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1. 发明专利

JP5165080B2 A method for manufacturing the Ic card and ic card 有权
公开(公告)号：JP5165080B2
公开(公告)日：2013-03-21
申请号：JP2011102688
申请日：2011-05-02
申请人：株式会社半導体エネルギー研究所
发明人：舜平山崎
IPC分类号： G06K19/077 , B42D15/10 , G06K19/07 , H01L23/538
CPC分类号： G06K19/07747 , G06K19/0704 , G06K19/072 , G06K19/0723 , G06K19/077 , G06K19/07703 , G06K19/07743 , G06K19/07749 , H01L23/5388 , H01L24/45 , H01L24/48 , H01L2224/16 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01015 , H01L2924/01047 , H01L2924/01079 , H01L2924/10253 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/19041 , H01L2924/3025 , H01L2924/00 , H01L2224/05599
摘要： The present invention includes an IC card that can realize high function without increasing the size of an IC chip, and that can realize cost reduction. The IC card has a first single crystal integrated circuit, a second integrated circuit, and a display device. The second integrated circuit and the display device are each formed from a thin film semiconductor film, over a plastic substrate, and the first single crystal integrated circuit is mounted on the plastic substrate so as to be electrically connected to the second integrated circuit.

2. 发明专利

JP2011138508A Method of manufacturing electronic card 有权
标题翻译：制造电子卡的方法
公开(公告)号：JP2011138508A
公开(公告)日：2011-07-14
申请号：JP2010287048
申请日：2010-12-24
申请人： Nagraid Sa , ナグラアイディーエス.エイ.
发明人： DROZ FRANCOIS
IPC分类号： G06K19/077 , B42D15/10
CPC分类号： G06K19/077 , G06K19/072 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165
摘要： PROBLEM TO BE SOLVED: To solve a major drawback that occurs as production of an electronic device is not temporally separated from production of an electronic card mounted with the electronic device, in a method of manufacturing the electronic card. SOLUTION: In the method of manufacturing the electronic card, prior to the production of an electronic card, that is, before a solid layer and other materials that constitute a body of the electronic card are mounted, an electronic assembly or an electronic device is manufactured first which is formed of: at least a first electronic unit that is provided in a window in the solid layer of the electronic card; and a second electronic unit that is arranged in an inner layer or the body of the electronic card. Accordingly, the electronic device mounted in each electronic card is manufactured in a preliminary step in accordance with a conventional process. To implement the preliminary step, a protection film constitutes several parts or one part that has at least one slit. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决的问题：为了解决在制造电子卡的方法中电子设备的生产在时间上不同于安装有电子设备的电子卡的生产时发生的主要缺点。解决方案：在制造电子卡的方法中，在生产电子卡之前，即在构成电子卡的主体的固体层和其它材料安装之前，电子组件或电子首先制造装置，其由至少第一电子单元形成，该第一电子单元设置在电子卡的固体层的窗口中; 以及布置在电子卡的内层或主体中的第二电子单元。因此，安装在每个电子卡中的电子装置根据常规方法在预备步骤中制造。为了实现预备步骤，保护膜构成具有至少一个狭缝的若干部分或一部分。版权所有（C）2011，JPO＆INPIT

3. 发明专利

JP3910185B2 Tag unit reader 有权
公开(公告)号：JP3910185B2
公开(公告)日：2007-04-25
申请号：JP2004106542
申请日：2004-03-31
申请人：東芝テック株式会社
发明人：貢一佐野 , 保仁喜地 , 信男室伏 , 泰夫松本
IPC分类号： G06K19/07 , G06K7/00 , G06K7/10
CPC分类号： G06K19/0723 , G06K19/072 , G06K19/07758 , G06K19/0776

4. 发明专利

JP2006252390A Ic card manufacturing method and ic card 审中-公开
标题翻译： IC卡制造方法和IC卡
公开(公告)号：JP2006252390A
公开(公告)日：2006-09-21
申请号：JP2005070640
申请日：2005-03-14
申请人： Renesas Technology Corp , 株式会社ルネサステクノロジ
发明人： NISHIZAWA HIROTAKA , OSAWA KENJI , OSAKO JUNICHIRO , WADA TAMAKI
IPC分类号： G06K19/077 , B42D15/10
CPC分类号： H01L23/49855 , G06K19/072 , G06K19/07732 , G06K19/07743 , H01L21/52 , H01L21/561 , H01L23/3121 , H01L24/45 , H01L24/48 , H01L24/97 , H01L25/0657 , H01L2224/451 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2225/06562 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/30105 , H01L2924/3025 , H01L2224/85 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a technology for improving the manufacturing yield of IC cards. SOLUTION: A semiconductor chip 7 is mounted on a wiring board 5 having an external connecting terminal 6, and an electrode 7a of the semiconductor chip 7 and wiring 10 of the wiring board 5 are electrically connected through a bonding wire 9. A sealing part 8 is then formed by a resin mold to form an IC body 4. A case 2 made of thermoplastic resin is prepared. After mounting the IC body 4 in a recess 11 of the case 2 through an adhesive 3, a region near the recess 11 of the case 2 is plastically deformed to fix the IC body 4 to the case 2. The adhesive 3 is then hardened to manufacture the IC card 1 comprising the case 2 and the IC body 4 improved in stability by being bonded to the case 2 through the adhesive 3. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供用于提高IC卡的制造成品率的技术。解决方案：半导体芯片7安装在具有外部连接端子6的布线板5上，并且半导体芯片7的电极7a和布线板5的布线10通过接合线9电连接。然后通过树脂模具形成密封部分8，以形成IC体4.制备由热塑性树脂制成的壳体2。通过粘合剂3将IC体4安装在壳体2的凹部11中后，壳体2的凹部11附近的区域发生塑性变形，将IC体4固定在壳体2上。然后使粘合剂3硬化制造包含外壳2和IC体4的IC卡1，通过粘合剂3与壳体2结合而提高了稳定性。（C）2006，JPO＆NCIPI

5. 发明专利

JP2006172122A Card type storage device 审中-公开
标题翻译：卡类存储设备
公开(公告)号：JP2006172122A
公开(公告)日：2006-06-29
申请号：JP2004363400
申请日：2004-12-15
申请人： Toshiba Corp , 株式会社東芝
发明人： ITO TAKAFUMI
IPC分类号： G06K19/077 , B42D15/10
CPC分类号： G06K19/07732 , G06K19/072 , G06K19/077 , H01L2224/05554
摘要： PROBLEM TO BE SOLVED: To surely prevent a chip from being damaged due to stress when a card is manufactured or used. SOLUTION: A controller chip 12 for receiving a command from the outside and performing processing corresponding to the command, a memory chip connected to the controller chip 12 to store data and an IC card function chip connected to the controller chip 12 to process security data are layered on a substrate, and the IC card function chip is arranged at a position other than the lowest layer. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：当制造或使用卡片时，确保防止芯片受到应力损坏。解决方案：一种用于从外部接收命令并执行与该命令相对应的处理的控制器芯片12，连接到控制器芯片12以存储数据的存储器芯片和连接到控制器芯片12的IC卡功能芯片，以处理安全数据层叠在基板上，IC卡功能芯片配置在除最低层以外的位置。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2004151968A Noncontact data transmitter/receiver 审中-公开
公开(公告)号：JP2004151968A
公开(公告)日：2004-05-27
申请号：JP2002315943
申请日：2002-10-30
申请人： Toppan Forms Co Ltd , トッパン・フォームズ株式会社
发明人： SAITO MITSUGI
IPC分类号： B42D15/10 , G06K19/07 , G06K19/077
CPC分类号： G06K19/07749 , G06K19/072
摘要： PROBLEM TO BE SOLVED: To provide a noncontact data transmitter/receiver that offers a large memory capacity, a small size, a wide communication distance range and many functions. SOLUTION: The noncontact data transmitter/receiver 1 comprises a substrate 2 of an insulating member, a first IC chip 3 and a second IC chip 4 arranged on one surface of the substrate 2 to control storage, processing and communication of data, and an antenna 5 of a conductive member connected to the first IC chip 3 and second IC chip 4. The antenna 5 has a plurality of coil portions 6 and connection portions 7 extended from opposite ends of the coil portions 6. The coil portions 6 constituting the antenna 5 are connected at one end to the first IC chip 3 and second IC chip 4 as passed on a second insulating member 8 disposed over the coil portions 6, and are connected at the other end direct to the first IC chip 3 and second IC chip 4. The first IC chip 3 and second IC chip 4 are connected parallel to the antenna 5. COPYRIGHT: (C)2004,JPO

7. 发明专利

JP2003533787A Chip card 审中-公开
公开(公告)号：JP2003533787A
公开(公告)日：2003-11-11
申请号：JP2001583460
申请日：2001-03-22
申请人：インフィネオンテクノロジーズアクチェンゲゼルシャフト
发明人：ハラルドグントラッハ， , ヨッヘンミュラー，
IPC分类号： G06K19/077
CPC分类号： G06K19/072 , G06K7/0095 , G06K19/077
摘要： (57)【要約】キャリアボディを備えるチップカードが提示される。このキャリアボディ内に、それぞれ複数の電気構成要素を備える、少なくとも１つのシステムコンポーネントが導入可能である。このシステムコンポーネントは、チップカード内で動作するための電気的機能を一体化して備える。ここで、このシステムコンポーネントは、チップカードのカードボディの上面と、ほぼ同一平面で終端する。電気構成要素の少なくとも１つは、チップカードの上面からアクセス可能である。

8. 发明专利

JP2017027967A 基板、無線タグ及び電子機器审中-公开
标题翻译：局，无线电标签和电子设备
公开(公告)号：JP2017027967A
公开(公告)日：2017-02-02
申请号：JP2015141394
申请日：2015-07-15
申请人：富士通株式会社
发明人：馬場俊二 , 中本裕之
IPC分类号： H01L23/12 , G06K19/02 , H05K1/02
CPC分类号： H05K1/028 , G06K19/0704 , G06K19/0716 , G06K19/072 , G06K19/07722 , G06K19/07728 , G06K19/07773 , H05K1/181 , H05K2201/10143
摘要：【課題】基材上に形成した導電材に搭載部品を接続した構造において、基材を折り曲げても折り曲げ部分で導電材の断線を防止する。【解決手段】柔軟性及び絶縁性を有する基材26と、柔軟性及び導電性を有し基材26上に形成される導電材(導電パターン28)と、基材26に搭載され導電材28に接続される搭載部品30と、有する。そして、柔軟性及び絶縁性を有し導電材28が縁部からはみ出すように基材26上で搭載部品30を覆い、縁部46の硬さが基材26の硬さよりも硬いカバー部材44を有する。【選択図】図4
摘要翻译：公开的是所述安装部分连接到形成在基板上的导电材料，通过弯曲基片，以防止即使在弯曲部的导电材料的断开的结构。和基板26具有可挠性和绝缘性，柔韧性和电导率都形成在基板26（导体图案28）上的导电材料，所述导电材料28安装在基座构件26上和安装部30连接到有。柔性和导电材料28具有绝缘性的基板26上覆盖安装部分30，以便从边缘突出，刚性覆盖部件44比边缘46的基础材料26的硬度的硬度一。点域4

9. 发明专利

JP5190504B2 Semiconductor device 有权
公开(公告)号：JP5190504B2
公开(公告)日：2013-04-24
申请号：JP2010272473
申请日：2010-12-07
申请人：株式会社半導体エネルギー研究所
发明人：舜平山崎 , 剛長多 , 康行荒井 , 祐子江波戸
IPC分类号： G06K19/10 , B42D15/10 , G06K7/00 , G06K17/00 , G06K19/07 , G06K19/077
CPC分类号： G06K19/072 , G06K7/0008 , G06K19/0723 , G06K19/07718 , G06K19/07749
摘要： The present invention provides a thin semiconductor device in which its security such as prevention of counterfeit or information leakage is to be enhanced. One feature of the present invention is a thin semiconductor device in which a plurality of thin film integrated circuits are mounted and in which at least one integrated circuit is different from the other integrated circuits in any one of a specification, layout, frequency for transmission or reception, a memory, a communication means, a communication rule and the like. According to the present invention, a thin semiconductor device tag having the plurality of thin film integrated circuits communicates with a reader/writer and at least one of the thin film integrated circuits receives a signal to write information in a memory, and the information written in the memory determines which of the thin film integrated circuits communicates.

10. 发明专利

JP5069569B2 Smart card, and a method of operating a smart card 有权
公开(公告)号：JP5069569B2
公开(公告)日：2012-11-07
申请号：JP2007555751
申请日：2006-02-14
申请人：コーニンクレッカフィリップスエレクトロニクスエヌヴィ
发明人：スリッケルフェール，ペーテル , ミュシアル，パヴェル
IPC分类号： G06K19/07 , G06K19/077
CPC分类号： G06K19/072 , G06K7/10297 , G06K19/0719 , G06K19/07309 , G06K19/077

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