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    • 32. 发明专利
    • Method and device for separating semiconductor element
    • 用于分离半导体元件的方法和装置
    • JP2011060822A
    • 2011-03-24
    • JP2009205778
    • 2009-09-07
    • Mitsubishi Electric Corp三菱電機株式会社
    • ONO KATSUMINAKAMURA SATOSHINEGISHI MASAHITO
    • H01L21/301
    • PROBLEM TO BE SOLVED: To provide a method and device for separating a semiconductor element, which prevents an element from separating at an undesired part by exerting sufficient tensile stress in the vicinity of a scribe groove even when a space of a substrate supporter is narrowed at the time of the reduction of the semiconductor element in size.
      SOLUTION: The device includes: a breaking blade 10 for separating an LD chip 2 by pressing the LD chip 2 on an LD bar 1; and a pair of substrate supporter 7 for supporting the LD bar 1; and supporter driving unit 16 for expanding the space of the pair of substrate supporter 7 synchronized with travel of the breaking blade 10 when pressing the breaking blade 10 on the LD bar 1.
      COPYRIGHT: (C)2011,JPO&INPIT
    • 要解决的问题:提供一种用于分离半导体元件的方法和装置,其通过在划线槽附近施加足够的拉伸应力来防止元件在不期望的部分分离,即使当基板支撑件的空间 在半导体元件的尺寸减小时变窄。 解决方案:该装置包括:破碎刀片10,用于通过将LD芯片2按压在LD条1上来分离LD芯片2; 以及用于支撑LD条1的一对基板支撑件7; 以及支撑件驱动单元16,用于当按压LD条1上的断裂刀片10时,与断裂刀片10的行进同步地扩展一对基板支撑件7的空间。(C)2011年,JPO和INPIT
    • 33. 发明专利
    • Optical semiconductor module
    • 光学半导体模块
    • JP2011029387A
    • 2011-02-10
    • JP2009173168
    • 2009-07-24
    • Mitsubishi Electric Corp三菱電機株式会社
    • FUKUDA KEIICHIKAWAKAMI MANABUNAKAMURA SATOSHINANBA TOMOYO
    • H01S5/022
    • PROBLEM TO BE SOLVED: To provide a laser semiconductor module capable of leveling electric power supplied to a plurality of LDs (laser diode elements).
      SOLUTION: The optical semiconductor module includes a large-sized sub-mount 8 having a cathode-side conductive pattern, including a cathode-side terminal, formed on a surface, a small-sized sub-mount 7 arranged on a surface of the large-sized sub-mount 8 and having an anode-side conductive pattern, including an anode-side terminal, formed on a surface, the plurality of LDs 5 arranged in an array shape on the surface of the large-sized sub-mount 8, and a plurality of bonding wires 10 for connecting the anode-side conductive pattern to the respective LDs 5, wherein the cathode-side terminal and anode-side terminal are formed extending in a row direction parallel to the plurality of LDs 5 provided in an array, and the plurality of bonding wires 10 are formed to the same length.
      COPYRIGHT: (C)2011,JPO&INPIT
    • 要解决的问题:提供能够对提供给多个LD(激光二极管元件)的电力进行调平的激光半导体模块。 解决方案:光学半导体模块包括具有阴极侧导电图案的大尺寸子座8,其包括形成在表面上的阴极侧端子,设置在表面上的小尺寸子座7 的大型副安装座8,具有形成在表面上的具有阳极侧端子的阳极侧导电图案,在大型子座8的表面上排列成阵列状的多个LD5, 安装座8和多个用于将阳极侧导电图形连接到各个LD 5的接合线10,其中阴极侧端子和阳极侧端子形成为沿与平行于所述多个LD 5平行的行方向延伸 并且多个接合线10形成为相同的长度。 版权所有(C)2011,JPO&INPIT
    • 35. 发明专利
    • Obstacle detecting device
    • 异常检测装置
    • JP2004155368A
    • 2004-06-03
    • JP2002324994
    • 2002-11-08
    • Mitsubishi Electric Corp三菱電機株式会社
    • NAKAMURA SATOSHI
    • B61L23/00
    • PROBLEM TO BE SOLVED: To provide an obstacle detecting device in which a mounting expenditure for a leakage transmission path or its maintenance expenditure is reduced by about 3/4 when the detecting device covers a detecting range of wide spacing in obstacles.
      SOLUTION: This detecting device comprises a transmittance side leakage cable 1, and a pair of receiving side transmittance paths 2a, 2b around the transmittance side leakage cable 1 and arranged at both sides in parallel with it; a transmittance part 4 arranged at the transmittance side leakage transmittance path end so as to transmit an electric wave dispersed in spectrum with a pseudo noise code; receiving portions 5a, 5b arranged at each of the pair of receiving side leakage transmittance path ends so as to receive delayed electric wave in response to a position on the receiving side leakage transmittance path; a delay time measuring part for detecting an obstacle, specifying its position and measuring its moving speed in response to the delay time of the received electric wave and a variation in time of an electrical power level; and a receiving level comparing part 3.
      COPYRIGHT: (C)2004,JPO
    • 要解决的问题:为了提供一种障碍物检测装置,其中当检测装置覆盖障碍物中宽间距的检测范围时,泄漏传输路径的安装费用或其维护费用减少约3/4。 解决方案:该检测装置包括透射侧漏电缆1和围绕透射侧泄漏电缆1并与其平行布置的两侧的一对接收侧透射路径2a,2b; 布置在透射侧漏电透射路径端的透射部分4,以便以伪噪声码传输分散在光谱中的电波; 接收部分5a,5b布置在所述一对接收侧泄漏透射路径中的每一个端部,以便响应于接收侧泄漏透射路径上的位置接收延迟的电波; 用于检测障碍物的延迟时间测量部分,响应于接收到的电波的延迟时间和电功率电平的时间变化来指定其位置并测量其移动速度; 和第3部分的接收等级。版权所有(C)2004,JPO
    • 36. 发明专利
    • Obstacle detecting device
    • JP2004117175A
    • 2004-04-15
    • JP2002281077
    • 2002-09-26
    • Mitsubishi Electric Corp三菱電機株式会社
    • NAKAMURA SATOSHI
    • G01V3/12B61L23/00B61L23/06G01S13/74G01S13/91
    • PROBLEM TO BE SOLVED: To accurately detect an obstacle without misidentifying a worker as an obstacle. SOLUTION: Leakage coaxial cables 1, 2 are placed in parallel on both sides of an obstacle monitoring section. A transmission part 3 is connected to one end of one leakage coaxial cable 1 for transmitting signals subjected to spread spectrum with predetermined false noise codes, as electric waves at a first power level. An intruder identifying device 6 emits signals at a second power level, subjected to spread spectrum with the same false noise codes as the predetermined false noise codes in synchronization with the predetermined false noise codes and thereby amplified a preset amount higher than the first power level, as identifying electric waves to the other leakage coaxial cable. A reception part 4 is connected to one end of the other leakage coaxial cable 2 for receiving the electric waves, and a delay time/power measuring part 5 measures the power level of the electric waves received by the received part 4 and detects the presence or absence of the obstacle in the obstacle monitoring section and the intruder identifying device 6 in accordance with the power level of the received electric waves. COPYRIGHT: (C)2004,JPO
    • 37. 发明专利
    • Apparatus and method for separating semiconductor device
    • 用于分离半导体器件的装置和方法
    • JP2003068678A
    • 2003-03-07
    • JP2001259513
    • 2001-08-29
    • Mitsubishi Electric Corp三菱電機株式会社
    • YONEZAWA HIROTOSHINAKAMURA SATOSHIMATSUNAGA YASUHIKOHARA SHOICHIROISHII MITSUO
    • H01L21/301
    • PROBLEM TO BE SOLVED: To provide a semiconductor device separating apparatus, by which under or over cutting by a separating blade can be prevented, and a smooth separation plane can be provided stably. SOLUTION: This device is provided with a transparent wafer for placing a semiconductor device group 10, with which a plurality of semiconductor devices are formed into a array shape and a flexible transparent sheet is adhered on a first side formed with a scribe groove; a positioning stage 1 capable of positioning the semiconductor device group 10 at a position and an angle, as desired within a plane which is parallel to the wafer; a separating blade lifting and driving control mechanism 2, having a separating blade 21 to be pressed on a second side opposed with the first side and a load sensor for detecting stress to be received from the second side to the separating blade 21 for controlling the moving amount of the separating blade 21 corresponding to a change in the detection output of the load sensor; and a first image recognizing device 4, with which the area of the first side formed with the scribe groove can be observed via the transparent sheet and the wafer, for recognizing and storing the position of the separating blade 21.
    • 要解决的问题:提供一种半导体器件分离装置,通过该半导体装置分离装置可以防止由分离刀片进行的切割或切割,并且可以稳定地提供平滑的分离平面。 解决方案:该装置设置有用于放置半导体器件组10的透明晶片,多个半导体器件形成为阵列形状,并且柔性透明片粘附在形成有划痕槽的第一侧上; 定位台1能够将半导体器件组10定位在与晶片平行的平面内所需的位置和角度; 分离叶片提升和驱动控制机构2,具有在与第一侧相对的第二侧上被按压的分离叶片21和用于检测从第二侧接收到分离叶片21的应力的负载传感器,用于控制移动 对应于负载传感器的检测输出的变化的分离叶片21的量; 以及第一图像识别装置4,通过透明片和晶片可以观察到形成有划线槽的第一侧的区域,用于识别和存储分离刀片21的位置。
    • 40. 发明专利
    • SPURIOUS RADIATION MEASURING DEVICE
    • JPH04110671A
    • 1992-04-13
    • JP22992890
    • 1990-08-31
    • MITSUBISHI ELECTRIC CORP
    • NAKAMURA SATOSHI
    • G01R29/08
    • PURPOSE:To enable a spectrum analyzer without requiring any strict accuracy to be used and measurement to be made easily by setting frequency of a reference signal where spectrum agrees with peak spectrum of spurious radiation and then measuring strength of the spurious radiation at this frequency. CONSTITUTION:Supurious radiation emitted from an equipment to be measured 1 is fed to a spectrum analyzer 3 through a mixer 7 and is displayed on a screen and then the central frequency is set to a reference signal generator 6, thus enabling reference signal to be generated. This reference signal is mixed with the supurious radiation by the mixer 7 and is displayed on a screen of the analyzer 3 and an oscillation frequency is swept, thus enabling spectrum of the reference signal to match peak spectrum of the supurious radiation. Then, a selection switch 5 is switched to a side b and a knob of a voltage- measuring meter 14 is operated for setting frequency to be measured to oscillation frequency of a signal generator 6, thus enabling strength of the supurious radiation to be measured. With this configuration, no strict accuracy is required in the spectrum analyzer and a highly accurate measurement can be made in a short time.