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    • 70. 发明专利
    • MANUFACTURE OF CIRCUIT BOARD
    • JPS63300591A
    • 1988-12-07
    • JP13349987
    • 1987-05-30
    • NIHON CEMENT
    • TSUKAMOTO KEIZOISHII MAMORUYAMAGISHI SENJO
    • C04B41/87C01G1/00H01B12/06H01B13/00H05K3/12
    • PURPOSE:To eliminate the disconnection of a conductor and to improve productivity by repeating two or more cycles of the printing and baking of superconducting material paste on a substrate. CONSTITUTION:After paste is screen printed on a board made of zirconia or mullite and dried, it is baked and cooled to complete a first cycle. Further, the pattern is repeatedly treated by the same procedure as the first cycle in second, third and later cycles. The pattern is formed by the first printing and baking. A board and a conductor are contracted by the later cooling. The conductor is microcracked at this time. Second paste is printed so as to become the same pattern on the conductor, baked and cooled at the same temperatures as those in the previous cycle. Thus, a second layer conductor is formed. In this case, the expansions and the contractions of the boards in baking and cooling cycles are negligibly small. Accordingly, the number of the cracks is reduced as compared with that of the first cycle, and cracking positions are largely different in the first and second cycles. Thus, the disconnection due to the microcrack can be eliminated by the two cycles of processing, and preferably three cycles of processing can completely eliminate the microcrack.