专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

51. 发明专利

JP2005038864A Method for manufacturing anisotropic conductive sheet 有权
标题翻译：制造各向异性导电片的方法
公开(公告)号：JP2005038864A
公开(公告)日：2005-02-10
申请号：JP2004242875
申请日：2004-08-23
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TSUKAGOSHI ISAO , GOTO YASUSHI , OTA TOMOHISA
IPC分类号： H01R11/01 , H01B13/00 , H01R43/00
摘要： PROBLEM TO BE SOLVED: To provide a low-cost method for manufacturing an anisotropic conductive sheet for inspection, useful for electric connection and inspection of a high-density electrode.
SOLUTION: The method comprises (a) a step of dispersing in the curing insulating material particles in which surfaces of conductive particles 1 of a uniform particle size are coated with thermosoftening insulating coating 2 and forming a sheet like object in which thickness of an insulating material is equal or thicker than the particle size of the conductive particles 1 on a circuit of a wiring board; and (b) a step of heating to pressure the object between flexible materials and curing the insulating material at a temperature of equal to or higher than a thermosoftening point of the insulating coating.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供用于制造用于检查的各向异性导电片的低成本方法，其用于高密度电极的电连接和检查。解决方案：该方法包括（a）在固化绝缘材料颗粒中分散均匀粒度的导电颗粒1的表面的步骤，其中涂覆有热软化绝缘涂层2并形成板状物体，其中厚度为绝缘材料等于或大于布线板电路上的导电粒子1的粒径; 和（b）在绝热涂层的热软化点的温度以上的温度下加热加压物体之间的柔性材料并固化绝缘材料的步骤。版权所有（C）2005，JPO＆NCIPI

52. 发明专利

JP2004331330A Adhesive tape reel, adhesion device, and connection method 有权
标题翻译：粘合胶带，粘合装置和连接方法
公开(公告)号：JP2004331330A
公开(公告)日：2004-11-25
申请号：JP2003130197
申请日：2003-05-08
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： ARIFUKU MASAHIRO , TSUKAGOSHI ISAO , GOTO YASUSHI , FUKUSHIMA NAOKI , YUSA MASAMI , YANAGAWA TOSHIYUKI
IPC分类号： B65H75/28 , B65H19/18 , B65H26/02 , C09J5/00
摘要： PROBLEM TO BE SOLVED: To provide an adhesive tape reel, an adhesion device, and a bonding method capable of replacing the adhesive tape reel simply and enhancing the production efficiency of electronic appliances.
SOLUTION: The adhesive tape reel A includes a base member 9 coated with adhesive 11 where the terminating part 30 of one adhesive tape 1 is connected with the starting part 32 of another adhesive tape 1 using a fastening tool 43, wherein the connection part 41 is arranged so that the fastening tool 43 is covered with the adhesive tapes 1.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：解决的问题：提供一种能够简单地更换胶带卷轴并提高电子设备的生产效率的胶带卷轴，粘合装置和粘合方法。解决方案：胶带卷轴A包括涂覆有粘合剂11的基底部件9，其中一个粘合带1的端接部分30使用紧固工具43与另一个胶带1的起始部分32连接，其中连接部分41被布置成使得紧固工具43被胶带1覆盖。版权所有：（C）2005，JPO＆NCIPI

53. 发明专利

JP2004323622A Adhesive material tape 有权
公开(公告)号：JP2004323622A
公开(公告)日：2004-11-18
申请号：JP2003118287
申请日：2003-04-23
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： ARIFUKU MASAHIRO , TSUKAGOSHI ISAO , GOTO YASUSHI , FUKUSHIMA NAOKI , YUSA MASAMI , YANAGAWA TOSHIYUKI
IPC分类号： C09J7/02 , C09J201/00
摘要： PROBLEM TO BE SOLVED: To provide an adhesive material tape which enables easy replacement of a reel and can improve the production efficiency of electronic equipment.
SOLUTION: In the adhesive material tape 1 coated on a base material 9, the base material 9 has a hot melt layer 9a and a support layer 9b, and the support layer 9b is sandwiched between the hot melt layers 9a or the hot melt layer 9a is sandwiched between the support layers 9b.
COPYRIGHT: (C)2005,JPO&NCIPI

54. 发明专利

JP2004323621A Adhesive material tape 审中-公开
标题翻译：胶粘材质胶带
公开(公告)号：JP2004323621A
公开(公告)日：2004-11-18
申请号：JP2003118286
申请日：2003-04-23
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： ARIFUKU MASAHIRO , TSUKAGOSHI ISAO , GOTO YASUSHI , FUKUSHIMA NAOKI , YUSA MASAMI , YANAGAWA TOSHIYUKI
IPC分类号： C09J7/02 , C09J201/00 , H01B5/02 , H01R11/01
摘要： PROBLEM TO BE SOLVED: To provide an adhesive material tape which increases the number of turns per reel and can improve the production efficiency of electronic equipment.
SOLUTION: In the adhesive material tape 1 coated on a base material, the base material 9 is composed of a metallic film or an aromatic polyamide film, the thickness of the base material 9 is 1 to 25 μm, the tensile strength at 25°C of the base material 9 is ≥300 MPa, the ratio of the base material 9 to the adhesive 11 is 0.01-1.0, and the surface roughness R
max of the base material is ≤0.5 μm.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供增加每卷的匝数的粘合材料带，并且可以提高电子设备的生产效率。解决方案：在涂覆在基材上的粘合材料带1中，基材9由金属膜或芳香族聚酰胺膜构成，基材9的厚度为1〜25μm，拉伸强度为基材9的25℃≥300MPa，基材9与粘合剂11的比例为0.01〜1.0，基材的表面粗糙度R ~~≤0.5μm 。版权所有（C）2005，JPO＆NCIPI~~

55. 发明专利

JP2004211018A Adhesive tape, method of producing adhesive tape and compression adhesion method for the same 有权
公开(公告)号：JP2004211018A
公开(公告)日：2004-07-29
申请号：JP2003002093
申请日：2003-01-08
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： ARIFUKU MASAHIRO , TSUKAGOSHI ISAO , GOTO YASUSHI , FUKUSHIMA NAOKI , YUSA MASAMI , YANAGAWA TOSHIYUKI
IPC分类号： C09J7/02 , C09J5/00 , C09J201/00 , H01R43/02
摘要： PROBLEM TO BE SOLVED: To provide an adhesive tape that can increase the amount of an adhesive without increase of the rolling number of the adhesive tape, a method of producing the adhesive tape and compression adhesion method for the adhesive tape.
SOLUTION: The adhesive tape 1 allows an electronic part to adhere to a circuit board or allows a circuit board 21 to adhere to another circuit board 23. Simultaneously, the adhesive tape electrically connects between both electrodes 21a, 23a of these circuit boards. In this tape, the base material 9 is coated with an adhesive 11 and wound around a reel and the adhesive 11 is arranged in a plurality of rows in the transverse direction on the tape.
COPYRIGHT: (C)2004,JPO&NCIPI

56. 发明专利

JP2004203945A Adhesive tape reel and adhesion apparatus 有权
公开(公告)号：JP2004203945A
公开(公告)日：2004-07-22
申请号：JP2002371889
申请日：2002-12-24
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： YUSA MASAMI , YANAGAWA TOSHIYUKI , ARIFUKU MASAHIRO , TSUKAGOSHI ISAO , GOTO YASUSHI , FUKUSHIMA NAOKI
IPC分类号： C09J5/00
摘要： PROBLEM TO BE SOLVED: To provide an adhesive tape reel which can simply be replaced and can improve the production efficiency of electronic equipment, and to provide an adhesion apparatus.
SOLUTION: This adhesive tape reel A in which an adhesive tape 1 prepared by coating a substrate with an adhesive for connecting electrodes is rolled on a reel 3 is characterized by disposing rolling portions 2, 2a for the adhesive tape 1 in the width direction of the tape.
COPYRIGHT: (C)2004,JPO&NCIPI

57. 发明专利

JP2004031975A Connecting equipment 审中-公开
公开(公告)号：JP2004031975A
公开(公告)日：2004-01-29
申请号：JP2003199806
申请日：2003-07-22
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TSUKAGOSHI ISAO , KOBAYASHI KOJI , MATSUDA KAZUYA , FUKUSHIMA NAOKI
IPC分类号： H01L25/18 , H01L21/60 , H01L25/04
摘要： PROBLEM TO BE SOLVED: To provide a connecting equipment for mounting chip elements on a substrate, that is useful when the height of the chips are different or the chips are mounted on both sides of a substrate.
SOLUTION: The connecting equipment comprises a closed container; an inlet and outlet for getting in and out a sample that is provided for the closed container, and air intake and exhaust openings; an air intake and exhaust equipment connected to the air intake and exhaust opening that can change the kind of gases, and a heater for heating the closed container. The connecting equipment can heat an adhesive formed on the connecting objects in the closed container under a hydrostatic pressure.
COPYRIGHT: (C)2004,JPO

58. 发明专利

JP2003318502A Electrode connection structure 有权
标题翻译：电极连接结构
公开(公告)号：JP2003318502A
公开(公告)日：2003-11-07
申请号：JP2003047435
申请日：2003-02-25
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TSUKAGOSHI ISAO , FUJINAWA MITSUGI , SHIOZAWA NAOYUKI , GOTO YASUSHI , OTA TOMOHISA
IPC分类号： H01R11/01 , H01B1/00 , H01B1/22 , H01B5/00 , H05K1/14 , H05K3/32
摘要： PROBLEM TO BE SOLVED: To provide an electrode connection structure using conductive particles which do not require strictly controlled connecting conditions, possess superior connection reliability, and are adjustable in the degree of deformation.
SOLUTION: Circuits are connected together through the intermediary of an anisotropic conductive connecting member where the conductive particles are dispersed into an adhesive component. The conductive particles are each composed of a hard nucleus, a soft layer formed on the surface of the nucleus, and a conductive layer formed thereon, and the circuits using a plastics as a board are used in the electrode connection structure.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种使用不需要严格控制的连接条件的导电颗粒的电极连接结构，具有优异的连接可靠性，并且在变形程度上是可调节的。解决方案：电路通过各向异性导电连接构件的中间连接在一起，其中导电颗粒分散在粘合剂组分中。导电性粒子由硬核，形成在核表面上的软层和形成在其上的导电层构成，在电极连接结构中使用使用塑料作为基板的电路。版权所有（C）2004，JPO

59. 发明专利

JP2010010142A Thermosetting circuit connection member and connection structure of electrode using it and connecting method of electrode 审中-公开
标题翻译：使用电极的电热连接构件和电极的连接结构及电极的连接方法
公开(公告)号：JP2010010142A
公开(公告)日：2010-01-14
申请号：JP2009233793
申请日：2009-10-07
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TSUKAGOSHI ISAO , HIROZAWA YUKIHISA , KOBAYASHI KOJI , OTA TOMOHISA , MATSUOKA HIROSHI , WATANABE ITSUO , TAKEMURA KENZO , SHIOZAWA NAOYUKI , WATANABE OSAMU , KOJIMA KAZUYOSHI
IPC分类号： H01R11/01 , B32B7/02 , B32B27/00 , B32B27/38 , C09J5/06 , C09J7/00 , C09J9/02 , C09J11/00 , C09J163/00 , C09J171/10 , H01R43/00
摘要： PROBLEM TO BE SOLVED: To provide a high-resolution thermosetting circuit connection member capable of retaining conductive particles by preventing them from easily flowing out from the surfaces of electrodes at the time of connection, capable of easily providing contact between the electrodes and the conductive particles, hardly containing bubbles in a connection part, excelling in long-time connection reliability, excelling in workability without needing correct positioning between the conductive particles and the electrodes, and useful for connection between the electrodes, as well as a connection structure and a connection method of electrodes using it. SOLUTION: Of the thermosetting circuit connection member, a multilayer connection member is composed by forming a layer containing epoxy resin, phenoxy resin and a curing agent as an insulating adhesion layer on at least one surface of a conductive adhesion layer comprising epoxy resin, phenoxy resin and curing agent as a binder and a conductive material, and having conductivity in a pressing direction, melting viscosity of a binder constituent at the time of connection is 500 poise or less, and the insulating adhesion layer has a melting viscosity equivalent to that of the conductive adhesion layer. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决问题：为了提供一种能够通过防止在连接时从电极表面容易地从电极表面流出而能够保持导电粒子的高分辨率的热固性电路连接部件，能够容易地提供电极与电极之间的接触在连接部中几乎不含气泡的导电性粒子，长时间的连接可靠性优异，加工性优异，不需要导电粒子与电极之间的正确定位，也可用于电极之间的连接，以及连接结构和使用它的电极的连接方法。解决方案：在热固性电路连接构件中，多层连接构件通过在包含环氧树脂的导电粘合层的至少一个表面上形成包含环氧树脂，苯氧基树脂和固化剂作为绝缘粘合层的层，苯氧基树脂和固化剂作为粘合剂和导电材料，并且在挤压方向上具有导电性，连接时粘合剂成分的熔融粘度为500泊以下，绝缘粘合层的熔融粘度等于导电粘合层的。版权所有（C）2010，JPO＆INPIT

60. 发明专利

JP2009283961A Chip string with adhesive 审中-公开
标题翻译：带粘合剂的芯片
公开(公告)号：JP2009283961A
公开(公告)日：2009-12-03
申请号：JP2009170291
申请日：2009-07-21
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TSUKAGOSHI ISAO , KOBAYASHI KOJI , MATSUDA KAZUYA , FUKUSHIMA NAOKI , KOIDE NOBUKAZU
IPC分类号： H01L21/60 , H01L25/18 , H01L21/52 , H01L21/603 , H01L21/68 , H01L25/04 , H05K3/32
CPC分类号： H05K3/323 , H01L21/6835 , H01L24/27 , H01L24/29 , H01L24/743 , H01L24/83 , H01L2224/16 , H01L2224/29101 , H01L2224/2919 , H01L2224/293 , H01L2224/743 , H01L2224/7511 , H01L2224/83191 , H01L2224/83209 , H01L2224/838 , H01L2224/83851 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01021 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/10155 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H05K2201/10674 , H05K2201/10984 , H05K2203/0338 , Y10S428/914 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T156/1054 , Y10T156/1066 , Y10T156/108 , Y10T428/2486 , Y10T428/287 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a chip string with adhesives which has high productivity by successively supplying chips with adhesives. SOLUTION: The chip string with adhesives comprises a separator 5, film-like adhesive layers 4 formed on the separator 5 such that the adhesive layers are peeled, and a plurality of chips 1a to 1c disposed on the adhesive layers 4 independently at intervals in the order of mounting on a substrate. Electrode surfaces of the chips 1a to 1c are entirely stuck with the adhesive layers 4a to 4c having nearly the same size with the chips 1a to 1c, and adhesives are accurately formed on the electrode surfaces of the chips 1a to 1c having different sizes. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：通过连续地向芯片供应粘合剂来提供具有高生产率的粘合剂的芯片串。解决方案：具有粘合剂的芯片组包括分隔件5，形成在隔膜5上的膜状粘合剂层4，使得粘合剂层被剥离，并且多个芯片1a至1c独立地设置在粘合剂层4上间隔以安装在基板上的顺序。芯片1a至1c的电极表面与芯片1a至1c的尺寸几乎相同的粘合剂层4a至4c完全粘合，并且在具有不同尺寸的芯片1a至1c的电极表面上精确地形成粘合剂。版权所有（C）2010，JPO＆INPIT

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式