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51. 发明专利

JP2002359223A CLEANING LIQUID 失效
公开(公告)号：JP2002359223A
公开(公告)日：2002-12-13
申请号：JP2001163303
申请日：2001-05-30
申请人： SHIBAURA MECHATRONICS CORP , TOSHIBA CORP , TAMA KAGAKU KOGYO KK
发明人： HIRABAYASHI HIDEAKI , HAYASHI TOSHIHIDE , NONAKA MIKIO , SAKURAI NAOAKI , KATO KATSUHIRO
IPC分类号： B01D19/04 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a cleaning liquid that can remove a complex layer on the surface of an embedded wiring of Cu appropriately, without damaging embedded wiring of Cu after CMP in the formation process of the embedded wiring made of Cu or a Cu alloy in the manufacture of an electronic device such as a semiconductor device. SOLUTION: The washing liquid is used after a thin film made of copper or a copper alloy is polished chemically and mechanically by a polishing composition that contains water-soluble organic acid for generating a copper complex that reacts to copper, is insoluble to water substantially, and at the same time, is mechanically more brittle than copper. In this case, the cleaning liquid is to contain at least one kind of organic alkali.

52. 发明专利

JP2001012632A FLOW RATE REGULATION VALVE AND FLOW RATE REGULATION SYSTEM 失效
公开(公告)号：JP2001012632A
公开(公告)日：2001-01-16
申请号：JP34049999
申请日：1999-11-30
申请人： TOKYO KEISO KK , TOSHIBA CORP
发明人： WATANABE YASUSHI , SENDA KEIICHIRO , FUJITA HIROSHI , HAYAMIZU NAOYA , HIRABAYASHI HIDEAKI
IPC分类号： F16K7/12 , F16K31/00 , F16K31/02 , F16K31/50 , H02N2/00
摘要： PROBLEM TO BE SOLVED: To hold the opening of a valve hole in a prescribed, value even if the electric power supply to a drive machine is stopped by rotating the rotary shaft of the drive machine by an ultrasonic vibration. SOLUTION: The drive machine 4 of a flow rate regulation valve 7 is constituted by an ultrasonic motor and the vibration of an ultrasonic wave area is generated on the upper surface of a stator by supplying the high frequency voltage having the frequency of several decades kiro-cycle extent to the piezoelectric element 25 of a stator 23 and a rotor is rotated by this vibration. Therefore, when the opening of a valve hole is set in a prescribed value, even if the electric power supply to the drive machine 4 is stopped, as the rotor 26 is press-contacted to the stator 23 by a push-press force of a pressurization spring 27 in the drive machine 4, the rotary shaft 18 is held and fixed and the opening of the valve hole is kept in a prescribed value. Thus, as the rotary angle of the drive machine operated by the ultrasonic wave vibration is controlled by the number of vibration of the high frequency voltage, the resolving power is extremely high and controlled in a high accuracy and moreover there is not mis-operation by a surrounding magnetic force.

53. 发明专利

JPH1190816A POLISHING DEVICE AND POLISHING METHOD 失效
公开(公告)号：JPH1190816A
公开(公告)日：1999-04-06
申请号：JP25733497
申请日：1997-09-22
申请人： TOSHIBA CORP
发明人： HIRABAYASHI HIDEAKI , INO TAKAO , FURUYA MASAAKI
IPC分类号： B24B37/013 , B24B37/07 , B24B37/10 , B24B53/017 , H01L21/304 , B24B37/04 , B24B37/00
摘要： PROBLEM TO BE SOLVED: To uniformly polish a wafer by arranging a polish section having a polishing face with an area smaller than that of the wafer oppositely to a wafer hold section. SOLUTION: A surface plate 21 is rotated by a drive mechanism 22, a polishing fabric holding mechanism 31 is reciprocated in the directions of arrows X, Y by a positioning mechanism 33, and a polishing fabric holding board 35 is rotated by a drive mechanism 36. A polishing liquid L is fed by a polishing liquid feed nozzle 51. The diameter of a polishing fabric 34 is formed smaller than the diameter of a wafer W held by a wafer hold section 20. Even if the wafer W has a nonuniform portion in thickness, the portion can be concentrically polished, thus the wafer W can be uniformly polished finally.

54. 发明专利

JPH10242088A WAFER POLISHING APPARATUS 失效
公开(公告)号：JPH10242088A
公开(公告)日：1998-09-11
申请号：JP4055697
申请日：1997-02-25
申请人： TOSHIBA CORP
发明人： HIRABAYASHI HIDEAKI , SAKURAI NAOAKI
IPC分类号： H01L21/304
摘要： PROBLEM TO BE SOLVED: To surely clean a wafer holding mechanism and avoid impeding the holding condition of a wafer with this mechanism, by providing means for measuring the cleanness of a cleaning liq. for cleaning this mechanism for holding the wafer on a wafer polisher at cleaning by a cleaner. SOLUTION: A top ring 25 is rotated with feeding a polishing liq. on a polishing board 8 from a polishing liq. feed nozzle 12, while this board 8 is rotated to polish a mirror wafer 11. The polished wafer pasted on the top ring 25 is released from the holding condition by a releaser 3 and carried to a wafer mount by a carrier, an arm is rotated to move the ring 25 to a first cleaner mechanism 5 at the opposite end of the board 8 to face the ring 25 at a brush 17, and a head 25b of the ring 25 is rotated to clean its bottom face to remove particles.

55. 发明专利

JPH07275817A SUPERSONIC CLEANING DEVICE 失效
公开(公告)号：JPH07275817A
公开(公告)日：1995-10-24
申请号：JP7369994
申请日：1994-04-13
申请人： TOSHIBA CORP
发明人： HIRABAYASHI HIDEAKI , SAKURAI NAOAKI
IPC分类号： B06B1/02 , B08B3/12 , G03F1/82 , H01L21/304 , G03F1/08
摘要： PURPOSE:To prevent the lowering of supersonic cleaning capability from occurring due to the variation in a vibrator with elapse of time. CONSTITUTION:This supersonic cleaning device cleaning a material to be cleaned with cleaning fluid under supersonic vibration comprises a cleaning unit 1 having a vibrator for providing supersonic vibration to the cleaning fluid, a power source section 17 for applying the voltage of a prescribed frequency to the vibrator and generating supersonic vibration, a sensor 12 for sensing sound pressure provided in the cleaning fluid and a control device 14 for controlling the frequency of voltage applied to the vibrator by driving the power source section with a sensing signal from the sensor.

56. 发明专利

JPH07161995A MANUFACTURE OF THIN-FILM SEMICONDUCTOR ELEMENT 失效
公开(公告)号：JPH07161995A
公开(公告)日：1995-06-23
申请号：JP30932893
申请日：1993-12-09
申请人： TOSHIBA CORP
发明人： HIRABAYASHI HIDEAKI
IPC分类号： H01L29/78 , H01L21/336 , H01L29/786
摘要： PURPOSE:To remove spontaneous oxide from the surface of an active layer on a transparent, insulating substrate in a dry atmosphere by treating the substrate heated in a plasma chamber containing a mixture of CH4 and H2 after an a-Si etching stopper is formed on it. CONSTITUTION:A glass substrate 31 is placed on the lower electrode 14 of a plasma etching system. A first gate valve 23 is closed and a first vacuum chamber 12 is evacuated through a duct 19. The substrate is heated by a heater 16 built in the lower electrode. The chamber 12 is supplied with CH4 and H2 (20:50) through pipes 17 and 18. High-frequency power is applied to the upper electrode 13 from a power source 15 to produce a plasma in the chamber 12, so that spontaneous oxide is removed from the surface of an active layer 36 in a dry atmosphere.

57. 发明专利

JP2002270566A CLEANING LIQUID AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 失效
公开(公告)号：JP2002270566A
公开(公告)日：2002-09-20
申请号：JP2001062030
申请日：2001-03-06
申请人： TOSHIBA CORP
发明人： HAYAMIZU NAOYA , HIRABAYASHI HIDEAKI , MATSUI YOSHITAKA
IPC分类号： C11D3/33 , C11D17/08 , H01L21/304 , H01L21/3205
摘要： PROBLEM TO BE SOLVED: To provide a cleaning liquid which can remove particles, organic impurities and metal impurities while preventing damage to a device. SOLUTION: The cleaning liquid contains 0.001% by weight or more of a compound forming a complex with metal containing at least copper or aluminium and 0.001% by weight or more of a surfactant.

58. 发明专利

JP2002190460A POLISHING CLOTH, POLISHING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 审中-公开
公开(公告)号：JP2002190460A
公开(公告)日：2002-07-05
申请号：JP2001210856
申请日：2001-07-11
申请人： TOSHIBA CORP , NOF CORP
发明人： HIRABAYASHI HIDEAKI , SAITO AKIKO , SAKURAI NAOAKI , OSHIBE YOSHIHIRO , ISHIDOYA MASAHIRO
IPC分类号： B24B37/20 , B24B37/24 , B24B49/16 , B24D3/00 , B24D3/28 , B24D3/34 , B24D11/00 , B24D13/14 , C08F20/28 , C08F22/20 , C08F24/00 , C08F30/08 , C08J5/14 , C08K3/22 , C08K3/36 , C08L101/02 , C08L101/14 , H01L21/304 , B24B37/00
摘要： PROBLEM TO BE SOLVED: To provide a polishing cloth, capable of performing stable polishing for a relatively long time without dressing. SOLUTION: The polishing cloth comprises a polishing layer, containing a polymer material such as α,β-unsaturated homopolymer or copolymer or the like to be hydrolyzed by water medium.

59. 发明专利

JP2001210644A SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD 失效
公开(公告)号：JP2001210644A
公开(公告)日：2001-08-03
申请号：JP2000016189
申请日：2000-01-25
申请人： TOSHIBA CORP
发明人： TOYODA HIROSHI , HIRABAYASHI HIDEAKI , KANEKO HISAFUMI
IPC分类号： H01L23/52 , H01L21/306 , H01L21/3205
摘要： PROBLEM TO BE SOLVED: To uniformly perform recess etching treatment to the surface of a wiring layer. SOLUTION: A process for forming a groove 16 on a silicon oxide film 14 on an Si substrate 11, a process for depositing a TaN film 17 and a Cu wiring material 18 along the surface of the silicon oxide film 14, a process for embedding the TaN film 17 and Cu damascene wiring 18 in the groove 16 by performing averaging treatment to the surface of the Cu wiring material 18 and the TaN film 17 until the silicon oxide film 14 is exposed, a process for forming a recessed part 19, by subjecting the Cu damascene wiring 18 to recess etching treatment to the Cu using an etching solution containing hydrogen peroxide water that reacts with Cu, glycine for forming a complex with the ion of Cu, and water for dissolving the complex and making the surface of the Cu damascene wiring 18 to retreat, a process for forming a TaN film 20, so that the recessed part 19 is embedded onto the Cu damascene wiring 18 and the silicon oxide film 14, and a process for forming the TaN film 20 on the recessed part 20 by performing planarizing, until the surface of the silicon oxide film 14 is exposed.

60. 发明专利

JP2000317811A SLURRY SUPPLYING APPARATUS AND METHOD, AND POLISHING APPARATUS AND METHOD 失效
公开(公告)号：JP2000317811A
公开(公告)日：2000-11-21
申请号：JP13015099
申请日：1999-05-11
申请人： TOSHIBA CORP
发明人： FUJITA HIROSHI , INO TAKAO , HIRABAYASHI HIDEAKI
IPC分类号： B24B37/00
摘要： PROBLEM TO BE SOLVED: To provide a slurry supplying apparatus and method, and a polishing apparatus and method which are capable of maintaining a supply amount of slurry at a constant. SOLUTION: This slurry supplying apparatus 20 for supplying slurry 22 to an article to be polished has a slurry tank 21 for storing the slurry 22, a pump 24 for pumping the slurry 22 stored in the slurry tank 21, a flow meter 26 for measuring a flow rate of the slurry 22 sucked by the pump 24, a controller 27 for controlling a suction operation of the pump 24 based on the measurement of the flow meter 26, and a three-way valve 29 for switching a flow of the slurry 22 passing through the flow meter 26 between a side of the slurry tank 21 and a side of the article to be polished.

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