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51. 发明专利

JP5171405B2 Interposer joining method 有权
公开(公告)号：JP5171405B2
公开(公告)日：2013-03-27
申请号：JP2008148264
申请日：2008-06-05
申请人：株式会社ハリーズ
发明人：良一西川 , 博司青山
IPC分类号： H05K3/34 , H01L21/60 , H01L23/32 , H05K3/32
CPC分类号： H01L2224/83192

52. 发明专利

JP4838136B2 Transfer device 有权
公开(公告)号：JP4838136B2
公开(公告)日：2011-12-14
申请号：JP2006536403
申请日：2005-09-21
申请人：株式会社ハリーズ
发明人：良一西川 , 博司青山
IPC分类号： B65G47/84
CPC分类号： B65G47/848 , A61F13/15764 , B65G29/00 , F16C19/54 , F16C19/55 , F16C35/061 , H01L21/67144

53. 发明专利

JP2011101942A Grinding device, grinding method and method of manufacturing thin plate-like member 有权
标题翻译：研磨装置，研磨方法和制造薄板状构件的方法
公开(公告)号：JP2011101942A
公开(公告)日：2011-05-26
申请号：JP2010186467
申请日：2010-08-23
申请人： Hallys Corp , 株式会社ハリーズ
发明人： AOYAMA HIROSHI , NISHIKAWA RYOICHI , SUGIMOTO NORIHIKO , HAYASHIDA TORU
IPC分类号： B24B47/22 , B24B9/00 , B24B9/10 , B24B49/12
摘要： PROBLEM TO BE SOLVED: To provide a grinding device capable of performing grinding work without arranging a mark on a surface of thin plate glass while accurately performing work by performing the grinding work by using photographing data of a camera when grinding an end surface of the thin plate glass used for a display image screen of a portable terminal such as a cellular phone.
SOLUTION: In S4, the machine origin of a work stage is calculated from a position of a reference pin. In S5, a gravity center position of an external shape of an actual work and a gravity center position of a hole are calculated from data on the actual work. Afterwards, in S6, the gravity center position of the actual work (the gravity center position of the external shape and the gravity center position of the hole part) and a gravity center position of a model (the gravity center position of the external shape and the gravity center position of the hole part) are made to coincide with each other. In S7, the machine origin of the work stage is compared with the gravity center position of the actual work, and a dislocation quantity from the machine origin (a dislocation quantity X in the horizontal direction, a dislocation quantity Y in the vertical direction and a dislocation quantity θ in the rotational direction) is arithmetically operated. The actual work Wi is compared with Wm, and a shave-in quantity Δw is also arithmetically operated by an external shape difference.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够进行磨削加工而不在薄板玻璃的表面上设置标记的研磨装置，同时通过在研磨端面时通过使用照相机的拍摄数据进行研磨工作来精确地进行加工用于便携式终端如蜂窝电话的显示图像屏幕的薄板玻璃。
解决方案：在S4中，从基准销的位置计算工作台的机器原点。在S5中，根据实际工作的数据计算出实际作业的外部形状的重心位置和孔的重心位置。此后，在S6中，实际作业的重心位置（外部的重心位置和孔部的重心位置）和模型的重心位置（外形的重心位置孔部分的重心位置）彼此重合。在S7中，将工作台的机器原点与实际作业的重心位置进行比较，从机器原点（水平方向的位错量X，垂直方向的位错量Y，位移量θ在旋转方向上）被算术运算。实际工作Wi与Wm进行比较，剃须量Δw也由外部形状差异算术运算。版权所有（C）2011，JPO＆INPIT

54. 发明专利

JP2011083853A Grinder 审中-公开
标题翻译：磨床
公开(公告)号：JP2011083853A
公开(公告)日：2011-04-28
申请号：JP2009237946
申请日：2009-10-15
申请人： Hallys Corp , 株式会社ハリーズ
发明人： AOYAMA HIROSHI , NISHIKAWA RYOICHI , SUGIMOTO NORIHIKO , SADA HIROSHI , CHIKAHIRA JUNICHI
IPC分类号： B24B49/12 , B24B55/02
摘要： PROBLEM TO BE SOLVED: To provide a grinder for photographing a workpiece illuminated by a lighting apparatus by a camera and grinding the workpiece utilizing the photographic data, which can improve accuracy in grinding by surely preventing the illuminating light of the lighting apparatus from leaking outside to make a workpiece position clear in the photographic data, and in addition can keep illuminating performance of the lighting apparatus by surely preventing the lighting apparatus from being influenced by grinding cooling water. SOLUTION: An illumination frame 52 is located inward from a sidewall 36a of a catch pan 36 by an illumination moving unit when photographing the workpiece W, and is located outward from the sidewall 36a of the catch pan 36 when grinding the workpiece W. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于通过照相机拍摄由照明装置照亮的工件的研磨机，并且利用摄影数据研磨工件，这可以通过可靠地防止照明装置的照明光提高研磨精度泄漏到外面以使照相数据中的工件位置清晰，并且通过可靠地防止照明装置受到研磨冷却水的影响，可以保持照明装置的照明性能。解决方案：当拍摄工件W时，照明框架52通过照明移动单元从捕获盘36的侧壁36a向内定位，并且当研磨工件W时从照明框架52的侧壁36a向外定位版权所有（C）2011，JPO＆INPIT

55. 发明专利

JP2011083852A Grinder 有权
标题翻译：磨床
公开(公告)号：JP2011083852A
公开(公告)日：2011-04-28
申请号：JP2009237945
申请日：2009-10-15
申请人： Hallys Corp , 株式会社ハリーズ
发明人： AOYAMA HIROSHI , NISHIKAWA RYOICHI , SUGIMOTO NORIHIKO , SADA HIROSHI
IPC分类号： B24B49/12 , B24B9/10
摘要： PROBLEM TO BE SOLVED: To provide a grinder for grinding a workpiece utilizing data photographed by a camera, which includes a plurality of working stages to improve production efficiency of the workpiece, in addition, can prevent enlargement of an apparatus, prevent an increase in cost and also prevent grinding cooling water from attaching to the camera. SOLUTION: The grinder includes: a plurality of working stages 30 for grinding the workpiece W; a put-in/out stage 4 for putting in and out the workpiece W; a conveyance robot 2 for carrying respective workpieces W between the respective working stages 30 and the put-in/out stage 4; and the camera 23 provided on the conveyance robot 2. The respective working stages 30 are photographed by the camera 23, and image data to be used in the respective working stages 30 is acquired. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种用于利用由照相机拍摄的数据来研磨工件的研磨机，其包括多个工作台以提高工件的生产效率，另外，可以防止装置的放大，防止增加成本，并且还防止冷却水附着在相机上。解决方案：研磨机包括：多个用于研磨工件W的工作台30; 用于放入和取出工件W的放入/退出阶段4; 输送机器人2，用于承载各工作台30与放入/退出台4之间的工件W; 以及设置在输送机器人2上的相机23.由相机23拍摄各个工作台30，并且获取在各个工作阶段30中使用的图像数据。版权所有（C）2011，JPO＆INPIT

56. 发明专利

JP4628067B2 Bonding method, and the electronic component of the interposer. 有权
公开(公告)号：JP4628067B2
公开(公告)日：2011-02-09
申请号：JP2004329658
申请日：2004-11-12
申请人：株式会社ハリーズ
发明人：良一西川 , 博司青山
IPC分类号： H05K3/32 , G06K19/077 , H01L23/12
CPC分类号： H05K3/326 , H01L21/4857 , H01L23/49833 , H01L2224/32225 , H05K1/189 , H05K3/305 , H05K2201/091 , H05K2201/10727 , H05K2201/10977 , H05K2203/1189

57. 发明专利

JP2010160706A Contactless ic tags 审中-公开
标题翻译：不间断IC标签
公开(公告)号：JP2010160706A
公开(公告)日：2010-07-22
申请号：JP2009002991
申请日：2009-01-08
申请人： Hallys Corp , 株式会社ハリーズ
发明人： AOYAMA HIROSHI , NISHIKAWA RYOICHI , HAYASHIDA TORU
IPC分类号： G06K19/077 , B42D15/10 , G06K19/07
摘要： PROBLEM TO BE SOLVED: To provide a contactless IC tags capable of providing a final product inexpensively as possible by eliminating a lamination process by means of a laminated layer in the contactless IC tags to be used in an RFID technology. SOLUTION: An adhesive material 7 applied in almost the same range as a sheet substrate 2 is layered at a lower position of a strap member 5 and the sheet substrate 2. The adhesive material 7 is set so that it has adhesiveness to be adhered and fixed to an article or the like when a release paper 8 is peeled off, and is applied all over the lower side of the sheet substrate 2 by an adhesive material application device. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种非接触IC标签，其能够通过在RFID技术中使用的非接触IC标签中通过层叠层去除层压处理，从而廉价地提供最终产品。＆lt;解决方案＆gt;在带状部件5和片基材2的下部位置层叠与片基材2大致相同的粘合剂材料7。粘接材料7的粘合性为当剥离纸8被剥离时，粘附并固定在物品等上，并且通过粘合剂施加装置施加到片状基板2的整个下侧。版权所有（C）2010，JPO＆INPIT

58. 发明专利

JP2009295811A Interposer bonding method 有权
标题翻译：插件连接方式
公开(公告)号：JP2009295811A
公开(公告)日：2009-12-17
申请号：JP2008148264
申请日：2008-06-05
申请人： Hallys Corp , 株式会社ハリーズ
发明人： NISHIKAWA RYOICHI , AOYAMA HIROSHI
IPC分类号： H05K3/34 , H01L21/60 , H01L23/32 , H05K3/32
CPC分类号： H01L2224/83192
摘要： PROBLEM TO BE SOLVED: To provide an interposer bonding method capable of physically, electrically and highly surely bonding an interposer and a base circuit sheet to each other.
SOLUTION: The interposer bonding method includes: an adhesive applying step of providing an adhesive arrangement layer 25 made of an electrically insulating adhesive, on a surface of a base-side terminal 22 out of a surface of a base circuit sheet 20; an interposer disposing step of disposing an interposer 10 on the surface of the base circuit sheet 20; and a pressure bonding step of applying a pressure to the base circuit sheet 20 and the interposer 10. The base-side terminal 22 of the base circuit sheet 20 before bonding of the interposer 10 is formed with a concave recess 220 where a bump electrode 26 is stored. In the pressure bonding step, the bump electrode 26 stored in the recess 220 is pushed up into press contact with an interposer-side terminal 12 by deforming the recess 220 so as to push up it from the bottom.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够将内插器和基底电路板物理地，电连接并且高度可靠地接合的插入件接合方法。插入物接合方法包括：粘合剂涂布步骤，在基底电路板20的表面的基底侧端子22的表面上设置由电绝缘性粘合剂构成的粘合剂排列层25; 将基板电路片20的表面上设置插入件10的插入件配置工序; 以及对基底电路片20和插入件10施加压力的压接工序。在插入件10的接合之前，基底电路片20的基底侧端子22形成有凹部凹部220，凸部电极26 被存储。在压接工序中，通过使凹部220变形从底部向上方推出，将存储在凹部220中的凸块电极26向上推入与插入件侧端子12进行压接。版权所有（C）2010，JPO＆INPIT

59. 发明专利

JP4091096B2 Interposer bonding apparatus 有权
公开(公告)号：JP4091096B2
公开(公告)日：2008-05-28
申请号：JP2006546658
申请日：2005-12-03
申请人：株式会社ハリーズ
发明人：良一西川 , 博司青山
IPC分类号： H05K13/04 , G06K19/077 , H01L21/60 , H05K13/02
CPC分类号： G06K19/07749 , G06K19/07718 , G06K19/07752 , H01L23/66 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/83 , H01L24/97 , H01L2223/6677 , H01L2224/2919 , H01L2224/32225 , H01L2224/83192 , H01L2224/83205 , H01L2224/83385 , H01L2224/97 , H01L2924/07802 , H01L2924/14 , H01L2924/1421 , H05K3/323 , Y10T29/4913 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187 , H01L2224/83 , H01L2924/00
摘要： An interposer bonding device 3 bondes an interposer 10 having an interposer-side terminal to a base circuit sheet 20 provided with a base-side terminal. The interposer bonding device 3 has a press anvil 31 that holds the base circuit sheet 20 on which the interposer 10 is laminated and a bonding head 32 that moves with respect to the press anvil 31. The bonding head 32 has a pressing surface 320 that presses the rear surface of the interposer by abutting against this surface. The pressing surface 320 scans the rear surface of the interposer 10 by the relative movement of the bonding head 32 with respect to the press anvil 31 and presses the whole surface of the interposer-side terminal 12 toward the base circuit sheet 20.

60. 发明专利

JP3739752B2 Random cycle speed possible piece transfer device 有权
公开(公告)号：JP3739752B2
公开(公告)日：2006-01-25
申请号：JP2003031165
申请日：2003-02-07
申请人：株式会社ハリーズ
发明人：良一西川 , 博司青山
IPC分类号： H05K13/04 , G06K19/077 , H01L21/00 , H05K13/00 , H05K13/02 , H05K13/08
CPC分类号： B65G47/848 , B65G29/00 , G06K19/07718 , G06K19/07749 , G06K19/0775 , H01L21/67132 , H01L21/67144 , H05K13/02 , Y10T29/49004 , Y10T29/4913 , Y10T29/53039 , Y10T29/5313 , Y10T29/53174 , Y10T29/53178 , Y10T29/53191

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