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    • 31. 发明专利
    • SEMICONDUCTOR DEVICE
    • JPS62200783A
    • 1987-09-04
    • JP4177386
    • 1986-02-28
    • HITACHI LTD
    • OISHI AKIOTSUJI SHINJIHIRAO MOTONAOMATSUMURA HIROYOSHI
    • H01L29/73H01L21/331H01L29/205H01L29/737H01S5/00
    • PURPOSE:To obtain a highly reliable semiconductor device such as a lateral single-mode semiconductor laser having a low threshold current value which is not changed in association with lapse of operating time, by utilizing InGaAsP layers for all or a part of semiconductor layers forming NPN- or PNP-type junctions. CONSTITUTION:All or a part of semiconductor layers forming PNP- or NPN- type junctions are formed of InGaAsP. For example, an InGaAsP active layer 7 and a P-type InP layer 8 are formed on an N-type InP substrate 1 by means of the liquid-phase growth process. After that, a mesa stripe is formed with the active layer 7 of a width of about 1mum left. A P-type InGaAsP layer 2, a P-type InP layer 3 and an N-type InP layer 4 are formed on opposite sides of the mesa by means of the liquid-phase growth process. Subsequently, a P-type InP layer 5 and a P-type InGaAsP layer 6 are grown on the whole surface to produce a semiconductor laser. In this contruction, the layers 4, 3 and 2 and the substrate 1 constitute an NPN structure in which an intermediate P-type layer is provided by the InGaAsP layer 2. These layers act as current blocking layers for preventing electric current from flowing out of the active layer.
    • 35. 发明专利
    • Semiconductor laser
    • 半导体激光器
    • JPS6184890A
    • 1986-04-30
    • JP20623784
    • 1984-10-03
    • Hitachi Ltd
    • SAITO KATSUTOSHITSUJI SHINJIOISHI AKIOKAYANE NAOKI
    • H01L21/3205H01L23/52H01S5/00H01S5/026H01S5/042H01S5/12H01S5/227
    • H01S5/227H01L24/05H01L2224/04042H01L2224/48463H01S5/026H01S5/12H01S5/2275
    • PURPOSE:To reduce the electrostatic capacitance produced by an electrode provided on the main surface side, by a method wherein the electrode structure constructed of an ohmic electrode having a specific width, one or more lead terminals to supply power to this electrode, and one or more bonding pads to connect lead wires for external connection is used to excite the active region. CONSTITUTION:A diffraction grating is formed in the surface of an n type InP substrate 40, and an InGaAsP guide layer 41, an InGaAsP active layer 42, an InGaAsP antimeltback layer 43, a p type InP clad layer 44, and a p- InGaAsP surface layer 45 are laminated thereon. The guide, active, antimeltback, clad, and surface layers are constructed in stripe form by selective etching, and the width of the active layer is adjusted at about 6mum. The stripe mesa part including the active layer 42 is filled with the liquid epitaxial grown layers of a p-InP layer 46, an n-InP layer 47, and an InGaAsP surface layer 48, resulting in the construction of a DFB type laser of BH structure. The substrate is provided with an ohmic electrode 49 made of Au-Ge-Ni-Au.
    • 目的:为了减小由主表面侧的电极产生的静电电容,通过这样一种方法,其中由具有特定宽度的欧姆电极构成的电极结构,一个或多个用于向该电极供电的引线端子,以及一个或 用于连接用于外部连接的引线的更多接合焊盘用于激发有源区。 构成:在n型InP衬底40的表面和InGaAsP导向层41,InGaAsP有源层42,InGaAsP抗反射层43,p型InP覆盖层44和pInGaAsP表面中形成衍射光栅 层45。 通过选择性蚀刻,引导,主动,防反射,包层和表面层以条纹形式构成,活性层的宽度调节为约6μm。 包括有源层42的条状台面部分填充有p-InP层46,n-InP层47和InGaAsP表面层48的液体外延生长层,从而构造了BHB型激光器 结构体。 衬底设有由Au-Ge-Ni-Au制成的欧姆电极49。
    • 39. 发明专利
    • BURIED TYPE SEMICONDUCTOR LASER
    • JPH03205887A
    • 1991-09-09
    • JP67890
    • 1990-01-08
    • HITACHI LTD
    • OISHI AKIO
    • H01S5/00H01S5/22H01S5/223H01S5/323
    • PURPOSE:To make it possible to embody a buried structure with ease even in the case of a semiconductor laser provided with cladding made of a material which is hard to make a buried growth by lattice-maching an active layer with a material system, which is different from a cladding layer, on a buried layer and using a 111-V group semiconductor whose band width is greater than that of the active layer. CONSTITUTION:An attempt is made to grow an n-(Al0.6Ga0.4)0.51In0.49P cladding layer 2, an In0.49Ga0.51P active layer 3, p-(Al0.6Ga0.4)0.51In0.49P cladding layer 4, and a p-GaAs cap layer 5 on an n-Ga substrate 1 and form reverse mesa stripes, and bury both sides of the mesa stripes with a p-Al0.5Ga0.2As layer 6, and an n-Al0.8Ga0.2As layer 7, which are different from an AlGaInP system of the cladding layer. In this case, the x of the AlxGa1-xAs used for embedding growth is adapted to be larger than the band width of the AlGaInP active layer and fail to exceed a differential lattice constant of 0.2% of the active layer as well.