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    • 1. 发明专利
    • PELTIER COOLER AND OPTICAL ELEMENT MODULE
    • JPH1154806A
    • 1999-02-26
    • JP20881897
    • 1997-08-04
    • HITACHI LTD
    • KUWANO HIDEYUKIOISHI AKIO
    • G02B6/42H01L35/32H01S3/04H01S5/00H01S5/024H01S3/18
    • PROBLEM TO BE SOLVED: To wire the inside of the package of a Peltier cooler with a single process by providing an electrode for supplying current on the low or high temperature-side surface of the Peltier cooler, incorporating the Peltier cooler in an optical element module, and then wiring the package by wire bonding. SOLUTION: After a laser diode 4, a lens 5, a thermistor 6, and a photodiode 3 have been mounted on a subcarrier 2, the subcarrier 2 is fixed to the low- temperature substrate 11 of a Peltier cooler 9. Then, the cooler 9 is housed in a package 1, and a high-temperature substrate 10 of the cooler 9 is fixed to the bottom of the package 1. In addition, a negative electrode 12 and a positive electrode 13 are connected in series with a Peltier element via through- holes 14. Moreover, the electrodes of the laser diode 4, the thermistor 6, and the photodiode 3 and the electrodes 12 and 13 of the cooler 9 are connected to the wiring pattern of a package-connecting substrate 8 through Au wires 7. Therefore, the internal wiring of the package 1 can be performed with a single process.
    • 2. 发明专利
    • SEMICONDUCTOR LASER
    • JPH02240988A
    • 1990-09-25
    • JP6096989
    • 1989-03-15
    • HITACHI LTD
    • KAJIMURA TAKASHITANAKA TOSHIAKIOISHI AKIOKONDO MASAHIKO
    • H01S5/00
    • PURPOSE:To contrive decrease in a series resistance and improvement in temperature characteristics and perform high output operation at a high temperature by using a p-type substrate that is made up by layers which contain a highly concentrated p-type impurities on a part or the whole surface of a substrate crystal. CONSTITUTION:Zn is diffused on the surface of a p-type GaAs substrate 1 and a p-type impurity highly concentrated layer 2 is formed. After that, a p-type Al0.25Ga0.25In0.5P clad layer 3, an In0.5Ga0.5P active layer 4, an n-type Al0.25Ga0.25 In0.5P clad layer 5, and an N-type GaAs cap layer 6 are formed by MOCVD. Subsequently, an SiO2 film 7 having a stripe groove is formed through photolithography and CVD processes. After forming an n-type electrode 8, a p-type electrode 9 is formed and laser chips are obtained by cleaving this member. Consequently, a p-type impurity concentration in a p-type clad layer of an AlInGaP system 0.6mum band laser is allowed to be highly concentrated easily after producing favorable control effect. Decrease in a series resistance as well as the overflow of injected carriers into a p-type clad layer 5 is achieved and high output operation of a laser at a high temperature is thus performed.
    • 3. 发明专利
    • SEMICONDUCTOR LASER
    • JPH02181985A
    • 1990-07-16
    • JP131189
    • 1989-01-09
    • HITACHI LTD
    • MINAGAWA SHIGEKAZUKONDO MASAHIKOTANAKA TOSHIAKIOISHI AKIOSAITO KATSUTOSHI
    • H01S5/00
    • PURPOSE:To sharply improve the continuous oscillation temperature of a semiconductor laser by forming a double heterostructure body consisting of a mixed crystal of AlGaInP on a p-type GaAs substrate in the order of a p-type light guide layer, active layer, and n-type light guide layer and, it the same time, a current constriction means so as to limit the current area injected into the n-type light guide layer. CONSTITUTION:A p-GaInP layer 32, p-AlGaInP layer 33, GaInP active layer 34, n-AlGaInP layer 35, n-GaAs surface protective layer 36 are successively grown epitaxially on a p-type GaAs 100 substrate crystal 31. After forming the layers 32-36, a photoresist layer 37 (6mum in width and 4mum in thickness) is formed on the wafer and boron ions 38 are implanted under an acceleration voltage of 250KeV in an implanting density of 1X10 pieces/cm . After implantation, the layer 37 is removed and an n-GaAs layer 40 is further formed on the protective layer 36, so as to obtain a wafer for gain waveguide type semiconductor laser containing an electric current blocking layer 39 insulated by the ion implantation.
    • 4. 发明专利
    • SEMICONDUCTOR LASER DEVICE AND ITS MANUFACTURE
    • JPH01309393A
    • 1989-12-13
    • JP13939088
    • 1988-06-08
    • HITACHI LTD
    • OTOSHI SOOISHI AKIOUOMI KAZUHISAYAMAGUCHI KEN
    • H01S5/00
    • PURPOSE:To obtain a semiconductor laser whose efficiency is high and whose high-temperature characteristic is excellent by a method wherein a stepped part is formed at a side part of a mesa and is filled and a position of a P-N interface of a buried layer is aligned with the stepped part with good controllability. CONSTITUTION:A light guide layer 2, an active layer 3, an antimeltback layer 4, a clad layer 5 and a cap layer are grown one after another on a substrate 1 by a liquid growth method. The surface of the substrate 1 is etched by using an etching liquid by making use of a photoresist as a mask; a mesa with a stripe width of 1mum is formed. About 0.1mum of only InP in a mesa part 1a of the substrate 1 and in the clad layer 5 is etched selectively; a stepped part is formed at a boundary between the antimeltback layer 4 and the clad layer 5. Buried layers 7 and 8 are formed by using a liquid growth method. A contact hole is bored; after that, Zn is diffused selectively; a Zn diffusion region 9 is formed. A P-type electrode 11 and an N-type electrode 12 are formed by using an evaporation method. By this setup, a semiconductor laser whose efficiency is high and whose high-temperature characteristic is excellent can be obtained.
    • 6. 发明专利
    • OPTICAL INTEGRATED CIRCUIT
    • JPS63108788A
    • 1988-05-13
    • JP25382086
    • 1986-10-27
    • HITACHI LTDHITACHI CABLE
    • MATSUMURA HIROYOSHISAKANO SHINJITSUJI SHINJIOISHI AKIOINOUE HIROAKIHIRAO MOTONAO
    • G02B6/12G02B6/42H01S5/00
    • PURPOSE:To obstruct reflected return beams while stabilizing a laser output and a wavelength by forming a tapered optical guide between a semiconductor laser and the optical guide. CONSTITUTION:An optical integrated circuit is constituted of a semiconductor laser region A and an optical guide region B, an optical guide 1 for a semiconductor laser is shaped in the region A, and a tapered optical guide 2 is formed in the region B. Beams projected by the taper of the optical guide 2 are condensed gradually and changed into an original single mode, and projected to another optcal element, and the single mode reversely reflected from the optical element and being returning is turned slowly into another mode, and mismatched to the waveguide 1, and the projection of a return wave is hindered. A rotational grating 4 is shaped to a section corresponding to the laser section A on the InP substrate 1 for a distributed feedback type semiconductor laser by the irradiation of electron beams, and laser structure having an active layer 5 is formed through an LPE method. A crystal in the tapered optical guide section B is gotten rid of, and the crystal structure of the tapered optical guide 2 is formed through selective epitaxial growth.