hole resistance, and increase the strength of a via-hole part in a multilayer wiring board in which a conductive paste having copper powder and solder powder is used for a via-hole conductor.SOLUTION: The multilayer wiring board 110 has: an electrically insulative base material 130 composed of an incompressible member; a plurality of wiring lines 120; and a via-hole conductor 140. The via-hole conductor 140 comprises: a resin part 200; and a metal part 190 including at least a first metal region 160 consisting primarily of copper, a second metal region 170 consisting primarily of a tin-copper alloy, and a third metal region 180 consisting primarily of bismuth. The second metal region 170 is larger than a discrete piece of the first metal region 160 and a discrete piece of the third metal region 180; in the second metal region 170, such pieces of the first and third metal regions 160 and 180 are sprinkled so as not to be in contact with one another. The second metal region 170 contains an intermetallic compound CuSnand an intermetallic compound CuSn; the ratio of CuSn/CuSn is 0.10 or less.
摘要翻译：要解决的问题：为了减少通孔电阻，并且增加了具有铜粉末和焊料粉末的导电浆料用于通孔导体的多层线路板中的通路孔部分的强度。解决方案：多层布线板110具有：由不可压缩构件构成的电绝缘基材130; 多条布线120; 和通孔导体140.通孔导体140包括：树脂部分200; 以及金属部件190，其至少包括主要由铜组成的第一金属区域160，主要由锡 - 铜合金组成的第二金属区域170和主要由铋组成的第三金属区域180。第二金属区域170大于第一金属区域160的分立件和第三金属区域180的分立件; 在第二金属区域170中，第一金属区域160和第三金属区域180的这些块被喷洒以不彼此接触。第二金属区域170包含金属间化合物CuSn和金属间化合物CuSn; CuSn / CuSn的比例为0.10以下。

63. 发明专利

JP5218709B1 Ink receiving layer forming resin composition and the ink receptive substrate obtained therewith, printed matter and the conductive pattern 有权
公开(公告)号：JP5218709B1
公开(公告)日：2013-06-26
申请号：JP2012547199
申请日：2012-07-04
申请人： Dic株式会社
发明人：公恵斉藤 , 亘冨士川 , 潤白髪
IPC分类号： B41M5/00 , B41J2/01 , B41M5/50 , B41M5/52
CPC分类号： H05K1/092 , B41M5/52 , B41M5/5218 , B41M5/5227 , B41M5/5245 , B41M5/5254 , C08F220/06 , C08F220/18 , C08K3/013 , C08K3/36 , C09D133/08 , C09D133/12 , H05K3/1283 , Y10T428/24802 , C08F2220/1825 , C08F220/14 , C08F220/58 , C08F2220/1808 , C08L33/08
摘要： The present invention addresses the problem of providing a resin composition for forming an ink-receiving layer that is capable of forming print images having excellent printability and water resistance with use of an aqueous ink or a solvent-borne ink. The present invention is a resin composition for forming an ink-receiving layer, which contains a binder resin (A) that has a weight average molecular weight of 100,000 or more and an acid value of 90-450, an aqueous medium (B), and if necessary, a component (C) that is composed of one or more materials selected from the group consisting of water-soluble resins (c1) and inorganic fillers (c2). The resin composition for forming an ink-receiving layer is characterized in that: the binder resin (A) is dispersed in the aqueous medium (B); and the content of the component (C) relative to the total mass of the binder resin (A) is from 0% by mass to 15% by mass.

64. 发明专利

JP5212364B2 Process for producing a conductive material, a conductive material obtained by the method, an electronic apparatus including the conductive material, the light emitting device, the light emitting device manufacturing method 有权
公开(公告)号：JP5212364B2
公开(公告)日：2013-06-19
申请号：JP2009512355
申请日：2009-01-09
申请人：日亜化学工業株式会社
发明人：雅史蔵本 , 悟小川 , 克昭菅沼 , 槿銖金
IPC分类号： H01B13/00 , H01B1/02 , H01L33/62 , H05K1/09 , H05K3/12 , H05K3/32
CPC分类号： H01L33/62 , B23K1/0008 , B23K1/0016 , B23K35/025 , H01B1/02 , H01L2924/0002 , H01L2933/0066 , H05K1/092 , Y10T29/49144 , H01L2924/00
摘要： An object of the present invention is to provide a method for producing a conductive material that allows a low electric resistance to be generated, and that is obtained by using an inexpensive and stable conductive material composition containing no adhesive. The conductive material can be provided by a producing method that includes the step of sintering a first conductive material composition that contains silver particles having an average particle diameter (median diameter) of 0.1 µm to 15 µm, and a metal oxide, so as to obtain a conductive material. The conductive material can be provided also by a method that includes the step of sintering a second conductive material composition that contains silver particles having an average particle diameter (median diameter) of 0.1 µm to 15 µm in an atmosphere of oxygen or ozone, or ambient atmosphere, at a temperature in a range of 150°C to 320°C, so as to obtain a conductive material.

65. 发明专利

JP2013105605A Copper particulate dispersion liquid, conductive film forming method and circuit board 有权
标题翻译：铜颗粒分散液，导电膜形成方法和电路板
公开(公告)号：JP2013105605A
公开(公告)日：2013-05-30
申请号：JP2011248127
申请日：2011-11-14
申请人： Ishihara Chem Co Ltd , 石原薬品株式会社 , Applied Nanotech Holdings Inc , アプライド・ナノテック・ホールディングス・インコーポレーテッド
发明人： KAWATO YUICHI , MAEDA YUSUKE , KUDO TOMIO
IPC分类号： H01B1/22 , B22F1/02 , B22F9/00 , B82Y30/00 , H01B5/14 , H01B13/00 , H05K3/10
CPC分类号： C09D11/52 , C09D11/03 , C09D11/38 , H01B1/026 , H01B1/22 , H01L23/49883 , H01L2924/0002 , H05K1/092 , H05K1/095 , H05K1/097 , H05K2203/0514 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a copper particulate dispersion liquid suitable for discharging as a droplet.SOLUTION: A copper particulate dispersion liquid comprises: copper particulates; at least one type of a dispersant containing the copper particulates; and at least one type of a dispersant in which copper particulates are dispersed in the dispersant. Each of the copper particulates has a center particle diameter of 1 nm or more to less than 100 nm. The dispersant is a polar dispersant having a boiling point within a range of 150 to 250°C. Thereby, when the copper particulate dispersion liquid is discharged as droplets, clogging in a discharging part due to drying of the dispersion medium is prevented, so as to be suitable for discharging as droplets since the viscosity is low compared to high boiling point.
摘要翻译：要解决的问题：提供适合作为液滴排出的铜微粒分散液。铜颗粒分散液包括：铜颗粒; 至少一种含有铜颗粒的分散剂; 和分散剂中分散有铜颗粒的至少一种分散剂。每个铜微粒具有1nm以上至小于100nm的中心粒径。分散剂是沸点在150-250℃范围内的极性分散剂。因此，当铜微粒分散液作为液滴排出时，由于粘度低于高沸点，所以防止由于分散介质的干燥导致的排出部分的堵塞，从而适合作为液滴的排出。版权所有（C）2013，JPO＆INPIT

66. 发明专利

JPWO2011089795A1 配線板及びその製造方法审中-公开
公开(公告)号：JPWO2011089795A1
公开(公告)日：2013-05-20
申请号：JP2011550806
申请日：2010-12-10
申请人：イビデン株式会社
发明人：伸幸長沼 , 伸幸長沼 , 通昌高橋 , 通昌高橋 , 雅一青山 , 雅一青山
IPC分类号： H05K3/46
CPC分类号： H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L23/5383 , H05K1/0298 , H05K1/092 , H05K1/116 , H05K1/18 , H05K3/0011 , H05K3/0094 , H05K3/4069 , H05K3/4611 , H05K3/4623 , H05K2201/09545 , H05K2201/09563 , H05K2201/096 , H05K2201/09854 , Y10T156/1056
摘要：配線板(100)が、第1面から第2面に向かって順に積層される第1絶縁層(10a)、第2絶縁層(20a)、及び第3絶縁層(30a)と、第1絶縁層(10a)を貫通する第1孔(13a)にめっきが充填されてなる第1導体(13)と、第2絶縁層(20a)を貫通する第2孔(21a)に導電性ペーストが充填されてなる第2導体(21)と、第3絶縁層(30a)を貫通する第3孔(33a)にめっきが充填されてなる第3導体(33)と、を有する。そして、第1導体(13)、第2導体(21)、及び第3導体(33)が、同軸上に配置され、互いに導通している。

67. 发明专利

JP2013507772A Electrode and a method of manufacturing the same, including the oxidation resistance boron oxide layer 审中-公开
标题翻译：空值
公开(公告)号：JP2013507772A
公开(公告)日：2013-03-04
申请号：JP2012533265
申请日：2010-10-06
申请人：イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーE.I.Du Pont De Nemours And Company
发明人：正勝黒木
IPC分类号： H01L21/288 , C01B35/10 , G03F7/004 , G03F7/028 , G03F7/40 , H01B5/14 , H01B13/00 , H01L21/283 , H05K1/09 , H05K3/12 , H05K3/28
CPC分类号： H01B1/22 , G03F7/0047 , G03F7/027 , H01J9/02 , H01J2211/225 , H01J2211/40 , H05K1/092 , H05K3/282 , H05K2203/1126
摘要：ここで開示されているのは、銅、ニッケル、鉄、コバルト、チタン、鉛、アルミニウム、スズおよびこれらの金属の１つを主成分として含む合金からなる群から選択される導電性構成成分を含む導電層と、酸化ホウ素を含む酸化保護層とを含む電極であって、前記酸化保護層が導電層の上面を被覆するかまたは導電層の上面および側面の両方を被覆するかまたは導電層が形成されている全ての場所を被覆する電極であって；導電層および酸化保護層を同時に空気焼成することによって形成される電極である。
摘要翻译：公开了一种电极，包括含有选自铜，镍，铁，钴，钛，铅，铝，锡的导电组分的导电层，以及包含这些金属作为其主要成分的合金的导电层，以及包含氧化硼的氧化保护层，所述氧化保护层覆盖导电层的顶表面，或覆盖导电层的顶表面和侧面，或覆盖形成导电层的所有位置; 电极通过空气同时烧制导电层和氧化保护层而形成。

68. 发明专利

JP5139659B2 Silver particle composite powder and its manufacturing method 有权
公开(公告)号：JP5139659B2
公开(公告)日：2013-02-06
申请号：JP2006263362
申请日：2006-09-27
申请人： Dowaエレクトロニクス株式会社
发明人：孝造尾木 , 穣久枝
IPC分类号： B22F1/02 , B22F1/00 , B22F9/24 , C09C1/62 , C09C3/08 , C09D1/00 , C09D5/24 , H01B1/22 , H01B5/00 , H01B13/00 , H01L21/28 , H01L21/288
CPC分类号： H01B1/22 , B22F1/0022 , B22F1/0062 , B22F9/24 , B22F2998/00 , B82Y30/00 , C01P2002/88 , C01P2004/04 , C01P2004/64 , C01P2006/32 , C01P2006/40 , C08K3/08 , C08K9/04 , C09C1/62 , C09C3/08 , C09D5/24 , C09D7/62 , C09D7/67 , H01B1/02 , H05K1/092
摘要： A silver particle composite powder produced by mixing a silver particle powder (A) which bears on the surface of each silver particle, an organic protective layer comprising an amine compound having at least one unsaturated bond in one molecule and having a molecular weight of from 100 to 1000, and has a mean particle diameter D TEM , as determined by TEM, of at most 50 nm and a silver particle powder (B) which bears on the surface of each silver particle, an organic protective layer comprising a fatty acid having a molecular weight of from 100 to 1000 and an amine compound having a molecular weight of from 100 to 1000 with at least any one of the fatty acid and the amine compound having at least one unsaturated bond in one molecule, and has a mean particle diameter D TEM of at most 50 nm, in a blend ratio by mass, A/B of from 3/1 to 1/3 in terms of silver.

69. 发明专利

JP5088761B1 Copper fine particle dispersion, the conductive film forming method and a circuit board 有权
公开(公告)号：JP5088761B1
公开(公告)日：2012-12-05
申请号：JP2011248127
申请日：2011-11-14
申请人：石原薬品株式会社 , アプライド・ナノテック・ホールディングス・インコーポレーテッド
发明人：祐一川戸 , 祐介前田 , 富雄工藤
IPC分类号： B22F9/00 , B82Y30/00 , H01B1/22 , H01B13/00 , H05K1/09 , H05K3/12
CPC分类号： C09D11/52 , C09D11/03 , C09D11/38 , H01B1/026 , H01B1/22 , H01L23/49883 , H01L2924/0002 , H05K1/092 , H05K1/095 , H05K1/097 , H05K2203/0514 , H01L2924/00
摘要：【課題】液滴としての吐出に好適な銅微粒子分散液を提供する。
【解決手段】銅微粒子分散液は、銅微粒子と、この銅微粒子を含有する少なくとも１種の分散媒と、この銅微粒子を前記分散媒中で分散させる少なくとも１種の分散剤とを有する。銅微粒子は、中心粒子径が１ｎｍ以上１００ｎｍ未満である。分散媒は、１５０℃乃至２５０℃の範囲内の沸点を有する極性分散媒である。これにより、銅微粒子分散液は、液滴として吐出する場合、分散媒の乾燥による吐出部分の詰まりが防がれ、沸点が高い割に粘度が低く、液滴としての吐出に適する。
【選択図】なし

70. 发明专利

JP2012227505A Transparent conductive circuit board and manufacturing method of the same 有权
标题翻译：透明导电电路板及其制造方法
公开(公告)号：JP2012227505A
公开(公告)日：2012-11-15
申请号：JP2011233034
申请日：2011-10-24
申请人： Polychem Uv Eb Internatl Corp , 瑞化股▲ふん▼有限公司
发明人： YANG YUNG-SHU
IPC分类号： H05K3/12
CPC分类号： H05K3/1258 , C08G2261/3223 , C08G2261/51 , C08G2261/794 , C08L65/00 , C09D11/00 , H05K1/03 , H05K1/092 , H05K2201/0108
摘要： PROBLEM TO BE SOLVED: To provide a transparent conductive circuit board which improves the uniformity and the resolution of the transparent conductive circuit, achieves high manufacturing speed, and suppresses the manufacturing cost, and to provide a manufacturing method of the transparent conductive circuit board.SOLUTION: A transparent conductive circuit board includes: a substrate 10; a transparent ink layer 20 adhered to a conduction unwanted region on a surface of the substrate 10 and having characteristics absorbing a conductive polymer liquid; and a conductive layer 30 covering the ink layer 20 and a region of the surface of the substrate 10, which is not covered by an ink and needs to have the conductivity, and formed by a conductive polymer coating. The conductive polymer coating contains an intrinsic conductive polymer and increases an electric resistance value in a region of the conductive layer 30, which is laminated on the ink layer 20, to form a non-conductive region 301. Then, a conductive circuit 11 having the conductivity is formed in a region of the conductive layer 30 which is not laminated on the ink layer 20.
摘要翻译：要解决的问题：提供一种透明导电电路板，其提高透明导电电路的均匀性和分辨率，实现高制造速度，并且抑制制造成本，并且提供透明导电电路的制造方法板。透明导电电路板包括：基板10; 粘附到基板10的表面上的导电不需要区域并具有吸收导电聚合物液体的特性的透明油墨层20; 以及覆盖油墨层20的导电层30和不被油墨覆盖并且需要具有导电性并由导电聚合物涂层形成的基板10的表面的区域。导电聚合物涂层含有本征导电聚合物，并且增加层压在油墨层20上的导电层30的区域中的电阻值，以形成非导电区域301.然后，具有电导率形成在导电层30的不层压在墨层20上的区域中。（C）2013，JPO＆INPIT

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式