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61. 发明专利

JPS60102552A SENSOR FOR FINE PARTICLE EXISTING IN LIQUID 失效
公开(公告)号：JPS60102552A
公开(公告)日：1985-06-06
申请号：JP20895683
申请日：1983-11-09
申请人： HITACHI LTD
发明人： ISHINO MASAKAZU
IPC分类号： G01N29/02 , G01N29/032
摘要： PURPOSE:To make it possible to detect fine particles contained in a liquid by enhancing electricity-sound converting efficiency, in a sensor for counting the number of fine particles such as dust or bacteria present in the liquid such as water, by allowing an ultrasonic vibrator to expose to a liquid flowing part. CONSTITUTION:An 1/4 wavelength plate 5 is applied to an ultrasonic vibrator 1 having a concave surface and a packing material 4 for absorbing an ultrasonic wave is further provided to the rear surface of said ultrasonic vibrator 1. In this case, the surface of the 1/4 wavelength plate 5 is pierced through the wall surface of an arranged pipe material 3 so as to be exposed to a liquid flowing part. When a sonic wave is emitted from the ultrasonic vibrator 1, it is directly emitted to the liquid flowing part without being attenuated in the material of said arranged pipe material 3 and reflected sounds from fine particles increase. Because the ultrasonic vibrator 1 coated with the 1/4 wavelength plate 5 is exposed to the liquid flowing part, the attenuation element of the reflected sonic wave is eliminated and sound-electricity converting efficiency becomes high and the detection of fine particles in a liquid is enabled.

62. 发明专利

JP2010161184A Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：JP2010161184A
公开(公告)日：2010-07-22
申请号：JP2009002106
申请日：2009-01-08
申请人： Elpida Memory Inc , Hitachi Ltd , エルピーダメモリ株式会社 , 株式会社日立製作所
发明人： KUNO NAE , OHASHI SHIGEO , OSONE YASUO , NAKA YASUHIRO , TENMYO HIROYUKI , NISHI KUNIHIKO , IKEDA HIROAKI , ISHINO MASAKAZU , MIYAKE HIDEJI , UCHIYAMA SHIRO
IPC分类号： H01L23/473
CPC分类号： H01L24/14 , H01L23/3128 , H01L23/34 , H01L23/473 , H01L2224/16145 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2225/06565 , H01L2924/1461 , H01L2924/15311 , H01L2924/15321 , H01L2924/181 , H01L2924/18161 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a means for efficiently cooling a semiconductor element of a semiconductor device in which a package substrate, a semiconductor element, and a mounting substrate are stacked sequentially. SOLUTION: In the semiconductor device, a package substrate 11, a semiconductor element 131, and a mounting substrate 2 are sequentially stacked, the package substrate and the semiconductor element are electrically connected together via a primary connection bump 122; a heat-receiving part 31 of a liquid cooling module for cooling the semiconductor element that uses a liquid coolant is installed between the semiconductor element and the mounting substrate; and a plurality of secondary connection bumps 15 are installed between the package substrate and the mounting substrate. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于有效地冷却其中封装衬底，半导体元件和安装衬底被顺序堆叠的半导体器件的半导体元件的装置。解决方案：在半导体器件中，依次堆叠封装基板11，半导体元件131和安装基板2，封装基板和半导体元件经由主连接凸块122电连接在一起; 在半导体元件和安装基板之间安装用于冷却使用液体冷却剂的半导体元件的液体冷却模块的受热部31; 并且在封装基板和安装基板之间安装多个次级连接凸块15。版权所有（C）2010，JPO＆INPIT

63. 发明专利

JP2008135663A Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：JP2008135663A
公开(公告)日：2008-06-12
申请号：JP2006322221
申请日：2006-11-29
申请人： Elpida Memory Inc , Hitachi Ltd , エルピーダメモリ株式会社 , 株式会社日立製作所
发明人： NAKA YASUHIRO , TENMYO HIROYUKI , NISHI KUNIHIKO , IKEDA HIROAKI , ISHINO MASAKAZU
IPC分类号： H01L21/60
CPC分类号： H01L21/563 , H01L23/3171 , H01L23/481 , H01L24/81 , H01L24/83 , H01L25/0657 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16145 , H01L2224/16225 , H01L2224/16237 , H01L2224/32145 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83192 , H01L2225/06513 , H01L2225/06517 , H01L2225/06565 , H01L2225/06593 , H01L2924/00014 , H01L2924/01019 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/00 , H01L2224/05599
摘要： PROBLEM TO BE SOLVED: To prevent poor connection due to displacement of a semiconductor element during flip-chip connection of the semiconductor element having a miniaturized and narrow-pitch bump, and ensure reliability of the device. SOLUTION: A guide that is formed of an insulative resin and aims for the prevention of displacement is provided around a connecting electrode. Assuming that an angle of inclination of a side of a connection of the guide is θ when a positioning error of a semiconductor device connecting device is δ, the insulative resin has a thickness of δ tan θ or more. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了防止在具有小型化和窄间距凸块的半导体元件的倒装芯片连接期间由于半导体元件的位移导致的连接不良，并且确保器件的可靠性。解决方案：在连接电极周围设置由绝缘树脂形成并且防止位移的目的的导向件。假设当半导体装置连接装置的定位误差为δ时，导向件的连接侧的倾斜角为θ，则绝缘树脂的厚度δtanθ以上。版权所有（C）2008，JPO＆INPIT

64. 发明专利

JP2007123656A Solder bump formation equipment 审中-公开
标题翻译：焊接成型设备
公开(公告)号：JP2007123656A
公开(公告)日：2007-05-17
申请号：JP2005315622
申请日：2005-10-31
申请人： Elpida Memory Inc , Hitachi Ltd , エルピーダメモリ株式会社 , 株式会社日立製作所
发明人： TENMYO HIROYUKI , ISADA NAOYA , NAKA YASUHIRO , IKEDA HIROAKI , ISHINO MASAKAZU
IPC分类号： H01L21/60
CPC分类号： H01L24/81
摘要： PROBLEM TO BE SOLVED: To provide solder bump formation equipment where electroplating tin does not oxidize. SOLUTION: Following processes are carried out in a series of equipment. (1) In vacuum equipment, oxide on a surface electroplated with tin is removed by argon plasma. (2) The surface is heated in vacuum or inert gas (argon, nitrogen, helium, or a gas obtained by mixing hydrogen in the inert gas for suppressing oxidization). (3) An adhesive is applied on the surface in the inert gas (argon, nitrogen, helium, or a gas obtained by mixing hydrogen in the inert gas for suppressing oxidization). (4) The adhesive is semi-cured in the inert gas (argon, nitrogen, helium, or a gas obtained by mixing hydrogen in the inert gas for suppressing oxidization). COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供电镀锡不氧化的焊料凸块形成设备。
解决方案：以下过程在一系列设备中进行。（1）在真空设备中，通过氩等离子体除去用锡电镀的表面上的氧化物。（2）将表面在真空或惰性气体（氩气，氮气，氦气或通过在惰性气体中混合氢以抑制氧化而获得的气体）加热。（3）在惰性气体（氩，氮，氦或通过在惰性气体中混合氢气以抑制氧化而获得的气体）的表面上施加粘合剂。（4）粘合剂在惰性气体（氩，氮，氦或通过在用于抑制氧化的惰性气体中混合氢气获得的气体）半固化。版权所有（C）2007，JPO＆INPIT

65. 发明专利

JP2001330628A METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 失效
公开(公告)号：JP2001330628A
公开(公告)日：2001-11-30
申请号：JP2001091643
申请日：2001-03-28
申请人： HITACHI LTD
发明人： KASUKABE SUSUMU , USAMI MITSUO , UEHARA KEIJIRO , TASE TAKASHI , ISHINO MASAKAZU , KASHIMURA TAKASHI
IPC分类号： G01R31/26 , G01R1/073 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To provide a connection device, having a contact terminal enabling multipoint and high density contact concerning an object to be inspected, and to provide a method for manufacturing the same. SOLUTION: A hole which is to be a mold for forming the contact terminal 103 is formed to a silicon wafer by anisotropic etching, and this mold is used to form the contact terminal 103, an insulating film 104 comprising a polyimide film and outgoing wiring 105. Furthermore, a cushioning layer 108 and a silicon wafer which is to become a substrate 109 are held between the insulating film 104 and a wiring board 107 to be integrated with them, and then the mold is removed. Thereafter, the loading out wiring 105 is connected to the electrode 110a of the wiring board 107 with a solder 111.

66. 发明专利

JPH118471A MANUFACTURE OF MULTILEVEL INTERCONNECTION BOARD AND MOUNTING METHOD OF ELECTRONIC COMPONENT BY USING THE MULTILEVEL INTERCONNECTION BOARD 失效
公开(公告)号：JPH118471A
公开(公告)日：1999-01-12
申请号：JP16124597
申请日：1997-06-18
申请人： HITACHI LTD , HITACHI CABLE
发明人： ISHINO MASAKAZU , TENMYO HIROYUKI , ONDA MAMORU
IPC分类号： H05K3/40 , H05K3/36 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide the manufacturing method of a multilevel interconnection board which enables the improvement in the precision of a conductive paste filling position, without the use of an elaborate apparatus. SOLUTION: An adhering material layer consisting of an adhesive layer 104 and a protective layer 105 which is removably provided on the adhesive layer 104 is laminated on the rear of a film substrate having circuit patterns. Via holes 106 which pierce through the film substrate and the adhering material layer are formed. A conductive paste is applied to the protective layer 5 to fill the via holes 106 with the conductive paste. After that, the protective layer 105 is removed from the adhesive layer 104.

67. 发明专利

JPH10107178A STRUCTURE FOR ELECTRONIC CIRCUIT BOARD AND ITS MANUFACTURE 失效
公开(公告)号：JPH10107178A
公开(公告)日：1998-04-24
申请号：JP18208997
申请日：1997-07-08
申请人： HITACHI LTD , HITACHI CABLE
发明人： ISHINO MASAKAZU , TENMYO HIROYUKI , EGUCHI KUNIYUKI , ONDA MAMORU
IPC分类号： H05K3/36 , H01L23/12 , H05K3/00 , H05K3/40 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To enhance an insulating characteristic between interconnections with adhesion strength reinforced between sheets and with gaps filled by a method wherein a plurality of sheets on which wiring patterns are formed are thermocompression-bonded only in via parts and the gaps generated between the sheets are filled with a resin so as to be integrated. SOLUTION: A copper foil 502 and a copper foil 503 are laminated in advance on both faces of a polyimide sheet 501, a protective tape 505 is bonded to the rear of the polyimide sheet 501, and its surface side is coated with a resist 504 so as to be dried. The resist 504 is exposed and developed, the resist is removed from only places in which via holes are to be formed, and the via holes 506 are formed in the polyimide sheet 501 so as to correspond to opening parts in the copper foil 502. Then, a plurality of wiring sheets 601 which are formed in his manner are piled up, electrodes 602 for connection are aligned, only the via holes 506 are bonded by a thermocompression-bonding operation, and gaps which are generated between the respective wiring sheets 601 are filled with an epoxy resin so as to be integrated.

68. 发明专利

JPH09219590A THIN FILM LAMINATED SUBSTRATE AND SHEET THEREOF AS WELL AS ITS MANUFACTURING METHOD AND DEVICE 失效
公开(公告)号：JPH09219590A
公开(公告)日：1997-08-19
申请号：JP2541196
申请日：1996-02-13
申请人： HITACHI LTD
发明人： TENMYO HIROYUKI , SHIGI HIDETAKA , ISHINO MASAKAZU
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To easily manufacture high reliable thin film laminated substrate applicable to fine wiring and various structures at low cost. SOLUTION: An insulating film 4 having through holes is formed of a sensitive resin on the surface of a long metallic foil 2 to be a long composite sheet 4b. A via-wiring 36 and planar wirings 2a are formed and then cut off to obtain wiring sheets 4e. Next, these wiring sheets 4e are laminated through the intermediary of an adhesive sheet to obtain a multilayer laminated substrate.

69. 发明专利

JPH097969A METHOD OF FILLING FINE HOLE WITH METAL 失效
公开(公告)号：JPH097969A
公开(公告)日：1997-01-10
申请号：JP18307696
申请日：1996-07-12
申请人： HITACHI LTD
发明人： NISHITANI EISUKE , TSUJIKU SUSUMU , ISHINO MASAKAZU , KOBAYASHI HIDE , KASAHARA OSAMU , TAMARU TAKESHI , NEZU HIROKI
IPC分类号： C23C16/02 , C23C16/04 , C23C16/06 , H01L21/28 , H01L21/285 , H01L21/302 , H01L21/3065 , H01L21/768
摘要： PROBLEM TO BE SOLVED: To provide a method of filling a fine hole with a selective CVD representative of a W selection CVD wherein selectivity is not lowered even if there is performed a processing of purifying the base of the fine hole. SOLUTION: In a method of filling a fine hole with metal, the hole being provided in an insulating film on the substrate for exposing part of a substrate base, a fine hole bottom base surface is cleaned, and an insulating film surface layer part activated by a cleaning process is stabilized for selective CVD of metal.

70. 发明专利

JPH08340166A WIRING BOARD, MULTILAYER WIRING BOARD, MANUFACTURE THEREOF, MANUFACTURING DEVICE THEREOF, REPAIR OF WIRING BOARD AND REPAIRING DEVICE 失效
公开(公告)号：JPH08340166A
公开(公告)日：1996-12-24
申请号：JP16813495
申请日：1995-06-09
申请人： HITACHI LTD
发明人： MATSUSHIMA NAOKI , ISHINO MASAKAZU , SAKAMOTO HARUHISA , YABUSHITA AKIRA , FUKUSHIMA MAKOTO , KINOSHITA MADOKA
IPC分类号： H05K1/02 , H05K3/00 , H05K3/22 , H05K3/38 , H05K3/46
摘要： PURPOSE: To obtain efficiently a wiring board, which is provided with the smooth surface, without causing problems, such as a covering of a board conductor using an insulator and a roughening of the surface of the board. CONSTITUTION: A filter 3 is individually filled only in recessed parts 21a having an aperture diameter of a previously set value (such as a wiring width) or larger among recessed parts 21 formed in the surface of a board 11. The filling is conducted using a microdispenser.

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