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61. 发明专利

JPS6197914A Charged particle beam lithography equipment 失效
标题翻译：充电颗粒光束光刻设备
公开(公告)号：JPS6197914A
公开(公告)日：1986-05-16
申请号：JP21845984
申请日：1984-10-19
申请人： Hitachi Ltd
发明人： MORITA MITSUHIRO , NAKAGAWA KIYOSHI
IPC分类号： H01J37/305 , H01L21/027 , H01L21/30
CPC分类号： H01L21/30
摘要： PURPOSE:To improve a shape and the length accuracy by controlling the intensity of a charged particle beam through connecting this detector with a controlling power source of a charged particle beam source after providing a charged particle beam detector in a position corresponding to a charged particle beam in an origin reset position of a table. CONSTITUTION:As an XY table 15 is certainly moved to an origin position when a wafer 1 is mounted before electron beam drawing, a detector 19 is set in a projecting position of an electron beam and a current of an electron beam A is detected here. This detected signal is input in a controlling power source 14, where a supply electric power to an electron gun 3 is feedback-controlled so that a current becomes the prede termined value according to the detected signal. After the electron beam A is controlled within the range of a proper current value, the XY table 15 starts a step movement to the direction of X and Y, and a pattern corresponding to plural chips is drawn in an electron beam resist on the wafer 1 by scanning of the electron beam A. As detecting a charged particle beam by the detector 13 certainly done every completion of drawing in a substrate, therefore, the stabilization of the changed particle beam is achieved and the pattern drawing of high length accuracy is realized.
摘要翻译：目的：通过在带电粒子束源的控制电源之后，通过将带电粒子束的控制电源连接到带电粒子束的位置，通过控制带电粒子束的强度来提高形状和长度精度，在表的原点复位位置。构成：当在电子束拉制之前安装晶片1时，XY台15肯定移动到原始位置，检测器19被设置在电子束的突出位置，并且这里检测电子束A的电流。该检测信号被输入到控制电源14中，其中对电子枪3的供电电力被反馈控制，使得电流根据检测到的信号变为预定值。在电子束A被控制在适当电流值的范围内之后，XY工作台15开始向X和Y的方向的步进移动，并且在晶片1上的电子束抗蚀剂中绘出与多个芯片对应的图案通过扫描电子束A.由于检测器13中检测到的带电粒子束在衬底中每次完成绘图都可以确定，所以实现了改变的粒子束的稳定化，并实现了高长度精度的图形绘制。

62. 发明专利

JPS6197509A Inspecting device 失效
标题翻译：检查设备
公开(公告)号：JPS6197509A
公开(公告)日：1986-05-16
申请号：JP21846984
申请日：1984-10-19
申请人： Hitachi Ltd
发明人： MORITA MITSUHIRO
IPC分类号： G01B15/00 , G01N23/225 , G01R31/302 , H01J37/28 , H01L21/66
CPC分类号： G01B15/00
摘要： PURPOSE:To enable the inspection of an object to be inspected efficiently at a high accuracy from the slant way without tilting it, by providing at least one inclined electron beam source on the object being inspected in addition to an electron beam source having a vertical axis with the axis thereof vertical to the object being inspected. CONSTITUTION:Secondary electron detectors R and L are provided above an X-Y table 1 slantly with respect to the table 1 and the amount of secondary electrons 9 generated from the surface of a wafer 2 by an electron beam 8 irradiated on the surface of the wafer 2 from an electron beam source A is converted into an electrical signal to be detected. Here, as there is a deviation caused in the spatial distribution of secondary electrons generated with the irradiation of the beam 2 at the corner of a pattern 21 formed on the surface of the wafer 2, causing a variation in the amount of electron beams 9 detected with the detectors R and L and the variation detection value is converted into image signal or the like, for instance, at a signal processing section 10 to be fed to a display section 11. Thus, a measuring person is enabled to recognize the dimensions or the like of the pattern 21.
摘要翻译：目的：为了能够从倾斜的方式高精度地检查要检查的物体，而不倾斜，除了具有垂直轴线的电子束源之外，通过在被检查物体上提供至少一个倾斜电子束源其轴线垂直于被检查物体。构成：二次电子检测器R和L相对于工作台1倾斜地设置在XY工作台1的上方，并且通过照射在晶片2的表面上的电子束8从晶片2的表面产生的二次电子量从电子束源A转换成要检测的电信号。这里，由于在形成在晶片2的表面上的图案21的角部处的光束2的照射产生的二次电子的空间分布引起的偏差，导致检测到的电子束9的量的变化检测器R和L以及变化检测值例如在信号处理部分10处被转换为图像信号等，以被馈送到显示部分11.因此，测量人员能够识别尺寸或图案21的类似物。

63. 发明专利

JPS6097623A EXPOSURE DEVICE 失效
公开(公告)号：JPS6097623A
公开(公告)日：1985-05-31
申请号：JP20480483
申请日：1983-11-02
申请人： HITACHI LTD
发明人： MORITA MITSUHIRO , KOMORIYA SUSUMU
IPC分类号： G03F9/00 , H01L21/027 , H01L21/30
摘要： PURPOSE:To align patterns of a large number of photo-masks in the same manner, and to improve the accuracy of superposition of the patterns in photolithography technique by exposing patterns corresponding to a reference mask at 1:1 onto photo-mask substrates. CONSTITUTION:Alignment marks A1 formed to a reference mask 6 to which a pattern is shaped previously and marks A2 in a reticle 12 are detected by an alignment sensor 32, a reticle finely-movable base 11 is moved so that the marks A2 and the marks A1 satisfy the predetermined relationship of coincidence, and an imaging pattern of the reticle 12 and an optical system detecting a pattern of the reference mask 6 are set to the relationship of complete correspondence. When the position of a stage 3 integrally mounted onto an X-Y table 1 on the basis of a chip pattern of the reference mask 6 is controlled by a control section 34, a pattern exposed onto a photo-mask substrate 5 has relationship positively opposed to the pattern of the reference mask 6, and a series of photo-masks not displaced completely can be obtained.

64. 发明专利

JPS6063928A CONTACT EXPOSURE DEVICE 失效
公开(公告)号：JPS6063928A
公开(公告)日：1985-04-12
申请号：JP13715484
申请日：1984-07-04
申请人： HITACHI LTD
发明人： KOMORIYA SUSUMU , MORITA MITSUHIRO , NISHIZUKA HIROSHI , MAEJIMA HIROSHI
IPC分类号： G03F9/00 , G03F7/20 , H01L21/027 , H01L21/30
摘要： PURPOSE:To enable the accurate control of the amount of bending of a mask exposure by a method wherein the titled device is equipped with a position control mechanism to make the mask abut against or close to a plate object to be processed and an atmospheric pressure control mechanism to control the difference in atmospheric pressures between both surfaces. CONSTITUTION:A wafer 33 is held by adsorption by means of pipes 35 and 37 and a wafer chuck 32 drawn in vacuum V. Next, the mask 11 and a mask holer 10 are fixed by adsorption in vacuum V via pipes 8 and 9. A wafer 33 on the chuck 32 is made to abut against the mask 11 by control of the supply pressure of an air chamber 25 by setting the initial amount of rise by means of a transfer amount setter 49. A spherical base 31 is fixed to a receiver plate 30 by evacuation of the air chamber 45 after parallel leading. While the target position of the mask and the wafer is confirmed through an alignment scope 44, the mask pattern and the wafer pattern are brought to agreement by transfer of alignment tables 12, 13, and 17.

65. 发明专利

JPS59161027A Projection aligner 失效
标题翻译：投影对准器
公开(公告)号：JPS59161027A
公开(公告)日：1984-09-11
申请号：JP3455583
申请日：1983-03-04
申请人： Hitachi Ltd
发明人： MORITA MITSUHIRO
IPC分类号： H01L21/30 , G03F7/20 , G03F9/00
CPC分类号： G03F9/70
摘要： PURPOSE:To contrive to stabilize the luminance on a wafer, and to enable to manufacture a wafer of high quality by a method wherein the luminance in the nearest condition to the luminance of the wafer is detected to control light vollume of a lamp. CONSTITUTION:A mask 1 is illuminated by an illuminating optical sistem 3, and the image of a mask pattern is formed on the surface of a wafer 2 according to an image forming optical system 4. The luminance at the position immediately before the mask 1 is detected according to a luminance monitoring sensor 24, an operation is performed by a microcomputer 25, the result thereof is inputted to a comparator 28 as a set value 27, compared with a primary voltage outputted from a control part 21 to control the voltage transfromation degree of the control part 21 at every scanning of lamp light to the mask 1 to be performed intermittently, and lumnous intensity of a lamp 5 is so controlled as to fix luminance of the mask 1 site. Because light passed through an optical element of lens, etc. to apply a large influence to a variation of luminance is used for monitoring, the variation of luminance on the wafer can be made extremely small.
摘要翻译：目的：为了稳定晶片的亮度，并且能够通过以下方法制造高质量的晶片，其中检测到晶片亮度最接近的亮度来控制灯的光伏。构成：通过照明光学系统3照射面罩1，根据图像形成光学系统4在晶片2的表面上形成掩模图案的图像。在掩模1之前的位置处的亮度为根据亮度监视传感器24检测到，由微计算机25执行操作，其结果被输入到比较器28作为设定值27，与从控制部分21输出的一次电压相比较，以控制电压变换度控制部分21在每次对灯光进行扫描的同时进行间歇执行，并且控制灯5的亮度以固定掩模1位置的亮度。因为通过透镜等的光学元件的光对亮度的变化施加很大的影响，因此可以使晶片的亮度变化非常小。

66. 发明专利

JPS59155130A Mask aliner 失效
标题翻译： MASK ALINER
公开(公告)号：JPS59155130A
公开(公告)日：1984-09-04
申请号：JP556184
申请日：1984-01-18
申请人： Hitachi Ltd
发明人： MAEJIMA HIROSHI , KOMORIYA SUSUMU , NISHIZUKA HIROSHI , MORITA MITSUHIRO
IPC分类号： G03F7/20 , H01L21/027
CPC分类号： G03F7/70691
摘要： PURPOSE:To prevent a pitch displacement generating between a mask and a wafer by a method wherein a mask holder which holds a mask with its circumferential part, a backup place and a ring-shaped wafer chuck, with a ring-shaped groove on the outer circumferential part of the surface opposing to the wafer, are provided. CONSTITUTION:A mask holder 1, which holds a mask 3 with its circumference, is brought to come in contact with the inner edge of the mask holder 1, sucking holes 7 are provided on the backup plate 2 which comes in contact with the back side of the mask, said sucking holes 7 are evacuated, and the mask 3 is fixed to the backup plate 2. A wafer chuck 5 has a ring-shaped groove 15 outside the surface opposing to a wafer 4 and also has ring-shaped feeding holes 14a and 14b, with which nitrogen gas to be used for gas curtain, on the outer circumferential part. The groove 15 is brought to a negative pressure condition by evacuation in such a manner that the pressure distribution is brought to highest degree at the wafer part.
摘要翻译：目的：通过以下方法防止掩模和晶片之间产生间距位移的方法，其中在其外侧保持具有圆周部分的掩模的保持器，备用位置和环形晶片卡盘，环形凹槽提供与晶片相对的表面的圆周部分。构成：将保持有周边的面罩3的面罩座1与面罩座1的内缘接触，在与背面接触的支承板2上设置有吸气孔7 所述吸气孔7被抽真空，并且掩模3固定到支撑板2.晶片卡盘5在与晶片4相对的表面的外侧具有环形槽15，并且还具有环形进给孔 14a和14b，用于气帘的氮气在外圆周部分上。通过使晶片部分的压力分布达到最高程度的排气使凹槽15处于负压状态。

67. 发明专利

JPS5827108A METHOD AND DEVICE FOR FOCUSING 失效
公开(公告)号：JPS5827108A
公开(公告)日：1983-02-17
申请号：JP12519781
申请日：1981-08-12
申请人： HITACHI LTD
发明人： MORITA MITSUHIRO , NISHIZUKA HIROSHI
IPC分类号： G02B7/04 , G03F7/20 , G03F9/00
摘要： PURPOSE:To perform always accurate focusing irrespectively of fluctuations in the imaging positions of mask patterns by recognizing the surface of a water and the mask pattern image reflected by the surface of the wafer respectively with a microscope block while moving the wafer in an optical axis direction. CONSTITUTION:The position where a microscope block 22 can recognize the surface of a wafer 19 sharply is detected by moving the wafer properly upward or downward. Said position is the focus position of the block 22 and the position is stored in a control part 24. If the position where the pattern of a mask 1 formed by an optical sysetm 18 for imaging is formed differs from the focus position stored in said part, the wafer 19 is moved vertically, and prescribed operations are performed in the part 24 in accordance with the vertical position signal of the wafer and the recognition signal from the image recognizing part 23 of the block 22, and according to the results thereof, a supporting structure 21 for the wafer is controlled until the vertical position of the wafer 19 is made coincident with the position where the image of the mask pattern is formed.

68. 发明专利

JPS56118337A POSITIONING STRUCTURE OF WAFER CHUCK FOR EXPOSURE DEVICE 失效
公开(公告)号：JPS56118337A
公开(公告)日：1981-09-17
申请号：JP2049880
申请日：1980-02-22
申请人： HITACHI LTD
发明人： MAEJIMA HIROSHI , KOMORIYA SUSUMU , NISHIZUKA HIROSHI , MORITA MITSUHIRO
IPC分类号： G03B27/02 , G03F7/20 , G03F9/00 , H01L21/027 , H01L21/68
摘要： PURPOSE:To facilitate a chuck positioning, by mounting a spherical body on the top of a cylindrical body which ascends and descends through a cylinder, mounting a wafer chuck thereon, mounting a standard piece thereabove, mounting the cylindrical body inside the cylinder so that it can move along the inner wall of the latter and mounting an elastic body thereon and an ascend/descent axis and a sensor thereunder. CONSTITUTION:A wafer 1 is attached on the upper surface of a chuck 6 by means of vacuum absorption. An axis 15 is lifted by a right revolution of motor 20 to lift a stopper 23. A disc 26 fixed to the axis 15 taps a lever 27 to operate a switch 27 to stop the motor. Simultaneously compressed air is sent to a bellows to lift a cylinder 11. This operation in turn lifts the chuck 6 through a sphere 5 and a spherical body 8 to push up the wafer 1 to parallel setting pads 3 of a standard piece 2. At the time a gap (e) takes place between the upper end of the stopper 23 and the top of the cylinder 11 that corresponds to a stroke. The value of (e) is adjusted by the setting of the switch 27. Thereafter the bellows 24 is depressed to pull down the cylinder 11 by the size of (e) to move a whole table 13 and an exposure is performed by the exposure system. Because the height of the wafer surface is fixed and stable no unfocused performance occurs.

69. 发明专利

JPS5527656A METHOD AND DEVICE OF STICKING PHOTOMASK AND WAFER TOGETHER 失效
公开(公告)号：JPS5527656A
公开(公告)日：1980-02-27
申请号：JP10094978
申请日：1978-08-21
申请人： HITACHI LTD
发明人： KOMORIYA SUSUMU , MORITA MITSUHIRO , NISHIZUKA HIROSHI , MAEJIMA HIROSHI
IPC分类号： G03F9/00 , G03F7/20 , H01L21/027
摘要： PURPOSE:To improve the available percentage of products manufactured from wafers and prevent the damage of masks in a mask alignment process by sticking masks and wafers together without the slips of their relative positions and perform- ing their separation in a short time. CONSTITUTION:A wafer 33 on a wafer chuck 32 is pressed to a mask 11 to coincide the patterns of the two. Next, the pressure of a chamber 40 is made negative to remove an air layer 56, then the mask 11 is bent downwards and pressed to the wafer 33 at its center. Then, N2 gas is blown out from the center of the wafer chuck 32 to the wafer, N2 gas is blown out also from the periphery and sticking is completed, and the pattern of the mask is exposed by exposing device. Next, only the periphery of the wafer chuck is changed to vacuum, the central part of the wafer is bent and the wafer is separated from the mask from its peripheral part.

70. 发明专利

JPS54139485A HOLDING MECHANISM OF BACKUP PLATE FOR MASK ALIGNER 失效
公开(公告)号：JPS54139485A
公开(公告)日：1979-10-29
申请号：JP4654078
申请日：1978-04-21
申请人： HITACHI LTD
发明人： KOMORIYA SUSUMU , MORITA MITSUHIRO
IPC分类号： H01L21/027 , H01L21/30
摘要： PURPOSE:To eliminate the warp of the plate by fitting the inner fringe part of the 1st ring substance holding the flange at the outer circumference to the periphery of the backup plate and then enclosing them with the 2nd ring substance which is then screwed tight via the bolt together with the 1st ring substance. CONSTITUTION:The 1st ring substance 7 containing the hole linking to suction hole 2 plus flange 7a at the outer circumference is fitted to the outer circumference of quartz backup plate 1 containing vacuum saction hole 2 to adsorb photo process mask 5. Then 2nd ring substance 3 holding the projection part linking to hole 2 and touching flange 7a of substance 7 is fitted to the outside of plate 1 via rubber pipe packing 8 to be screwed tight via the bolt at bolt screwing part 9. After this, the utmost outer circumference of the plate thus unified is attached to protective fixing stage 6 for unification. In such way, no warp is caused to plate 1 with no pitch shift caused to the semiconductor wafer.

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