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    • 31. 发明专利
    • ADJUSTING METHOD OF RESISTANCE VALUE OF RESISTOR
    • JPH0555014A
    • 1993-03-05
    • JP21347191
    • 1991-08-26
    • MATSUSHITA ELECTRIC IND CO LTD
    • KAWASAKI TETSUO
    • B41J2/335B41J2/35H01C17/22
    • PURPOSE:To make the resistance value of resistors collectively uniform without measuring the resistance value of the resistors individually by a method wherein the resistors are exposed to gaseous chlorine trifluoride within a temperature range in which the resistors are not reacted with the chlorine trifluoride. CONSTITUTION:When a DC voltage is applied to voltage application terminals, resistors 13 generate heat, their surface temperature is raised and their reaction with chlorine trifluoride is started. The initial resistance value of the resistors 13 is low. Even when the voltage is applied initially and their surface temperature is increased, the surface of the resistors 13 is gasified as their reaction with the chlorine trifluoride progresses. As a result, their resistance value is increased gradually. When their surface temperature is lowered and set to 80 deg.C finally, their reaction hardly progresses. Consequently, when the voltage is applied to all the resistors 13 in such a way that the surface temperature becomes 80 deg.C at a target resistance value to be adjusted, the resistance values of all the resistors lower than the target resistance value can be equalized to the target resistance value. Thereby, it is possible to obtain the uniform resistance value collectively.
    • 32. 发明专利
    • THIN FILM TYPE THERMAL HEAD
    • JPH04265755A
    • 1992-09-21
    • JP2714591
    • 1991-02-21
    • MATSUSHITA ELECTRIC IND CO LTD
    • KAWASAKI TETSUO
    • B41J2/335
    • PURPOSE:To obtain the above thin film type thermal head which can be stably formed by superposing successively a heat storing layer, intermediate layer, heating resistor layer, power feed layer, and anti-abrasion protection layer on a heat resistant base board, thereby improving thermal efficiency for setting. CONSTITUTION:There is provided on a heat resistant base board 11 an insulating material 12 composed of heat resistant resin particles of polyimide 13 and silicon oxide containing an extremely small amount of hydrogen obtained from alkoxy silane to form a heat storing layer 14. An intermediate layer 15 composed of silicon carbide, having a thickness of 0.7-2mum, and a heating resistor layer 16 are formed in succession on said layer 14, on a part of which a power feed layer 17 and anti-abrasion protection layer 18 are successively formed to form a thin film type thermal head. Since in this thermal head the thermal conductivity of the heat storing layer can have a value of 10 -10 cal/cm.deg which is an intermediate value of those of glass and resin, heat efficiency for setting can be improved. And the intermediate layer has a mechanical strength equivalent to that of glass, thereby enabling its application to hard recording material such as card.
    • 38. 发明专利
    • MANGETOELECTRIC ELEMENT AND MANUFACTURE THEREOF
    • JP2001036163A
    • 2001-02-09
    • JP21044099
    • 1999-07-26
    • MATSUSHITA ELECTRIC IND CO LTD
    • KAWASAKI TETSUOHATTORI TAKAMICHIYAMAGUCHI MASAKOKORECHIKA AKIHIRO
    • G01D5/18H01L43/06
    • PROBLEM TO BE SOLVED: To improve reliability of a galvanomagnetic element by securing continuity of a conducting layer in the step section of a magnetism sensitive layer, by providing a conductive step coating layer either continuously from the partial surface of the conductive layer on the magnetism sensitive layer to the partial surface of at least the continuous or approximate conductive layer on a substrate. SOLUTION: A galvanomagnetic element is provided with a magnetism sensitive layer 12 on the upper surface of a substrate 11, and the layer 12 converts the variation of magnetic field intensity into variation of electrical characteristics by the Hall effect possessed of a semiconductor. The element is also provided with a conductive layer 13 at a desired spot on the upper surface of the magnetism sensitive layer 12 and the layer 13 electrically connects the layer 12 to connection terminals 15. In addition, the element is also provided with a step coating layer 14 formed continuously from the upper surface of the conductive layer 13 on the magnetism sensitive layer 12 and the upper surface of the layer 13 on the substrate 11 for securing continuity between the conductive layer 13 on the magnetism sensitive layer 12 and the layer 13 on the substrate 11. The element is connected to external electric terminals through the connection terminals 15 provided on the partial surface of the conductive layer 13 on the upper surface of the substrate 11 in a region, where the layer 13 is not in contact with the coating layer 14.