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51. 发明专利

JP2012524324A Touch panel manufacturing pad touch panel is a touch panel manufacturing method and by this using the same 审中-公开
公开(公告)号：JP2012524324A
公开(公告)日：2012-10-11
申请号：JP2012505809
申请日：2010-04-12
申请人：パクジュンヨンPARK, Jun−Young
发明人：ジュンヨンパク
IPC分类号： G06F3/041 , B32B15/04 , H01B5/14
CPC分类号： G06F3/044 , G06F3/045 , H05K3/24
摘要： The present invention relates to a pad for a touch panel, to a method for manufacturing a touch panel using same, and to a touch panel manufactured by the method. The present invention relates to a pad for a touch panel, comprising: an insulator layer consisting of a transparent organic insulator or an inorganic insulator; an upper transparent conductive material coating layer formed on the upper surface of the insulator layer; an upper metal coating layer formed on the upper surface of the upper transparent conductive material coating layer; and a lower conductive layer formed at the lower surface of the insulator layer, and consisting of: i) a transparent conductive material coating layer, or ii) a metal coating layer, or iii) a stacked layer of a transparent conductive material coating layer and a metal coating layer. The present invention also relates to a method for manufacturing a touch panel using same, and to a touch panel manufactured by the method. Through the above-described configuration, the present invention makes it possible to manufacture a touch panel through processes that are more simplified than conventional processes using a silver paste, and enables easy manufacture and reduces manufacturing costs. Further, the present invention enables the formation of more fine conductive wires at both sides of the touch panel, and can thus achieve a compact device configuration. The present invention minimizes the stepped portion at the edge of the touch panel on which a pattern is formed to prevent defects such as air bubbles in the attached surface of the touch panel when an adhesive layer is attached, thereby achieving a touch panel with a high resolution. The present invention enables the formation of a pattern on the upper surface of the touch panel and the formation of a ground line at the lower surface of the touch panel to be performed at the same time, thereby simplifying the processes.

52. 发明专利

JP4556422B2 Electronic components and a method of manufacturing the same 有权
公开(公告)号：JP4556422B2
公开(公告)日：2010-10-06
申请号：JP2003402606
申请日：2003-12-02
申请人：パナソニック株式会社
发明人：昌吾平井 , 剛司檜森
IPC分类号： H05K3/28 , H05K1/16 , H05K3/24
CPC分类号： H05K3/246 , H05K1/092 , H05K1/165 , H05K3/24 , H05K3/28 , H05K2201/0347 , H05K2203/0315 , Y10T428/24917 , Y10T428/24926

53. 发明专利

JP3782869B2 Tin - silver alloy plating bath 失效
公开(公告)号：JP3782869B2
公开(公告)日：2006-06-07
申请号：JP18895397
申请日：1997-07-01
申请人：株式会社大和化成研究所 , 石原薬品株式会社
发明人：惠吾小幡 , 征史正木 , 孝夫武内 , 秀美縄舟 , 哲也近藤 , 和博青木
IPC分类号： C25D3/56 , C25D3/60 , H05K3/24 , H05K3/34
CPC分类号： H05K3/24 , H05K3/3473

54. 发明专利

JP2005220412A Metal-ceramic-bonded member and manufacturing method therefor 有权
标题翻译：金属 - 陶瓷结合件及其制造方法
公开(公告)号：JP2005220412A
公开(公告)日：2005-08-18
申请号：JP2004030139
申请日：2004-02-06
申请人： Dowa Mining Co Ltd , 同和鉱業株式会社
发明人： TSUKAGUCHI NOBUYOSHI , IYODA KEN
IPC分类号： B23K1/19 , B23K1/20 , C23C18/16 , C23C18/18 , C23C18/32 , H01L21/48 , H01L23/12 , H01L23/373 , H05K1/03 , H05K1/09 , H05K3/24
CPC分类号： H01L23/3735 , C23C18/1608 , C23C18/1696 , C23C18/1831 , C23C18/32 , H01L21/4846 , H01L2924/0002 , H05K1/0306 , H05K1/09 , H05K3/24 , H05K3/243 , H05K2201/0355 , H05K2203/072 , H05K2203/0793 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a metal-ceramic-bonded member, which improves the adhesiveness of and a productivity for a plated film, without using a resist of a peeled type by an organic solvent and carrying out a heat treatment step.
SOLUTION: In a method for manufacturing the metal-ceramic-bonded member by bonding an aluminum alloy sheet 12 to at least one surface of a ceramic substrate 10, forming a circuit pattern thereon, and electroless-plating a nickel alloy 18 on a predetermined part of the surface of the aluminum alloy sheet 12, this manufacturing method comprises: bonding a resist 16 of a peeled type by an alkali to the surface of the aluminum alloy sheet 12, so as to form a predetermined shape; activating the surface of the aluminum alloy sheet 12 having no resist 16 bonded thereon with an acidic zinc-displacement liquid containing a fluoride or a silicic fluoride; electroless-plating the nickel alloy 18 thereon; and peeling the resist 16 by the alkali to form a plated film with the predetermined shape.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种提高金属 - 陶瓷结合部件的制造方法，其改善了镀膜的粘附性和生产率，而不用有机溶剂使用剥离型抗蚀剂，并且进行热处理步骤。解决方案：在通过将铝合金板12粘合到陶瓷基板10的至少一个表面上制造金属陶瓷结合部件的方法中，在其上形成电路图案，并对镍合金18进行无电镀铝合金板12的表面的预定部分，该制造方法包括：通过碱将剥离型抗蚀剂16与铝合金板12的表面接合，形成预定的形状; 用含有氟化物或氟化硅的酸性锌取代液体活化未结合抗蚀剂16的铝合金板12的表面; 在其上对镍合金18进行无电镀; 并且用碱剥离抗蚀剂16以形成具有预定形状的镀膜。版权所有（C）2005，JPO＆NCIPI

55. 发明专利

JP3669460B2 Electroless plating method 失效
公开(公告)号：JP3669460B2
公开(公告)日：2005-07-06
申请号：JP2221897
申请日：1997-02-05
申请人：日立化成工業株式会社
发明人：清長谷川 , 昭男高橋
IPC分类号： C23C18/22 , C23C18/18 , H05K3/22 , H05K3/24
CPC分类号： H05K3/22 , H05K3/24

56. 发明专利

JP3573774B2 Method of manufacturing a hybrid integrated circuit device 失效
公开(公告)号：JP3573774B2
公开(公告)日：2004-10-06
申请号：JP29572293
申请日：1993-11-25
申请人：三洋電機株式会社
发明人：優助五十嵐 , 純坂野 , 傑若井 , 昌巳茂木
IPC分类号： H05K1/09 , H01L23/12 , H05K1/02 , H05K3/06 , H05K3/24
CPC分类号： H05K3/062 , H05K3/24

57. 发明专利

JP3515833B2 Interconnection substrate 失效
公开(公告)号：JP3515833B2
公开(公告)日：2004-04-05
申请号：JP17880595
申请日：1995-07-14
申请人：株式会社東芝
发明人：健一茂泉 , 忠郷飯田
IPC分类号： H05K7/12 , H05K1/02 , H05K1/11 , H05K1/18 , H05K3/10 , H05K3/24 , H05K3/30
CPC分类号： H05K1/0263 , H05K3/24 , H05K3/301

60. 发明专利

JP3381602B2 Electronic component production method 失效
公开(公告)号：JP3381602B2
公开(公告)日：2003-03-04
申请号：JP1372698
申请日：1998-01-27
申请人：松下電器産業株式会社
发明人：宏土師
IPC分类号： H01L21/60 , H01L23/12 , H05K3/24
CPC分类号： H01L2224/16225 , H01L2224/73204 , H01L2924/15311 , H05K3/24
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing electronic parts capable of ensuring both excellent conduction to a gold bump of electronic parts with bumps and bonding property of a solder bump. SOLUTION: An electrode 12 for being electrically connected to a gold bump 17 of electronic parts 16 with bumps and an electrode 13 for forming a solder bump 15 are formed on a substrate 11, and a nickel film and a gold film are sequently formed on the electrodes 12, 13. After a conduction obstacles produced on the surface of the gold film of the electrode 12 are removed by plasma process, the gold bump 17 is positioned to the electrode 12 to be electrically connected thereto, and also the electronic parts 16 with bumps are sealed on the substrate 11 with an insulation resin to be secured. Thereafter, the solder bump 15 is formed on the electrode 13. Thus, the gold bump 17 is excellently and electrically connected and the solder bump 15 can be formed in the electrode 13 with an excellent joining property.

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