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41. 发明专利

JP2000301328A SOLDERING DEVICE WITH ALARM DEVICE 失效
公开(公告)号：JP2000301328A
公开(公告)日：2000-10-31
申请号：JP10803799
申请日：1999-04-15
申请人： JAPAN UNIX CO LTD
发明人： HATTORI MASAHIRO
IPC分类号： B23K3/03 , B23K1/00
摘要： PROBLEM TO BE SOLVED: To obtain a soldering device with an alarm device, which can prevent soldering from being performed at a temperature deviated from a soldering condition. SOLUTION: A temperature sensor 3 for detecting the iron temperature of a soldering iron 1, a vibration sensor 4 detecting vibrations when using the soldering iron 1, a first alarm generator giving an alarm signal and an alarm circuit operating the first alarm generator by a detected signal from the vibration sensor 4 when the vibrations of the soldering iron 1 have been detected by the vibration sensor 4 while the iron temperature has deviated from a soldering condition, are provided.

42. 发明专利

JP2019018207A ハンダ鏝自動交換機構付きハンダ付け装置及びハンダ鏝自動交換方法审中-公开
公开(公告)号：JP2019018207A
公开(公告)日：2019-02-07
申请号：JP2017135522
申请日：2017-07-11
申请人： JAPAN UNIX CO LTD
发明人： KADOI TAKESHI
IPC分类号： B23K3/03 , B23K1/00 , B23K3/00 , B23K3/02 , B23K31/02 , B25J15/04
摘要：【課題】ハンダ付け装置において、鏝先が摩耗したハンダ鏝の交換を自動的に行うことができるようにする。【解決手段】制御装置2により自動制御されるハンダ付けロボット1のロボットアーム11に、ハンダ鏝22Aを自動交換機構23を介して取り付け、ハンダ付け工程中に、前記ハンダ鏝22Aの鏝先28aの摩耗度を測定し、測定した摩耗度が前記制御装置2に入力された基準値に達したとき、該制御装置2で前記自動交換機構23を動作させることにより、前記ハンダ鏝22Aをロボットアーム11から取り外し、鏝置き台85に格納されている新たなハンダ鏝22Bを前記ロボットアーム11に取り付ける。【選択図】図1

43. 发明专利

JP2015056442A レーザー走査式リフローはんだ付け方法及び装置审中-公开
标题翻译：激光扫描反射焊接方法和装置
公开(公告)号：JP2015056442A
公开(公告)日：2015-03-23
申请号：JP2013187511
申请日：2013-09-10
申请人：株式会社ジャパンユニックス , Japan Unix Co Ltd
发明人： KONO HIROSHI
IPC分类号： H05K3/34 , B23K1/00 , B23K1/005
摘要：【課題】レーザー光とマスクとを使用して、基板や実装部品等の焼けの問題を生じることなくリフロー方式のはんだ付けを行う。【解決手段】基板7に形成された複数の電極部9に、はんだボール11又はクリームはんだ14からなるはんだ体を供給し、前記基板7を、前記はんだ体の径より小径をなす複数のレーザー投射孔12を有する金属製のマスク3で覆った状態にし、該マスク3の上から、横に細長い形に形成された線形のレーザー光5を投射して前記電極部9を含む領域に沿って走査することにより、前記レーザー投射孔12を通して前記はんだ体に投射されるレーザー光5によって該はんだ体を溶融させ、該はんだ体を前記電極部9に溶着させる。【選択図】図1
摘要翻译：要解决的问题：通过使用激光和掩模进行回流焊接，而不会引起电路板，安装部件等的烧焦问题。解决方案：由焊球11或奶油焊料14组成的焊料体供给多个形成在电路板7上的电极9.电路板7被覆盖有金属掩模3的状态，金属掩模3具有多个比焊料体直径小的激光投射孔12。随后，横向延伸的线性激光束5从掩模3的上方突出，沿着包括电极9的区域扫描。因此，通过激光投射孔12将激光束5投影的焊料体熔化并焊接到电极9。

44. 发明专利

JP2012180977A Ventilating opening cover 有权
标题翻译：通风打开盖
公开(公告)号：JP2012180977A
公开(公告)日：2012-09-20
申请号：JP2011044493
申请日：2011-03-01
申请人： Unix Co Ltd , 株式会社ユニックス
发明人： OKAMOTO KOJI , AKABOSHI TAKASHI
IPC分类号： F24F7/04
摘要： PROBLEM TO BE SOLVED: To provide a technique for preventing furniture dirt and wall surface dirt due to blowout from a ventilation opening even when furniture or the like is posteriorly moved or is newly carried in with respect to a ventilating opening cover which includes a base body having a back plate along a wall surface of a building and an air flow adjusting plate for adjusting a supply air flow by being moved back or forth with respect to the base body and which is provided on an indoor wall surface of the building.SOLUTION: The ventilating opening cover is provided with a wind direction controller which is projected to the rear side from the air flow adjusting plate 15 toward the base body 12 and allows its projecting position to be changed, so as to shut off a prescribed part of a supply/discharge port generated between an opening of the base body 12 and the air flow adjusting plate 15.
摘要翻译：要解决的问题：提供一种即使在家具等相对于通风开口盖向后移动或重新携带的情况下，也能够防止由于通风口的吹出而造成的家具污物和壁面污垢的技术，具有沿建筑物的墙壁表面的背板的基体和用于通过相对于基体相对于基体前后移动来调节供气流并且设置在建筑物的室内壁表面上的气流调节板。解决方案：通风开口盖设有风向控制器，该风向控制器从气流调节板15朝向基体12突出到后侧，并允许其突出位置被改变，以便关闭在基体12的开口和气流调节板15之间产生的排出口的规定部分。（C）2012年，JPO和INPIT

45. 发明专利

JP2011197536A Film vibration sound absorbing plate and sound absorbing panel employing the same 审中-公开
标题翻译：薄膜振动声吸收板和使用它的声音吸收板
公开(公告)号：JP2011197536A
公开(公告)日：2011-10-06
申请号：JP2010066199
申请日：2010-03-23
申请人： Unix Co Ltd , 株式会社ユニックス
发明人： MORIMOTO TORU , IHARA KANJI , SEKIYA MASAMICHI
IPC分类号： G10K11/16 , E01F8/00 , G10K11/162
摘要： PROBLEM TO BE SOLVED: To provide a film vibration sound absorbing plate with a superior sound absorbing rate, and a translucent type film vibration sound absorbing plate with superior translucency water mark nature, and to provide a sound absorbing panel.SOLUTION: Between one sheet of transparent resin plate with holes, and an aluminum expand metal in which resin painting is performed on a plate formed with resin grid or aluminum expand metal, which is flattened beforehand, at least one Fluorine transparent resin thin film is pinched, in a laminate. Static electricity is raised by forcibly frictioning one surface of the plate with holes, or a surface of the resin thin film, and thereby, adhesion of the plate with holes, to the resin thin film is improved.
摘要翻译：要解决的问题：提供具有优良吸声率的薄膜振动吸音板和具有优异的半透明水印性的半透膜型振动吸音板，并提供吸音面板。解决方案：在一张具有孔的透明树脂板和铝膨胀金属，其中在预先扁平化的树脂网格或铝膨胀金属的板上进行树脂涂漆，至少一个氟透明树脂薄膜被夹在层压板中。通过用孔或树脂薄膜的表面强制地摩擦板的一个表面来提高静电，从而提高了板与孔的粘附性对树脂薄膜的粘附。

46. 发明专利

JP2010147255A Soldering iron for use in transfer soldering 审中-公开
标题翻译：焊接铁用于转移焊接
公开(公告)号：JP2010147255A
公开(公告)日：2010-07-01
申请号：JP2008322978
申请日：2008-12-18
申请人： Japan Unix Co Ltd , Tokai Rika Co Ltd , 株式会社ジャパンユニックス , 株式会社東海理化電機製作所
发明人： SHINTANI GENKEI , MURASE YUKIHIKO , TSUJI HIRONOBU , KONDO NORIHIRO
IPC分类号： H05K3/34 , B23K1/00 , B23K3/02 , B23K101/42
摘要： PROBLEM TO BE SOLVED: To provide a soldering iron for use in transfer soldering, that solders pin-shaped terminals with no problem even if there is a barrier such as a wall in the row direction of the pin-shaped terminals to be soldered.
SOLUTION: A terminal receiving groove 39, through which a pin-shaped terminal 38 passes during transfer soldering, is formed on the surface 35 of the solder tip 23 of a soldering iron 22 so as to traverse the tip surface 35 in the transfer direction of the soldering iron 22, and a solder feeding groove 40 for feeding a molten solder to the terminal receiving groove 39 is formed in the direction crossing the terminal receiving groove 39 so as to traverse the top surface 35. A solder melting groove 42 is formed at one end of the solder feeding groove 40 with which a tip of a thread solder 24 is brought into abutment for melting.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供用于转移焊接的烙铁，即使在销状端子的行方向上存在诸如墙壁等障碍物的焊料销状端子也不会有问题焊接。解决方案：在烙铁22的焊接头23的表面35上形成有用于在转移焊接期间针形端子38通过的端子接收槽39，以便在烙铁22的顶端表面35上穿过在与端子容纳槽39交叉的方向上形成用于将熔融焊料供给到端子容纳槽39的焊料供给槽40，以横越顶面35。焊料熔融槽42 形成在焊料供给槽40的一端，螺纹焊料24的顶端与其抵接以熔化。版权所有（C）2010，JPO＆INPIT

47. 发明专利

JP2010029888A Soldering inspection method and soldering equipment 审中-公开
标题翻译：焊接检验方法和焊接设备
公开(公告)号：JP2010029888A
公开(公告)日：2010-02-12
申请号：JP2008192659
申请日：2008-07-25
申请人： Japan Unix Co Ltd , Okayama Univ , 国立大学法人岡山大学 , 株式会社ジャパンユニックス
发明人： MUNESAWA YOSHIOMI , MURATA ATSUO , KIRA SHUJI
IPC分类号： B23K1/00 , G01N21/956 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To suppress generation of defective products in soldering operation.
SOLUTION: A soldering inspection method is disclosed in which a solder fusing means is arranged in a region where soldering is performed, and solder is supplied to the solder fusing means. The method incudes: a step in which a criterion range is freely designated in the soldering region; a step in which the soldering region is successively photographed with a camera to form image data; a step in which, among the image data, a difference of at least two image data having different photographing timing is taken to successively form the image data of the difference; a step in which the image data of the difference are synthesized to form synthesized image data; a step in which the area of solder is detected in the criterion range of the synthesized image data; a step in which whether the area of the solder satisfies the proportion of the criterion range; and a step in which, if the proportion of the criterion range is found satisfied, supply of the solder to the solder fusing means is stopped.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：抑制焊接操作中的不合格产品的产生。解决方案：公开了一种焊接检测方法，其中在进行焊接的区域中布置焊料熔化装置，并且将焊料供应到焊料熔化装置。该方法包括：在焊接区域中自由指定标准范围的步骤; 使用相机连续拍摄焊接区域以形成图像数据的步骤; 在图像数据中，采用具有不同拍摄定时的至少两个图像数据的差异来连续地形成差异的图像数据的步骤; 合成差分的图像数据以形成合成图像数据的步骤; 在合成图像数据的标准范围内检测焊料的区域的步骤; 焊料的面积是否满足标准范围的比例的步骤; 以及如果满足标准范围的比例满足，停止向焊料熔化装置供给焊料的步骤。版权所有（C）2010，JPO＆INPIT

48. 发明专利

JP2010010589A Laser type soldering method and apparatus 有权
标题翻译：激光类型焊接方法和装置
公开(公告)号：JP2010010589A
公开(公告)日：2010-01-14
申请号：JP2008170935
申请日：2008-06-30
申请人： Japan Unix Co Ltd , 株式会社ジャパンユニックス
发明人： MATSUSHITA KOTARO
IPC分类号： H05K3/34 , B23K1/00 , B23K1/005 , B23K3/06 , B23K26/00 , B23K101/42
CPC分类号： H05K3/3447 , B23K1/0016 , B23K1/0056 , B23K3/063 , B23K3/0638 , B23K3/082 , B23K3/087 , B23K26/03 , B23K2201/42 , H05K3/3484 , H05K3/3494 , H05K2203/0405 , H05K2203/107
摘要： PROBLEM TO BE SOLVED: To provide a technology of soldering with high quality, an annular terminal of a printed wiring board and a rod-like terminal of an electronic component using laser light without causing a problem of the firing of the electronic component. SOLUTION: Cream solder 28 is supplied from a cream solder supply device to the annular terminal 21 of the printed wiring board 15 and the rod-like terminal 23a of the electronic component 23 inserted in the annular terminal to close a through-hole 22 with the solder; the annular terminal 21, the rod-like terminal 23a and the cream solder 28 in this state are irradiated with laser light 32 from a laser light irradiation device, and wire solder 30 is supplied at the same time when the cream solder 28 starts to be melted, and thereby, the wire solder 30 and the cream solder 28 are amalgamated to solder the annular terminal 21 and the rod-like terminal 23a. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供使用激光的高质量焊接技术，印刷线路板的环形端子和电子部件的棒状端子，而不会引起电子部件的烧制问题。
解决方案：膏状焊料28从膏状焊料供应装置供应到印刷线路板15的环形端子21和插入环形端子中的电子部件23的棒状端子23a以封闭通孔 22与焊料; 在这种状态下的环形端子21，棒状端子23a和膏状焊料28用激光照射装置照射激光32，同时当膏状焊料28开始为熔化，从而将焊丝30和膏状焊料28合并，以焊接环形端子21和棒状端子23a。版权所有（C）2010，JPO＆INPIT

49. 发明专利

JP2008260035A Laser soldering apparatus 有权
标题翻译：激光焊接设备
公开(公告)号：JP2008260035A
公开(公告)日：2008-10-30
申请号：JP2007103861
申请日：2007-04-11
申请人： Japan Unix Co Ltd , 株式会社ジャパンユニックス
发明人： KONO HIROSHI
IPC分类号： B23K1/005 , B23K1/00 , B23K26/06 , B23K26/073 , B23K101/42
CPC分类号： B23K26/0652 , B23K26/0648
摘要： PROBLEM TO BE SOLVED: To provide a laser soldering apparatus of a simple structure which can efficiently solder an annular terminal and a bar-like terminal inserted inside the annular terminal without causing burning of electronic components. SOLUTION: In the irradiation part 18 for emitting a laser beam B5 to an object 15 to be soldered, there is installed an axicon lens 24 having a center hole 27. A circular laser beam B4 is converted by the axicon lens 24 into the laser beam B5 having an annular ring section Br and a circular section Bc located at the center of the ring section Br. Using these ring section Br and circular section Bc, the annular terminal 13a and the bar-like terminal 14a are both heated and soldered together simultaneously. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种结构简单的激光焊接装置，其能够有效地焊接插入环形端子内的环形端子和棒状端子，而不会引起电子部件的燃烧。解决方案：在用于将激光束B5发射到待焊接的物体15的照射部分18中，安装有具有中心孔27的旋转透镜24.圆形激光束B4由旋转透镜24转换成激光束B5具有环形环部分Br和位于环形部分Br中心的圆形部分Bc。使用这些环形部分Br和圆形部分Bc，环形端子13a和棒状端子14a都被同时加热和焊接在一起。版权所有（C）2009，JPO＆INPIT

50. 发明专利

JP2008173659A Laser head for soldering 审中-公开
标题翻译：激光头焊接
公开(公告)号：JP2008173659A
公开(公告)日：2008-07-31
申请号：JP2007008190
申请日：2007-01-17
申请人： Japan Unix Co Ltd , 株式会社ジャパンユニックス
发明人： KONO HIROSHI
IPC分类号： B23K1/005 , B23K26/00 , B23K26/03 , B23K101/36 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To prevent the generation of halation due to high-brightness light from an object to be soldered during soldering, in a laser head provided with a CCD camera. SOLUTION: The CCD camera 9 is constituted so as to pick up an image of the object 10 to be soldered through an optical system 2 for projecting a laser beam and a permselective filter 23 for interrupting the high brightness light which is sent from the object 10 to be soldered is arranged in an interrupting position where the optical path by which the CCD camera 9 and a half mirror 2c of the optical system 2 is joined is interrupted and an uniterrupting position apart from the optical path freely switchably between the CCD camera 9 and the half mirror 2c. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了防止在设置有CCD照相机的激光头中产生由于在焊接期间来自待焊接物体的高亮度光而产生的光晕。解决方案：CCD摄像机9构成为通过用于投射激光束的光学系统2拾取要焊接的对象10的图像，以及用于中断从高亮度光发送的高亮度光的选通滤光器23 要被焊接的物体10被布置在中断位置，其中CCD照相机9和光学系统2的半反射镜2c的光路被连接在一起，并且在CCD之间可自由地切换的光路之间的单位偏移位置相机9和半反射镜2c。版权所有（C）2008，JPO＆INPIT

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