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31. 发明专利

JP2014111817A Surface-treated copper foil and laminate made therefrom 有权
标题翻译：表面处理的铜箔和层压体
公开(公告)号：JP2014111817A
公开(公告)日：2014-06-19
申请号：JP2013000676
申请日：2013-01-07
申请人： Jx Nippon Mining & Metals Corp , Jx日鉱日石金属株式会社
发明人： ARAI EITA , MIKI ATSUSHI , ARAI YASUNORI , NAKAMURO KAICHIRO
IPC分类号： C25D7/06 , H05K1/09
CPC分类号： H05K1/056 , C25D1/04 , C25D3/38 , C25D3/58 , C25D5/16 , C25D7/0692 , H05K1/09 , H05K1/14 , H05K3/022 , H05K3/36 , H05K3/384 , Y10T29/49126 , Y10T428/12431 , Y10T428/24917 , Y10T428/31678
摘要： PROBLEM TO BE SOLVED: To provide surface-treated copper foil having good adhesion with a resin, which achieves excellent transparency after removal of the copper foil by etching; and a laminate made therefrom.SOLUTION: The surface-treated copper foil has at least one surface having a skewness Rsk of -0.35 to 0.53. In an observation spot vs brightness graph, the difference between the top average Bt and the bottom average Bb of the brightness curve extending from the end of a mark to the part having no mark is represented by ΔB(ΔB=Bt-Bb). In an observation spot vs brightness graph, a value t1 indicates the position of the intersection closest to the linear mark among the intersections of the brightness curve and Bt, ant a value t2 indicates the position of the intersection closest to the linear mark among the intersections of the brightness curve and 0.1ΔB in the depth range from the intersection of the brightness curve and Bt to 0.1ΔB on the basis of Bt. The surface-treated coper foil has an Sv of 3.5 or more, which is defined by the following expression (1).
摘要翻译：要解决的问题：提供与树脂具有良好粘合性的表面处理铜箔，其通过蚀刻除去铜箔后实现优异的透明度; 和由其制成的层压体。溶液：经表面处理的铜箔具有至少一个具有-0.35至0.53的偏度Rsk的表面。在观察点vs亮度图中，从标记结束到没有标记的部分的亮度曲线的顶部平均Bt和底部平均Bb之间的差由＆Dgr; B（＆Dgr; B = Bt- BB）。在观察点vs亮度图中，值t1表示亮度曲线和Bt的交点之间最接近线性标记的交点的位置，蚂蚁值t2表示交点之间最接近线性标记的交点的位置的亮度曲线和0.1＆Dgr; B在亮度曲线Bt与0.1＆Dgr; B之间的深度范围内，基于Bt。表面处理的氧化铝箔的Sv为3.5以上，由下述式（1）定义。

32. 发明专利

JPWO2012090360A1 金属ベース回路基板、金属ベース回路基板の製造方法有权
公开(公告)号：JPWO2012090360A1
公开(公告)日：2014-06-05
申请号：JP2012550678
申请日：2011-09-29
申请人：住友ベークライト株式会社
发明人：洋次白土 , 洋次白土 , 光男武谷 , 光男武谷 , 孝幸馬塲 , 孝幸馬塲 , 飛澤　晃彦 , 晃彦飛澤
IPC分类号： H05K1/05 , H05K3/44
CPC分类号： H05K1/056 , H05K3/385 , H05K2201/0209 , H05K2203/0307 , H05K2203/0315
摘要：金属ベース回路基板(10)は、アルミニウム基板(12)と、絶縁樹脂層(14)と、金属層(16)とが順に積層されている。アルミニウム基板(12)の表面は、表面粗度(Rz)が3μm以上9μm以下で、水との接触角が50°以上95°以下となるよう、50℃以上80℃以下の水に、0.5分間以上3分間以下接触させる。

33. 发明专利

JP5503915B2 The liquid crystal polyester composition and an electronic circuit board using the same 有权
公开(公告)号：JP5503915B2
公开(公告)日：2014-05-28
申请号：JP2009177570
申请日：2009-07-30
申请人：住友化学株式会社
发明人：剛司近藤 , 定信岩瀬 , 浩暢井山
IPC分类号： C08L67/00 , C08G63/685 , C08K3/22 , C08K3/28 , H05K1/03
CPC分类号： H05K1/056 , C08L67/03 , C09D167/03 , C09K19/3809 , H05K2201/0141 , H05K2201/0209 , H05K2201/0266 , Y10T428/10 , Y10T428/1036

35. 发明专利

JP5487010B2 For circuit board laminates and metal base circuit board 有权
公开(公告)号：JP5487010B2
公开(公告)日：2014-05-07
申请号：JP2010121940
申请日：2010-05-27
申请人：日本発條株式会社 , 住友化学株式会社
发明人：克美水野 , 和彦許斐 , 豊夏目 , 亮宮越 , 剛司近藤
IPC分类号： H05K1/05 , B32B15/04
CPC分类号： H05K1/0373 , B32B15/04 , B32B2457/08 , H05K1/056 , H05K2201/0141 , H05K2201/0209 , Y10T428/31681

36. 发明专利

JP5484176B2 Wiring circuit board and a method of manufacturing the same 有权
公开(公告)号：JP5484176B2
公开(公告)日：2014-05-07
申请号：JP2010101352
申请日：2010-04-26
申请人：日東電工株式会社
发明人：徹也大澤 , 満本上 , 大輔山内
IPC分类号： H05K1/02
CPC分类号： H05K1/056 , H05K1/0245 , H05K1/0251 , Y10T29/49155

37. 发明专利

JP2014037536A Epoxy resin composition and heat dissipation circuit board using the same 审中-公开
标题翻译：环氧树脂组合物和散热电路板使用相同
公开(公告)号：JP2014037536A
公开(公告)日：2014-02-27
申请号：JP2013169266
申请日：2013-08-16
申请人： Lg Innotek Co Ltd , エルジーイノテックカンパニーリミテッド
发明人： YUN SUN JIN , LEE HYUK SOO , CHO IN HEE , PARK JAE MAN , KIM MYEONG JEONG , YOON JONG HEUM , PARK JUNG-OOK , LEE JONG SIK , GIL GUN YOUNG , GIANG THANH KIEU , KIM JIN HWAN
IPC分类号： C08L63/00 , C08G59/28 , C08K3/00
CPC分类号： H05K1/0373 , C08G59/28 , C08G59/30 , C08K3/0033 , C08K3/013 , C08L63/00 , H05K1/0203 , H05K1/056 , H05K2201/0209
摘要： PROBLEM TO BE SOLVED: To provide an epoxy resin composition having a novel composition and to provide a heat dissipation circuit board having improved thermal efficiency.SOLUTION: The epoxy resin composition according to an embodiment of the present invention comprises an epoxy resin including a crystalline epoxy, a curing agent and an inorganic filler. The heat dissipation circuit board according to an embodiment of the present invention comprises a metal plate, an insulation layer formed on the metal plate and a circuit pattern formed on the insulation layer and the insulation layer is formed by curing the epoxy resin composition comprising the epoxy resin including a crystalline epoxy, the curing agent and the inorganic filler.
摘要翻译：要解决的问题：提供具有新组成的环氧树脂组合物，并提供具有改善的热效率的散热电路板。解决方案：根据本发明实施方案的环氧树脂组合物包含环氧树脂，其包含结晶环氧树脂，固化剂和无机填料。根据本发明实施例的散热电路板包括金属板，形成在金属板上的绝缘层和形成在绝缘层上的电路图案，并且绝缘层通过使包含环氧树脂的环氧树脂组合物包括结晶环氧树脂，固化剂和无机填料的树脂。

38. 发明专利

JP5430422B2 Manufacturing methods and metal base circuit board of the metal base circuit board 有权
公开(公告)号：JP5430422B2
公开(公告)日：2014-02-26
申请号：JP2010016005
申请日：2010-01-27
申请人：日本発條株式会社
发明人：康伸大東
IPC分类号： H05K3/44 , H05K1/05 , H05K3/00
CPC分类号： H05K1/056 , H01L2224/48091 , H01L2224/73265 , H05K1/183 , H05K2201/10106 , H05K2203/0323 , H05K2203/049 , H01L2924/00014

40. 发明专利

JP5378683B2 Circuit device and a method of manufacturing the same 有权
公开(公告)号：JP5378683B2
公开(公告)日：2013-12-25
申请号：JP2007533379
申请日：2006-08-30
申请人：セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー
发明人：貞道高草木 , 則明坂本
IPC分类号： H01L25/07 , H01L25/00 , H01L25/18
CPC分类号： H01L25/162 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/73215 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/19105 , H01L2924/19107 , H01L2924/30107 , H01L2924/3011 , H05K1/056 , H05K1/142 , H05K3/284 , H05K3/4046 , H05K2201/09554 , H05K2201/10287 , H05K2201/1034 , H05K2201/10924 , Y10T29/5313 , H01L2924/00 , H01L2224/48247 , H01L2924/00014 , H01L2924/00012
摘要： Provided is a circuit device in which an electronic circuit to be incorporated therein operates stably. A hybrid integrated circuit device includes multiple circuit boards which are disposed on approximately the same plane. An electronic circuit including a conductive pattern and a circuit element is formed on each top surface of the circuit boards. Furthermore, these circuit boards are integrally supported by a sealing resin. Moreover, a lead connected to the electronic circuit formed on the surface of the circuit board is led out from the sealing resin to the outside.

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