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    • 42. 发明专利
    • Cleaning device and cleaning method
    • 清洁装置和清洁方法
    • JP2010027641A
    • 2010-02-04
    • JP2008183499
    • 2008-07-15
    • Sumitomo Electric Ind Ltd住友電気工業株式会社
    • SASAKI MAKOTOHARADA MAKOTO
    • H01L21/304
    • PROBLEM TO BE SOLVED: To provide a cleaning device and a cleaning method of a semiconductor substrate or the like which effectively suppress reattachment while suppressing adverse effect on quality of the semiconductor substrate or the like.
      SOLUTION: The cleaning device 1 cleans an SiC substrate 50 as an object to be cleaned, which is formed of a semiconductor or material including the semiconductor. The cleaning device includes a cleaning tank 11 for holding a cleaning liquid 16, a substrate holder 12 arranged inside the cleaning tank 11 for holding the SiC substrate 50, a heater 13 for convecting the cleaning liquid 16 by adjusting a temperature of the cleaning liquid 16, and a filter 14 for trapping deposit dropped from the SiC substrate 50.
      COPYRIGHT: (C)2010,JPO&INPIT
    • 解决的问题:提供一种半导体衬底等的清洁装置和清洁方法,其有效地抑制重新附着,同时抑制对半导体衬底等的质量的不利影响。 解决方案:清洁装置1清洁作为由包括半导体的半导体或材料形成的作为被清洁物体的SiC基板50。 清洁装置包括:用于保持清洗液16的清洗槽11;布置在清洗槽11内用于保持SiC基板50的基板保持件12;加热器13,用于通过调节清洗液16的温度来对准清洗液16 ,以及用于捕获从SiC衬底50掉落的沉积物的过滤器14.权利要求:(C)2010,JPO&INPIT
    • 47. 发明专利
    • Manufacturing apparatus and method of silicon carbide single crystal substrate
    • 碳化硅单晶基板的制造装置及方法
    • JP2014159347A
    • 2014-09-04
    • JP2013030782
    • 2013-02-20
    • Sumitomo Electric Ind Ltd住友電気工業株式会社
    • OI NAOKIKAWASE TOMOHIROFUJIWARA SHINSUKESASAKI MAKOTONISHIGUCHI TAROHORI TSUTOMUUEDA SHUNSAKU
    • C30B29/36C30B23/06
    • PROBLEM TO BE SOLVED: To provide a manufacturing apparatus and method of a silicon carbide single crystal substrate that can reduce a variation of crystal quality in the surface of a silicon carbide single crystal substrate and reduce a stress generated in a silicon carbide single crystal during growth of the silicon carbide single crystal.SOLUTION: A manufacturing apparatus 11 of a silicon carbide single crystal substrate 100a includes a raw material housing part 8 and a seed substrate holding part 1. The seed substrate holding part 1 is disposed at a position opposed to the raw material housing part 8. The seed substrate holding part 1 comprises a plate part 2 having a first principal surface 2a and a second principal surface 2b which are opposed to each other, a body part 4 in contact with the first principal surface 2a of the plate part 2, and a connection part 3 for fixing the plate part 2 to the body part 4. The thickness T1 of the plate part 2 is less than the thickness T2 of the body part 4.
    • 要解决的问题:提供一种碳化硅单晶基板的制造装置和方法,其可以减少碳化硅单晶基板的表面的晶体质量的变化,并减少生长期间在碳化硅单晶中产生的应力 的碳化硅单晶。解决方案:碳化硅单晶基板100a的制造装置11包括原料收容部8和种子基板保持部1.种子基板保持部1配置在与 种子基板保持部分1包括具有彼此相对的第一主表面2a和第二主表面2b的板部分2,与第一主表面2a接触的主体部分4 板部2,以及用于将板部2固定在主体部4上的连接部3.板部2的厚度T1小于第 e身体部分4。
    • 48. 发明专利
    • Silicon carbide substrate, silicon carbide ingot and method for producing those
    • 硅碳化硅基体,碳化硅烧结体及其制造方法
    • JP2013087005A
    • 2013-05-13
    • JP2011227771
    • 2011-10-17
    • Sumitomo Electric Ind Ltd住友電気工業株式会社
    • SASAKI MAKOTONISHIGUCHI TARO
    • C30B29/36
    • C30B29/36C30B23/025C30B23/06C30B23/063Y10T428/24273Y10T428/24488
    • PROBLEM TO BE SOLVED: To provide a silicon carbide substrate excellent in uniformity of characteristics, a silicon carbide ingot and a method for producing those.SOLUTION: The method for producing the silicon carbide ingot comprises a step of preparing a base substrate 1 having ≤10° off angle to the (0001) plane and comprising single crystal silicon carbide, and a step of growing a silicon carbide layer on the surface of the base substrate 1. In the step for growing the silicon carbide layer, the temperature gradient is brought to be ≥20°C/cm in the width direction viewed from the side of the growth direction of the silicon carbide layer. By doing so, in the obtained silicon carbide ingot, almost the whole surface including the central part of the growing outermost surface 9 has become a facet plane 5; therefore, the silicon carbide ingot whose whole surface is brought to be the facet plane 5 can be obtained by solely grinding outer peripheral end portions.
    • 要解决的问题:为了提供特性均匀性优异的碳化硅衬底,碳化硅锭及其制造方法。 < P>解决方案:制造碳化硅锭的方法包括制备与(0001)面成10°偏角并包含单晶碳化硅的基底基板1的步骤,以及生长碳化硅层 在基底基板1的表面上。在用于生长碳化硅层的步骤中,从碳化硅层的生长方向侧观察的宽度方向的温度梯度为≥20℃/ cm 2。 通过这样做,在获得的碳化硅锭中,几乎包括生长的最外表面9的中心部分的整个表面已经成为小平面5; 因此,可以通过仅研磨外周端部来获得整个表面成为小平面5的碳化硅锭。 版权所有(C)2013,JPO&INPIT
    • 50. 发明专利
    • Silicon carbide crystal ingot, silicon carbide crystal wafer, and method for producing the silicon carbide crystal ingot
    • 硅碳化硅晶体,碳化硅晶体晶片及其生产碳化硅晶体晶体的方法
    • JP2012250864A
    • 2012-12-20
    • JP2011123040
    • 2011-06-01
    • Sumitomo Electric Ind Ltd住友電気工業株式会社
    • HORI TSUTOMUSASAKI MAKOTONISHIGUCHI TAROFUJIWARA SHINSUKE
    • C30B29/36
    • C30B23/00C30B29/36
    • PROBLEM TO BE SOLVED: To provide a silicon carbide crystal ingot capable of mitigating an internal strain, and suppressing warpage generated in a large-diameter silicon carbide crystal wafer, and to provide a silicon carbide crystal wafer, and a method for producing the silicon carbide crystal ingot.SOLUTION: This invention relates: to a silicon carbide crystal ingot having a surface whose diameter is ≥4 inches, wherein the concentrations of n-type dopants is ≥1×10/cmand ≤1×10/cm, the concentration of metal atoms is ≥1×10/cmand ≤1×10/cm, which is less than the concentrations of n-type dopants, and the concentration gradient of metal atoms is ≤1×10/(cm.mm); and to a silicon carbide crystal wafer produced by using the silicon carbide crystal ingot. The silicon carbide crystal ingot is fabricated by performing acid cleaning of raw material powder containing metal atoms each having a larger atomic radius than silicon in the crystal of silicon carbide powder as at least either of interstitial atoms and substituent atoms, and then by allowing the silicon carbide crystal ingot 5 to vapor-phase grow by using the raw material powder 6.
    • 要解决的问题:提供一种能够减轻内部应变的碳化硅晶体锭,并且抑制大直径碳化硅晶片中产生的翘曲并提供碳化硅晶片,以及制造方法 碳化硅晶锭。 解决方案:本发明涉及具有直径≥4英寸的表面的碳化硅晶体锭,其中n型掺杂剂的浓度为≥1×10 15 / cm 3 和≤1×10 20 / cm 3 金属原子的浓度为≥1×10 14 / cm 3 和≤1×10 18 / cm 3 ,小于n型掺杂剂的浓度,金属原子的浓度梯度为≤1×10 17 /(cm 3 .mm); 以及通过使用碳化硅晶体锭制造的碳化硅晶片。 碳化硅晶体锭是通过对作为至少间隙原子和取代基原子的碳化硅粉末的晶体中含有比硅原子半径大的金属原子的原料粉末进行酸洗,然后通过使硅 碳化物晶锭5通过使用原料粉末6进行气相生长。版权所有(C)2013,JPO&INPIT