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1. 发明专利

JP2011165758A Adhesive for circuit-member connection, and semiconductor device using the same 有权
标题翻译：用于电路会议连接的粘合剂和使用其的半导体器件
公开(公告)号：JP2011165758A
公开(公告)日：2011-08-25
申请号：JP2010024419
申请日：2010-02-05
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： KAWABATA YASUNORI , TAKEMURA KENZO , NAGAI AKIRA , WATANABE OSAMU , SATO SHIN
IPC分类号： H01L21/60 , C09J9/02 , C09J133/00 , C09J161/06 , C09J201/00 , H01L21/301
CPC分类号： H01L24/27 , H01L2224/73104 , H01L2224/83191
摘要： PROBLEM TO BE SOLVED: To provide an adhesive for circuit-member connection that allows alignment marks attached to a wafer to be highly recognizable in an uncured state and achieves excellent connection reliability when a semiconductor device is manufactured and a high-temperature and high-humidity test and a temperature cycle test are executed to the semiconductor device, and a semiconductor device using the same. SOLUTION: The adhesive for circuit-member connection contains a phenol-based compound having a phenolic hydroxyl group, a thermosetting resin, a thermoplastic resin, and a curing agent for a thermosetting resin. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于电路部件连接的粘合剂，其允许在未固化状态下高度识别安装在晶片上的对准标记，并且在制造半导体器件时获得优异的连接可靠性，并且在高温和对半导体器件和使用该半导体器件的半导体器件执行高湿度测试和温度循环测试。解决方案：用于电路构件连接的粘合剂包含具有酚羟基的酚类化合物，热固性树脂，热塑性树脂和用于热固性树脂的固化剂。版权所有（C）2011，JPO＆INPIT

2. 发明专利

JP2011155065A Adhesive film for processing semiconductor wafer, and manufacturing method thereof 有权
标题翻译：用于加工半导体滤波器的粘合膜及其制造方法
公开(公告)号：JP2011155065A
公开(公告)日：2011-08-11
申请号：JP2010014432
申请日：2010-01-26
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： WATANABE OSAMU , TAKEMURA KENZO , SATO SHIN , KAWABATA YASUNORI , NAGAI AKIRA
IPC分类号： H01L21/304 , C09J7/02
摘要： PROBLEM TO BE SOLVED: To provide an adhesive film for processing a semiconductor, along with its manufacturing method, capable of suppressing degradation of a cutter knife at cutting out after pasting of a semiconductor wafer with neither burr formation nor chip occurrence, relating to the adhesive film for processing a semiconductor wafer in which a bump electrode is so formed as to protrude from a main surface.
SOLUTION: The adhesive film for processing a semiconductor wafer in which a bump electrode is formed to protrude from a main surface contains a separation layer and an adhesive layer on a base material tape in this order.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决的问题：为了提供一种用于加工半导体的粘合剂膜及其制造方法，能够抑制在没有毛刺形成和切屑发生的半导体晶片粘贴之后切割时切割刀的劣化，涉及涉及用于处理凸起电极形成为从主表面突出的半导体晶片的粘合膜。解决方案：用于处理凸起电极从主表面突出的半导体晶片的加工用粘合膜在基材带上依次包含分离层和粘合剂层。版权所有（C）2011，JPO＆INPIT

3. 发明专利

JP2011071514A Adhesive for connection of circuit members, circuit board, and method of manufacturing the same 有权
标题翻译：用于连接电路元件，电路板及其制造方法的粘合剂
公开(公告)号：JP2011071514A
公开(公告)日：2011-04-07
申请号：JP2010210835
申请日：2010-09-21
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： WATANABE ITSUO , TAKEMURA KENZO , NAGAI AKIRA , ISAKA KAZUHIRO , WATANABE OSAMU , KOJIMA KAZUYOSHI
IPC分类号： H01L21/60 , C09J7/00 , C09J9/02 , C09J133/00 , C09J163/00 , H05K1/14 , H05K3/32
CPC分类号： H01L2224/16225 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2924/01005 , H01L2924/07811 , H01L2924/0665 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a circuit board that avoids an increase in connection resistance or peeling-off of an adhesive at a connected part, and greatly increases a connection reliability. SOLUTION: An adhesive 40 for connection of circuit members is provided between a first circuit member having a first connection terminal and a second circuit member which is opposed to the first connection terminal and which has a second connection terminal, to electrically connect the first and second connection terminals. The adhesive includes third and fourth adhesive layers. The third adhesive layer has a glass transition temperature not lower than 120°C, and the fourth adhesive layer has a glass transition temperature lower than that of the third adhesive layer. The third adhesive layer is bonded to one of the first and second circuit members having a relatively large elastic modulus, and the fourth adhesive layer is bonded to the other having a relatively small elastic modulus. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种电路板，其避免连接部分处的粘合剂的连接电阻增加或剥离，并且大大增加连接可靠性。解决方案：用于连接电路部件的粘合剂40设置在具有第一连接端子的第一电路部件和与第一连接端子相对并且具有第二连接端子的第二电路部件之间，以电连接第一和第二连接端子。粘合剂包括第三和第四粘合剂层。第三粘合层的玻璃化转变温度不低于120℃，第四粘合剂层的玻璃化转变温度低于第三粘合剂层的玻璃化转变温度。第三粘合剂层结合到具有较大弹性模量的第一和第二电路构件中的一个上，并且第四粘合层粘结到具有相对较小的弹性模量的另一个。版权所有（C）2011，JPO＆INPIT

4. 发明专利

JP2009147361A Adhesive for circuit member connection, circuit board, and manufacturing method thereof 有权
标题翻译：用于电路会议连接的电路，电路板及其制造方法
公开(公告)号：JP2009147361A
公开(公告)日：2009-07-02
申请号：JP2009032626
申请日：2009-02-16
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： WATANABE ITSUO , TAKEMURA KENZO , NAGAI AKIRA , ISAKA KAZUHIRO , WATANABE OSAMU , KOJIMA KAZUYOSHI
IPC分类号： H01L21/60 , C09J5/00 , C09J7/00 , C09J11/04 , C09J11/06 , C09J133/00 , C09J133/14 , C09J163/00 , C09J201/00
CPC分类号： H01L2224/16225 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2924/01005 , H01L2924/07811 , H01L2924/0665 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an adhesive for circuit member connection, which is free from the increase of connection resistance and exfoliation of a connecting agent at a connection part and considerably improves connection reliability, a circuit board having circuit members connected to each other, and the manufacturing method thereof. SOLUTION: The adhesive 40 for circuit member connection is interposed between circuit electrodes facing each other to electrically connect electrodes in a pressurizing direction by direct contact by applying a pressure to the circuit electrodes facing each other and contains an adhesive resin composition and an insulating inorganic filler and the circuit member connecting adhesives 40 containing 10 to 200 pts.wt. of the insulating inorganic filler with respect to 100 pts.wt. of the adhesive resin composition, and the adhesive 40 is used to connect circuit members to each other. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种用于电路构件连接的粘合剂，其不会在连接部分处增加连接电阻和连接剂的剥离，并且显着提高连接可靠性，电路板具有连接到彼此及其制造方法。解决方案：用于电路构件连接的粘合剂40插入在彼此相对的电路电极之间，通过对彼此面对的电路电极施加压力直接接触而使电极在加压方向上电连接，并且包含粘合剂树脂组合物和绝缘无机填料和连接粘合剂40的电路构件，其含有10〜200重量份的绝缘无机填料相对于100重量份的粘合剂树脂组合物，并且粘合剂40用于将电路构件彼此连接。版权所有（C）2009，JPO＆INPIT

5. 发明专利

JP2009105449A Circuit connection member and circuit board 审中-公开
标题翻译：电路连接器和电路板
公开(公告)号：JP2009105449A
公开(公告)日：2009-05-14
申请号：JP2009027377
申请日：2009-02-09
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： WATANABE ITSUO , TAKEMURA KENZO , NAGAI AKIRA , ISAKA KAZUHIRO , WATANABE OSAMU , KOJIMA KAZUYOSHI
IPC分类号： H01L21/60 , H05K3/32
摘要： PROBLEM TO BE SOLVED: To provide a circuit connection member which is used for connection between an electronic component and an circuit substrate, can relax a stress on a circuit connection interface, does not cause an increase of a connection resistance and peeling of an adhesive on the connection portion even after a reliability test, and the connection reliability is significantly improved; and to provide a circuit board excellent in the connection reliabilty.
SOLUTION: The circuit connection member is used for connection between an IC chip and printed substrate, or connection between an IC chip and flexible wiring board, and connects electrically between electrodes located in a direction of pressing by heating and pressing electrodes faced. The member contains a composition of adhesive comprising as an essential component: (A) an epoxy resin having dispersed rubber particles of a diameter 0.02-1 μm; and (B) a latent curing agent.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供用于电子部件和电路基板之间的连接的电路连接部件，可以使电路连接接口上的应力松弛，不会导致连接电阻的增加和剥离甚至在可靠性测试之后的连接部分上的粘合剂，并且连接可靠性显着提高; 并提供在连接可靠性方面优异的电路板。电路连接部件用于IC芯片与印刷基板之间的连接，或IC芯片与柔性布线基板之间的连接，并且通过面对的加热和加压电极而位于按压方向的电极之间电连接。该成员含有包含作为主要成分的粘合剂组合物：（A）具有分散的直径为0.02-1μm的橡胶颗粒的环氧树脂; 和（B）潜伏性固化剂。版权所有（C）2009，JPO＆INPIT

6. 发明专利

JP2008300360A Connecting method of electrode 有权
标题翻译：电极连接方法
公开(公告)号：JP2008300360A
公开(公告)日：2008-12-11
申请号：JP2008189038
申请日：2008-07-22
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TSUKAGOSHI ISAO , HIROZAWA YUKIHISA , KOBAYASHI KOJI , NAKAJIMA ATSUO , MATSUOKA HIROSHI , WATANABE ITSUO , TAKEMURA KENZO , SHIOZAWA NAOYUKI , KOJIMA KAZUYOSHI , WATANABE OSAMU , OTA TOMOHISA
IPC分类号： C09J5/00 , C09J7/02 , C09J9/02 , H01R11/01
摘要： PROBLEM TO BE SOLVED: To provide a connecting method of an electrode using a connecting member, excellent in connection reliability for a long time, free from accurate positioning between a conductive particle and an electrode, and with high resolution, capable of avoiding unnecessary adhesion and preventing dust or the like from attaching, and aiming at continuous automation of a connection work process with excellent workability. SOLUTION: The connecting method of an electrode uses a circuit connecting member made by forming a hardenable insulation adhesive layer 2 on one side of a conductive adhesive layer 1 made of a conductive material 3 and a binder having conductivity in a pressure direction, and connecting a peelable separator to the hardenable insulation adhesive layer 2. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供使用连接部件的电极的连接方法，长时间连接可靠性优异，没有导电颗粒和电极之间的精确定位，并且具有高分辨率，能够避免不必要的粘合和防止灰尘等附着，并且旨在连续工作过程的连续自动化，具有优异的可加工性。解决方案：电极的连接方法使用通过在由导电材料3制成的导电粘合剂层1和在压力方向上具有导电性的粘合剂的一侧上形成可硬化绝缘粘合剂层2而制成的电路连接构件，并将可剥离分离器连接到可硬化绝缘粘合剂层2上。版权所有（C）2009，JPO＆INPIT

7. 发明专利

JP2007107008A Film-shaped adhesive and method for producing laminate 审中-公开
标题翻译：薄膜形粘结剂及其生产方法
公开(公告)号：JP2007107008A
公开(公告)日：2007-04-26
申请号：JP2006307141
申请日：2006-11-13
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： WATANABE ITSUO , TAKEMURA KENZO , NAGAI AKIRA , ISAKA KAZUHIRO , WATANABE OSAMU , KOJIMA KAZUYOSHI
IPC分类号： C09J171/10 , C09J7/00 , C09J133/00 , C09J163/00 , H01B1/22 , H01B5/16 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide a film-shaped adhesive enabling manufacture of a circuit board hardly causing increase of connection resistance and separation of adhesive at a connecting part, and having extremely improved connection reliability to be produced.
SOLUTION: A solution is obtained by dissolving a phenoxy resin and an acrylic rubber in ethyl acetate. A solution for film coating is obtained by adding a liquid epoxide containing a microcapsule-type latent curing agent to the solution, stirring the resultant mixture, and dispersing 60 pts.wt. fumed silica based on 100 pts.wt. adhesive composition in the resultant mixture. An adhesive film 1 is produced from the solution. An adhesive film 2 having 25 μm thickness is produced by the similar method except the dispersion of nickel particles instead of the dispersion of the fumed silica in the production of the adhesive film 1. The adhesion is carried out by sticking the adhesive film 2 of the film-shaped adhesive to a Ni/Au-plated Cu circuit printed board, facing a chip to the adhesive film 1 side, positioning the bump of the chip and the Ni/Au-plated Cu circuit printed board, and heating and pressurizing the positioned product.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够制造电路板的薄膜状粘合剂，几乎不会导致连接部分的连接电阻增加和粘合剂分离，并且具有极高的连接可靠性得到制造。解决方案：通过将苯氧基树脂和丙烯酸橡胶溶解在乙酸乙酯中获得溶液。通过向溶液中加入含有微胶囊型潜在性固化剂的液体环氧化物，搅拌所得混合物，并分散60重量份，得到薄膜包衣溶液。基于100重量份的气相二氧化硅所得混合物中的粘合剂组合物。从该溶液制备粘合膜1。除了在制造粘合剂膜1之前，除了分散于镍颗粒之外的热解法二氧化硅的分散以外，通过类似的方法制造厚度为25μm的粘合膜2.通过将粘合剂膜2 将薄膜状粘合剂贴合到镀Ni / Au的Cu电路印刷电路板上，面向粘合膜1侧的芯片，定位芯片的凸块和镀Ni / Au的Cu电路印刷电路板，并对定位的加热和加压产品。版权所有（C）2007，JPO＆INPIT

8. 发明专利

JP2012209558A Anisotropic conductive adhesive for circuit member connection 审中-公开
标题翻译：用于电路会员连接的各向导性粘合剂
公开(公告)号：JP2012209558A
公开(公告)日：2012-10-25
申请号：JP2012098913
申请日：2012-04-24
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： WATANABE ITSUO , TAKEMURA KENZO , NAGAI AKIRA , ISAKA KAZUHIRO , WATANABE OSAMU , KOJIMA KAZUYOSHI
IPC分类号： H01L21/60 , C09J7/00 , C09J9/02 , C09J11/04 , C09J11/06 , C09J133/00 , C09J163/00 , H01B1/20 , H05K1/14 , H05K3/32
摘要： PROBLEM TO BE SOLVED: To provide an adhesive with which a circuit board hardly causing an increase of connection resistance at a connection and separation of an adhesive and remarkably improved in connection reliability can be manufactured.SOLUTION: An anisotropic conductive adhesive for circuit member connection is interposed between circuit electrodes facing with each other and, when pressure is applied between the circuit electrodes facing with each other, electrically connects between the electrodes in the pressurized direction. The adhesive contains: an adhesive resin composition including an epoxy resin having a skeleton including at least one naphthalene ring in one molecule and a latent curing agent; an inorganic filler selected from a group consisting of fused silica, crystalline silica, calcium silicate, alumina and calcium carbonate and having an average particle size of 3 μm or less; and a conductive particle. A content of the inorganic filler in the adhesive is 40-90 pts. wt. relative to 100 pts. wt. of the adhesive resin composition, and an average thermal expansion coefficient at 120-140°C after curing of the adhesive is 120 ppm or less.
摘要翻译：要解决的问题：为了提供一种电路板几乎不会导致连接处的连接电阻增加并且粘合剂分离并且显着提高连接可靠性的粘合剂。解决方案：用于电路构件连接的各向异性导电粘合剂插入在彼此面对的电路电极之间，并且当在彼此面对的电路电极之间施加压力时，在加压方向上电连接电极。粘合剂包含：粘合树脂组合物，其包含在一分子中具有至少一个萘环的骨架的环氧树脂和潜在性固化剂; 选自熔融二氧化硅，结晶二氧化硅，硅酸钙，氧化铝和碳酸钙的平均粒径为3μm以下的无机填料; 和导电颗粒。粘合剂中无机填料的含量为40-90点。重量。相对于100点。重量。，粘合剂固化后的120-140℃的平均热膨胀系数为120ppm以下。版权所有（C）2013，JPO＆INPIT

9. 发明专利

JP2011171711A Adhesive film for semiconductor wafer processing 有权
标题翻译：用于半导体波导处理的粘合膜
公开(公告)号：JP2011171711A
公开(公告)日：2011-09-01
申请号：JP2010277311
申请日：2010-12-13
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： WATANABE OSAMU , TAKEMURA KENZO , SATO SHIN , KAWABATA YASUNORI , NAGAI AKIRA
IPC分类号： H01L21/304 , C09J7/02 , C09J11/04 , C09J11/06 , C09J201/00
CPC分类号： H01L21/6836 , H01L2221/68327 , H01L2221/6834
摘要： PROBLEM TO BE SOLVED: To provide an adhesive film for a semiconductor wafer processing that actualizes uniform and flat backgrind of a semiconductor wafer, allows a base film to be easily peeled from an adhesive layer, and hardly causes degradation in the performance of the adhesive layer. SOLUTION: The adhesive film for a semiconductor wafer processing includes a mold release layer, the adhesive layer, an isolation layer, and the base film in order on a carrier tape, and is used to process the semiconductor wafer, wherein each of the adhesive layer, isolation layer and base film is formed in a wafer shape of substantially the same size with the semiconductor wafer to be processed. COPYRIGHT: (C)2011,JPO&INPIT

10. 发明专利

JP2011165822A Film for processing semiconductor wafer, and method of manufacturing semiconductor chip using the film 有权
标题翻译：用于处理半导体膜的膜和使用膜制造半导体芯片的方法
公开(公告)号：JP2011165822A
公开(公告)日：2011-08-25
申请号：JP2010025702
申请日：2010-02-08
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： SATO SHIN , TAKEMURA KENZO , NAGAI AKIRA , WATANABE OSAMU , KAWABATA YASUNORI
IPC分类号： H01L21/301 , H01L21/304 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide a film for processing a semiconductor wafer, reduced in manufacturing cost while existing manufacturing processes are utilized, and also to provide a method of manufacturing a semiconductor chip using the film.
SOLUTION: In a film 10 used for processing a semiconductor wafer, a separating layer 2 and an adhesive agent layer 3 are laminated on a base material 1 in this order. The adhesive agent layer 3 is individualized in a shape covering the whole of the semiconductor wafer to which the film 10 for processing a semiconductor wafer is bonded, and thereby, a plurality of individualized adhesive agent layers 3 exist on the separating layer 2.
COPYRIGHT: (C)2011,JPO&INPIT

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