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31. 发明专利

JP2009206328A Semiconductor device and method for manufacturing semiconductor device 审中-公开
标题翻译：半导体器件及制造半导体器件的方法
公开(公告)号：JP2009206328A
公开(公告)日：2009-09-10
申请号：JP2008047834
申请日：2008-02-28
申请人： Renesas Technology Corp , 株式会社ルネサステクノロジ
发明人： KURATOMI BUNJI , SHIMIZU FUKUMI , SUGIYAMA MICHIAKI
IPC分类号： H01L21/56 , H01L25/10 , H01L25/11 , H01L25/18
CPC分类号： H01L25/0657 , H01L2224/48225 , H01L2224/48227 , H01L2225/06568 , H01L2924/10253 , H01L2924/15311 , H01L2924/15331 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To solve the problem that although a sealed body to be sealed becomes thin as a semiconductor device becomes thinner recently and an air vent for discharging air in a cavity to the outside so as to improve charging property for a resin is provided to a metal mold, the air vent becomes smaller as the semiconductor becomes thinner to make the air vent portion apt to be clogged with the resin, and then the formed sealed body includes an uncharged region (absent region) to increase the possibility of production of a product defective. SOLUTION: In a method for manufacturing the semiconductor device, a detection pattern portion including a metal pattern is provided nearby outside a corner portion of a nearly rectangular resin sealed region, where a semiconductor chip on a wiring board is sealed, corresponding to the air vent portion of the metal mold, thereby when a resin charging state is observed by making an observation nearby outside the corner portion with reflected light by using an optical system. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：解决的问题为了解决近来半导体器件变薄时密封体密度变薄的问题，以及用于将空腔中的空气向外部排出的排气口，以改善对于树脂被提供到金属模具中，随着半导体变薄而使排气口变小，使得通气部分易于被树脂堵塞，然后形成的密封体包括不带电区域（不存在区域）以增加可能性的产品有缺陷。解决方案：在制造半导体器件的方法中，在近似矩形的树脂密封区域的角部附近设置包括金属图案的检测图案部分，其中布线板上的半导体芯片被密封，对应于从而当通过使用光学系统通过用反射光观察角落附近的观察来观察树脂充电状态时的金属模的通气部。版权所有（C）2009，JPO＆INPIT

32. 发明专利

JP2007005443A Semiconductor device and its manufacturing method 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：JP2007005443A
公开(公告)日：2007-01-11
申请号：JP2005181810
申请日：2005-06-22
申请人： Renesas Technology Corp , 株式会社ルネサステクノロジ
发明人： NISHIZAWA HIROTAKA , OSAKO JUNICHIRO , WADA TAMAKI , SUGIYAMA MICHIAKI
IPC分类号： H01L25/065 , H01L25/07 , H01L25/18
CPC分类号： H01L2224/45144 , H01L2224/48247 , H01L2224/49171 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To reduce a manufacturing cost of a multi-chip package. SOLUTION: A flash memory chip 1M and a controller chip 1C are sealed in a resin package 2 of the multi-chip package (MCP1). Respective centers of opposed two long sides of the resin package 2 go back to the center side of the resin package 2 from opposite ends thereof. An outer lead 6o disposed along the two long sides of the resin package 2 among outer leads 6o connected to the controller chip 1C is taken out outward from the central part of the resin package 2, and tip ends thereof are located to the center side of the resin package 2 from the opposite ends. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：降低多芯片封装的制造成本。解决方案：闪存芯片1M和控制器芯片1C被密封在多芯片封装（MCP1）的树脂封装2中。树脂封装2的相对的两个长边的各个中心从其相对端返回到树脂封装2的中心侧。连接到控制器芯片1C的外引线6o之中沿着树脂封装2的两个长边设置的外引线6o从树脂封装2的中心部分向外取出，其顶端位于树脂包装2从相对端。版权所有（C）2007，JPO＆INPIT

33. 发明专利

JP2006196734A Semiconductor device and its manufacturing method 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：JP2006196734A
公开(公告)日：2006-07-27
申请号：JP2005007277
申请日：2005-01-14
申请人： Renesas Technology Corp , 株式会社ルネサステクノロジ
发明人： NUMAJIRI WATARU , KAWADA YOICHI , SUGIYAMA MICHIAKI , UJIIE MIKAKO
IPC分类号： H01L23/12
CPC分类号： H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49113 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device hard to cause a damage of a semiconductor chip and having a satisfactory connectivity with a mounting substrate.
SOLUTION: The semiconductor device 1 comprises a plurality of electrode pads 7 on a first surface 2a, a plurality of external electrode terminals 4 on a second surface 2b opposite to the first surface. The electrode pad and the external electrode terminal are electrically connected by a conductor 8 provided from the first surface through the second surface. The semiconductor device 1 also comprises a first insulating layer 5 provided on the second surface apart in the predetermined distance from the external electrode terminal, and a wiring board 2 having a second insulating layer 9 and the semiconductor chip 11 having a plurality of electrtodes fixed on a second insulating layer of the first surface of the wiring board through an adhesive agent 10; a wire 17 for electrically connecting the electrodes of the semiconductor chip and the electrode pads of the wiring board; and a seal 3 comprising an insulating material covering all over the semiconductor chip and the wire, and provided over the first surface of the wiring board.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种难以引起半导体芯片的损坏并且与安装基板具有令人满意的连接性的半导体器件。解决方案：半导体器件1包括在第一表面2a上的多个电极焊盘7，在与第一表面相对的第二表面2b上的多个外部电极端子4。电极焊盘和外部电极端子由通过第二表面从第一表面提供的导体8电连接。半导体器件1还包括设置在与外部电极端子隔开预定距离的第二表面上的第一绝缘层5和具有第二绝缘层9的布线板2和具有多个电极固定的半导体芯片11 布线板的第一表面的第二绝缘层通过粘合剂10; 用于电连接半导体芯片的电极和布线板的电极焊盘的导线17; 以及密封件3，其包括覆盖半导体芯片和导线上的绝缘材料，并且设置在布线板的第一表面上。版权所有（C）2006，JPO＆NCIPI

34. 发明专利

JP2005322109A Ic card module 审中-公开
标题翻译： IC卡模块
公开(公告)号：JP2005322109A
公开(公告)日：2005-11-17
申请号：JP2004140699
申请日：2004-05-11
申请人： Renesas Technology Corp , 株式会社ルネサステクノロジ
发明人： NISHIZAWA HIROTAKA , TOTSUKA TAKASHI , OSAWA KENJI , OSAKO JUNICHIRO , WADA TAMAKI , SUGIYAMA MICHIAKI
IPC分类号： G06K19/077 , H04Q7/38 , H05K1/11 , H05K3/28
CPC分类号： G06K19/07743 , G06K19/072 , G06K19/077 , G06K19/07732 , G06K19/07739 , H01L24/73 , H01L2224/05554 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2225/06562 , H01L2924/14 , H01L2924/181 , H05K1/117 , H05K3/284 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To allow an IC card module having a microcomputer and a memory card controller to be compatible with an SIM card and deal with fast memory access.
SOLUTION: The IC card module 1 includes a plurality of first external connection terminals 11 and a plurality of second external connection terminals 12, both of which are exposed to a surface of a card base 10; a microcomputer connected to the first external connection terminals; a memory card controller connected to the second external connection terminals; and a volatile memory connected to the memory card controller. The shape of the card base and the configuration of the first external connection terminals are compliant or compatible with the plug-in UICC standard of ETSI TS 102 221 V4.4.0(2001-10). The second external connection terminals are positioned outside of the minimal range of the terminal configuration of the first external connection terminals specified by the standard, with the respective signal terminals of the first and second external connection terminals being electrically separated from each other.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：允许具有微型计算机和存储卡控制器的IC卡模块与SIM卡兼容并且处理快速存储器访问。解决方案：IC卡模块1包括多个第一外部连接端子11和多个第二外部连接端子12，两个第二外部连接端子暴露于卡座10的表面; 连接到第一外部连接端子的微型计算机; 连接到第二外部连接端子的存储卡控制器; 以及连接到存储卡控制器的易失性存储器。卡座的形状和第一外部连接端子的配置符合ETSI TS 102 221 V4.4.0（2001-10）的插件UICC标准。第二外部连接端子位于由标准规定的第一外部连接端子的端子结构的最小范围之外，第一和第二外部连接端子的各个信号端子彼此电分离。版权所有（C）2006，JPO＆NCIPI

35. 发明专利

JP2005084935A Memory card 有权
标题翻译：存储卡
公开(公告)号：JP2005084935A
公开(公告)日：2005-03-31
申请号：JP2003316002
申请日：2003-09-08
申请人： Renesas Technology Corp , 株式会社ルネサステクノロジ
发明人： NISHIZAWA HIROTAKA , HIGUCHI AKIRA , OSAWA KENJI , WADA TAMAKI , SUGIYAMA MICHIAKI , OSAKO JUNICHIRO
IPC分类号： G06K19/07 , G06F1/00 , G06K5/00 , G06K19/00 , G06K19/077 , H01L23/538 , H01L25/065 , H01L25/07 , H01L25/18
CPC分类号： G06K19/077 , G06K19/07732 , H01L23/5388 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0652 , H01L2224/05554 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/49171 , H01L2224/4943 , H01L2224/73265 , H01L2225/06562 , H01L2924/00014 , H01L2924/01046 , H01L2924/01055 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/3011 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： PROBLEM TO BE SOLVED: To restrain occurrence of a noise in an operation mode that makes security processing executed by applying an operation power only to a security controller. SOLUTION: A memory card comprises an interface controller (7) connected to an external connection terminal, a memory (8) connected to the interface controller, a security controller (9) connected to the interface controller, and a second external connection terminal (C15) that can apply operation power to the security controller, apart from a first external connection terminal (C4) that applies an operation power to the interface controller and the memory. An interface part (1) of the interface controller, connected to the security controller, receives the operation power from the second external connection terminal, and the supply of the operation power from the first external connection terminal can be made to suspend. This arrangement prevents the output of the interface part from becoming invalid, even if supply of the operation power to the interface controller is shut off. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：通过仅对安全控制器施加操作电力而进行安全处理的操作模式中，抑制噪声的发生。解决方案：存储卡包括连接到外部连接终端的接口控制器（7），连接到接口控制器的存储器（8），连接到接口控制器的安全控制器（9）和第二外部连接（C15），除了向接口控制器和存储器施加操作电力的第一外部连接端子（C4）外，还可以向安全控制器施加操作电力。连接到安全控制器的接口控制器的接口部分（1）接收来自第二外部连接终端的操作电力，并且能够使来自第一外部连接终端的操作电力的供应暂停。即使关闭对接口控制器的动作电力的供给，也能够防止接口部的输出变得无效。版权所有（C）2005，JPO＆NCIPI

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