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31. 发明专利

JPH08337613A POLYOLEFIN COMPOSITION AND METHOD FOR PREPARING THE SAME 失效
公开(公告)号：JPH08337613A
公开(公告)日：1996-12-24
申请号：JP14497095
申请日：1995-06-12
申请人： FUJIKURA LTD
发明人： NAKAMURA SHIYOUICHIROU , KOBAYASHI KAZUHARU
IPC分类号： C08F8/00 , C08F255/00
摘要： PURPOSE: To prevent an age resister from being exuded even when it is compounded with a polyolefin such as polyethylene. CONSTITUTION: This method for preparing a polyolefin composition comprises mixing a polyolefin with an age resister and an organic peroxide in an amount necessary to graft the age resister onto the polyolefin and kneading the mixture at the reaction initiation temperature or above to graft the age resister onto the polyolefin.

32. 发明专利

JPH08180739A LUBRICATED INSULATED ELECTRIC WIRE AND ITS MANUFACTURE 失效
公开(公告)号：JPH08180739A
公开(公告)日：1996-07-12
申请号：JP32342294
申请日：1994-12-26
申请人： FUJIKURA LTD
发明人： KOBAYASHI KAZUHARU , AMANO SHIGERU
IPC分类号： H01B7/02 , H01B13/00
摘要： PURPOSE: To present an excellent heat resistance and endurance against application of processing and also enhance the lubricating effect by mixing a liquid phase carbon fluoride with insulation varnish, and furnishing a lubricating layer consisting of this resin compound on a conductor directly or through an insulating layer. CONSTITUTION: An insulating layer 2 is furnished on a conductor 1, and a lubricating layer 3 is formed on this insulating layer 2. The lubricating layer 3 is formed by applying and baking resin compound prepared by mixing lubricant with insulative varnish. The lubricant consists of carbon fluoride of liquid form in the range of 5-40 deg.C such as perfluoroalkanes expressed by CnF2 n+2 , for example C7 F16 , C8 F18 , inert liquid of fluorine series, fluorocarbons, fluorocarbon iodide such as F(CF2 )4 CH2 CH2 I, F(CF2 )6 I, and fluorocarbons of amine series such as F(CF2 )CH2 NH2 . The resultant object excels in the heat resistance to enable high temp. baking, and the durability and anti-abrasiveness are excelennt and a long time service is ensured.

33. 发明专利

JPH08176247A RESIN COMPOSITION AND INSULATED WIRE 失效
公开(公告)号：JPH08176247A
公开(公告)日：1996-07-09
申请号：JP32342194
申请日：1994-12-26
申请人： FUJIKURA LTD
发明人： SUGIYAMA SHUICHI , ONO AKINOBU , KOBAYASHI KAZUHARU , SAWAMOTO TAKEHITO
IPC分类号： C08K3/16 , C08F290/00 , C08F299/06 , C08G18/67 , C08K5/09 , C08K5/56 , C08L75/00 , C08L75/16 , C09D175/14 , C09D175/16 , H01B3/30
摘要： PURPOSE: To enable an insulated wire having an insulating layer formed from an ultraviolet-curable urethane acrylate resin to be soldered at a low temp. in a short time. CONSTITUTION: 100 pts.wt. ultraviolet-curable urethane acrylate resin is compounded with 1-10 pts.wt. inorg. metal compd. (e.g. zinc chloride or iron chloride) or organometallic compd. (e.g. dibutyltin dilaurate, cobalt naphthenate, or iron 2-ethylhexoate), then applied to a conductor 1, and cured by irradiating with ultraviolet ray, thus forming an insulating layer 2.

34. 发明专利

JPH02245656A REFERENCE SAMPLE INJECTION MEASUREMENT FOR GAS CHROMATOGRAPHY MASS SPECTROSCOPY 失效
公开(公告)号：JPH02245656A
公开(公告)日：1990-10-01
申请号：JP6658089
申请日：1989-03-19
申请人： FUJIKURA LTD
发明人： KOBAYASHI KAZUHARU
IPC分类号： G01N27/62 , G01N30/72
摘要： PURPOSE:To enable the obtaining of a mass number data under the same conditions as those of an analysis data of a sample to be measured by setting a location of injecting a standard sample in an original analysis line to inject the sample under the same conditions as those of the sample to be measured. CONSTITUTION:A branch section 12 is provided at a part of a connection (analysis) line 11 between a gas chromatography apparatus system GC and a separator S. A standard sample reservoir 14 is provided at a branch line branched off the branch section 12 to supply a standard sample to the reservoir from an injector 15 such as microsyringe and a standard sample cylinder 16 or the like. When a standard sample is supplied into the analysis line 11 by injection, it is fed to a mass spectrograph system MS passing through the separator S. Thus, a mass number data of the sample is obtained under the same conditions as those of an analysis data of a sample to be measured.

35. 发明专利

JP2011018808A Double-sided flexible printed-circuit board 审中-公开
标题翻译：双面柔性印刷电路板
公开(公告)号：JP2011018808A
公开(公告)日：2011-01-27
申请号：JP2009163070
申请日：2009-07-09
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： NOGAMI ATSUKI , KOBAYASHI KAZUHARU , NAKAMURA SHOICHIRO
IPC分类号： H05K1/11
摘要： PROBLEM TO BE SOLVED: To provide a double-sided FPC having superior elasticity.
SOLUTION: The double-sided FPC 100 includes an insulating board 1 having a first surface 1a, a second surface 1b opposite to the first surface 1a, and a through-hole 2 formed to penetrate the first and second surfaces 1a and 1b, conductive layers 10 and 20 formed on the first surface 1a and the second surface 1b, and a conductive portion 30 formed on the inner wall surface 2a of the through-hole 2. The conductive layers 10 and 20 each have a thickness of 5 to 12 μm. When the thickness of each of the conductive layers 10 and 20 is d μm and the diameter of the through-hole 2 is ϕ μm, the double-sided FPC 100 satisfies d/ϕ=0.4 to 2.5.
COPYRIGHT: (C)2011,JPO&INPIT

36. 发明专利

JP2009295635A Printed wiring board 审中-公开
标题翻译：印刷线路板
公开(公告)号：JP2009295635A
公开(公告)日：2009-12-17
申请号：JP2008145057
申请日：2008-06-02
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： SHINODA TATSUNORI , KOBAYASHI KAZUHARU
IPC分类号： H05K1/11
摘要： PROBLEM TO BE SOLVED: To improve conduction reliability of a printed wiring board.
SOLUTION: The printed wiring board 10 includes insulated substrates 12 formed of polyimide resin or the like, through-hole electrodes 14 provided on the insulated substrates 12 and passing through the insulated substrates in a thickness direction or the insulated substrate 12, and connection lands 16 formed of conductive material copper or the like on at least one surfaces of the insulated substrates 12 and connected to the through-hole electrodes 14. The plurality of the through-hole electrodes 14 are formed on the insulated substrates 12, and the connection lands 16 are connected to the plurality of the through-hole electrodes 14.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提高印刷电路板的传导可靠性。解决方案：印刷电路板10包括由聚酰亚胺树脂等形成的绝缘基板12，设置在绝缘基板12上并穿过绝缘基板沿厚度方向的绝缘电极14或绝缘基板12，以及在绝缘基板12的至少一个表面上由导电材料铜等形成的连接焊盘16，并连接到通孔电极14.多个通孔电极14形成在绝缘基板12上，连接平台16连接到多个通孔电极14.版权所有：（C）2010，JPO＆INPIT

37. 发明专利

JP2005268593A Printed-wiring board and manufacturing method thereof 审中-公开
标题翻译：印刷电路板及其制造方法
公开(公告)号：JP2005268593A
公开(公告)日：2005-09-29
申请号：JP2004080200
申请日：2004-03-19
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： FUJINAMI HIDEYUKI , KOBAYASHI KAZUHARU
IPC分类号： H05K3/28 , H05K1/02 , H05K3/18
摘要： PROBLEM TO BE SOLVED: To promote high-density packaging by making a pitch fine, by enhancing the separation-resistant properties of a conductor without increasing the conductive width and securing improved insulating characteristics between conductors and migration-resistant properties even in a printed-wiring board in which a conductive circuit is formed by an additive method. SOLUTION: A conductive circuit 14 is formed on an insulating base 11, conductive width La in a part 14A for packaging electronic components in the conductive circuit 14 is set to be a conductive width requested by the packaging of electronic components, conductive width Lb in a part 14B other than that is narrowed as compared with the conductive width La of a part for packaging electronic components, and the part 14B in which the conductive width is narrower than the conductive width of the part 14A for packaging electronic components is covered with a solder resist layer 16, thus increasing the separation-resistant strength of the conductive circuit 14. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了通过提高间距精细来提高高密度封装，通过提高导体的耐分离性而不增加导电宽度并确保导体之间的绝缘特性和耐迁移性能，即使在印刷电路板，其中通过添加方法形成导电电路。解决方案：导电电路14形成在绝缘基底11上，用于将导电电路14中的电子元件封装的部分14A中的导电宽度La设定为电子部件封装所要求的导电宽度，导电宽度与包装电子部件用部件的导电宽度La相比，除了与其相比较的部分14B中的部分14B被覆盖，导电宽度比包装电子部件的部分14A的导电宽度窄的部分14B被覆盖具有阻焊层16，从而提高导电电路14的耐分离强度。版权所有（C）2005，JPO＆NCIPI

38. 发明专利

JP2005166910A Printed wiring board and its manufacturing method 审中-公开
标题翻译：印刷线路板及其制造方法
公开(公告)号：JP2005166910A
公开(公告)日：2005-06-23
申请号：JP2003403057
申请日：2003-12-02
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： FUJINAMI HIDEYUKI , HIGUCHI REIJI , KOBAYASHI KAZUHARU
IPC分类号： C25D5/10 , C25D7/00 , H05K3/18
摘要： PROBLEM TO BE SOLVED: To provide a printed wiring board by an additive method in which undercut is small without the need of a special processing such as a dry processing and a failure of cover material loading and a failure such as peeling of a conductor circuit are not produced.
SOLUTION: The conductor circuit 13 is composed of a lower region 14 on a conductive seed layer side and an upper region 15 on a tip surface side in electrolytic copper plating layers of different metal structures by an adjustment of electroplating current density. The electrolytic copper plating layer of the lower region 14 is made of the metal structure more precise than electrolytic copper plating layer of the upper region 15.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：通过添加方法提供印刷线路板，其中底切小，不需要诸如干法加工和覆盖材料加载的故障等特殊加工，以及诸如剥离导体电路不产生。解决方案：通过调整电镀电流密度，导体电路13由导电种子层侧的下部区域14和不同金属结构的电解镀铜层的前端面上的上部区域15构成。下部区域14的电解镀铜层由比上部区域15的电解铜电镀层更精确的金属结构构成。版权所有（C）2005，JPO＆NCIPI

39. 发明专利

JP2005044928A Dry film for plating resist, and method of forming circuit of printed board 有权
标题翻译：印刷电路用干膜及印刷电路形成方法
公开(公告)号：JP2005044928A
公开(公告)日：2005-02-17
申请号：JP2003201775
申请日：2003-07-25
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： KOBAYASHI KAZUHARU , FUJINAMI HIDEYUKI , HIGUCHI REIJI , ICHIKAWA MASATERU
IPC分类号： G03F7/004 , H05K3/18
摘要： PROBLEM TO BE SOLVED: To conduct circuit formation satisfactorily by a semi-additive method by stably supplying plating current when the circuit formation by a semi-additive method. SOLUTION: A dry film 10 for plating resist is used which is such that a plating resist material portion 12 and a conductive material portion 13 for supplying plating current are each formed in layers in different regions on one side of a support 11. COPYRIGHT: (C)2005,JPO&NCIPI

40. 发明专利

JPH10134646A AMMONIA-RESISTANT INSULATED WIRE 失效
公开(公告)号：JPH10134646A
公开(公告)日：1998-05-22
申请号：JP28885096
申请日：1996-10-30
申请人： FUJIKURA LTD
发明人： NAKAO HIROHIKO , KOBAYASHI KAZUHARU , JUMONJI SADAMITSU , AMANO SHIGERU , NAKANO KEIJI , HATANAKA YOSHIMASA
IPC分类号： C09D5/25 , C09D201/00 , H01B3/30 , H01B7/28
摘要： PROBLEM TO BE SOLVED: To make a resin coating film thin in thickness and prevent a finished wire from being enlarged in diameter by providing an enamel coating film on a conductor, extrusion-coat a thermoplastic resin on the film, making the extruded resin coating film thin in thickness, and preventing a pinhole, if any, from reaching the conductor with the enamel coating film of the inner layer. SOLUTION: An extruded resin coating film 3 is made thicker in thickness than an enamel coating film 2 to have ammonia resistance and mechanical strength, however the wire diameter is unpreferably increased when it is made too thick. The film 2 is provided on the inside of the film 3, and the film 3 is made thin. Even if a pinhole occurs on the film 3, the film 2 having no pinhole exists on the inside of the film 3, the hole insulator has no pinhole, and the characteristic deterioration is prevented. The film 3 is extrusion-coated with a thermoplastic resin having good ammonia resistance, and it is not deteriorated in the ammonia atmosphere. The obtained wire is not enlarged in diameter, and a coil formed with this wire is prevented from being enlarged.

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