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31. 发明专利

JP2014045013A Method and device for positioning object onto substrate 有权
标题翻译：用于将对象定位到基板上的方法和装置
公开(公告)号：JP2014045013A
公开(公告)日：2014-03-13
申请号：JP2012185463
申请日：2012-08-24
申请人： Bondtech Inc , ボンドテック株式会社
发明人： YAMAUCHI AKIRA
IPC分类号： H01L21/68 , H01L21/60 , H01L21/677
CPC分类号： H01L24/96 , H01L21/568 , H01L2224/04105 , H01L2224/18
摘要： PROBLEM TO BE SOLVED: To provide a method and a device for attaching a chip to a substrate, on which a mark is not put although positioning by marking is employed, with high positioning accuracy.SOLUTION: A method for positioning an object on a substrate includes step S11 for preparing a substrate support having a substrate supporting surface for supporting the substrate, and a substrate support side mark put at a predetermined position on the substrate supporting surface, step S12 for preparing the object having a mark region in which an object side mark is put, step S13 for attaching a transparent substrate onto the substrate supporting surface of the substrate support, and step S14 for positioning the object on the substrate by using light transmitting through the substrate and the mark region of the object in a direction substantially perpendicular to the substrate supporting surface of the substrate support, recognizing the images of the substrate support side mark and the object side mark, thereby measuring and correcting a relative position error between the object and substrate.
摘要翻译：要解决的问题：提供一种用于将芯片附着到基板上的方法和装置，尽管采用了通过标记进行定位的标记，但是其具有高的定位精度。解决方案：一种将物体定位在基板上的方法包括用于制备具有用于支撑基板的基板支撑表面的基板支撑件的步骤S11和放置在基板支撑表面上的预定位置的基板支撑侧标记，用于准备具有标记区域的物体的步骤S12，其中物体侧标记放置，用于将透明基板附着到基板支撑体的基板支撑表面上的步骤S13，以及通过使用在基板垂直方向上透过基板和物体的标记区域的光将物体定位在基板上的步骤S14 到基板支撑体的基板支撑表面，识别基板支撑侧标记和对象的图像从而测量和校正物体和衬底之间的相对位置误差。

32. 发明专利

JP2013042148A Transfer method and transfer device 有权
标题翻译：传输方法和传输设备
公开(公告)号：JP2013042148A
公开(公告)日：2013-02-28
申请号：JP2012204102
申请日：2012-09-18
申请人： Bondtech Inc , ボンドテック株式会社
发明人： YAMAUCHI AKIRA
IPC分类号： H01L21/027 , B29C59/02 , G01B11/00
摘要： PROBLEM TO BE SOLVED: To provide a technology capable of imprinting a concavo-convex pattern included by an original plate on a transfer liquid layer on a substrate easily and with high positional accuracy.SOLUTION: An alignment mark is formed on each of an original plate M and substrate S under the condition that a concavo-convex pattern P face on the original plate M is in contact with a transfer liquid layer coated on the substrate S. One recognition means 3 images one of the alignment marks from a direction from which both alignment marks are overlapped before imaging the other alignment mark, and performs positional error correction processing on each of obtained pictures of both alignment marks. Thereby, highly accurate alignment becomes possible by using both alignment mark pictures after the correction.
摘要翻译：要解决的问题：提供一种能够容易地并且以高位置精度将原版包含的凹凸图案在基板上的转印液层上印刷在基板上的转印液层上的技术。解决方案：在原版M上的凹凸图案P面对与涂布在基板S上的转印液层接触的条件下，在原版M和基板S的每一个上形成对准标记。一个识别意味着从成像另一个对准标记之前两个对准标记重叠的方向的3个图像中的一个对准标记，并且对获得的两个对准标记的图像执行位置误差校正处理。因此，通过在校正之后使用两个对准标记图像，可以进行高精度对准。版权所有（C）2013，JPO＆INPIT

33. 发明专利

JP2011119717A Bonding system and bonding method 有权
标题翻译：粘接系统和粘接方法
公开(公告)号：JP2011119717A
公开(公告)日：2011-06-16
申请号：JP2010247508
申请日：2010-11-04
申请人： Bondtech Inc , Tadatomo Suga , ボンドテック株式会社 , 唯知須賀
发明人： SUGA TADATOMO , YAMAUCHI AKIRA
IPC分类号： H01L21/60
CPC分类号： H01L24/80 , H01L24/81 , H01L2224/13021 , H01L2224/16111 , H01L2224/80895 , H01L2224/80896 , H01L2224/81895 , H01L2224/81896
摘要： PROBLEM TO BE SOLVED: To provide a bonding technology capable of securing the favorable bonding strength of both objects to be bonded without forming a resin layer necessarily when both the objects to be bonded are connected electrically.
SOLUTION: In a bonding system, two objects 91 and 92 to be bonded each having a bonding part PT1 composed of one of Au(gold), Cu(copper) and Al(aluminum) and a bonding part PT2 composed of one of one of Si(silicon), SiO
2 (silicon dioxide) or glass on bonding surfaces thereof are bonded. In the bonding system, each bonding surface of two objects 91 and 92 to be bonded is subjected to hydrophilic treatment by an energy wave, and then the two objects 91 and 92 to be bonded are pressed and bonded in a state that the bonding parts PT1 of the two objects 91 and 92 to be bonded and the bonding parts PT2 of the two objects 91 and 92 to be bonded are brought into contact with each other.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种接合技术，其能够在要被接合的物体两端电连接的同时，在不形成树脂层的情况下确保两接合物的良好的接合强度。解决方案：在接合系统中，要结合的两个物体91和92具有由Au（金），Cu（铜）和Al（铝）之一组成的接合部分PT1和由一个的Si（硅），SiO 2 （二氧化硅）之一或其结合面上的玻璃。在接合系统中，要接合的两个物体91和92的每个接合表面通过能量波进行亲水处理，然后在待接合的两个物体91和92被压接和接合在接合部分PT1 要接合的两个物体91和92的两个物体91和92的接合部分PT2彼此接触。版权所有（C）2011，JPO＆INPIT

34. 发明专利

JP2011071225A Alignment device 有权
标题翻译：对齐设备
公开(公告)号：JP2011071225A
公开(公告)日：2011-04-07
申请号：JP2009219545
申请日：2009-09-24
申请人： Bondtech Inc , ボンドテック株式会社
发明人： YAMAUCHI AKIRA , KUWAUCHI SHIGEKI
IPC分类号： H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide an alignment device capable of precisely adjusting relative positions of two objects, while reducing the number of imaging sections. SOLUTION: An alignment device 1 for aligning between a semiconductor chip 21 and a substrate 31 includes a tool 23, a stage 35, an imaging section 10, mirrors 41 and 43, a switching control section and a calculation section. The mirrors 41 and 43 are provided, in such manner that is insertable and removable to and from the gap between the semiconductor chip 21 and the substrate 31. The switching control section switches between a first state where an optical image about the semiconductor chip 21 reaches the imaging section 10 via the mirror 41, and a second state where an optical image about the substrate 31 reaches the imaging section 10 via the mirror 43, by relatively moving the imaging section 10 and the mirrors 41 and 43. The calculation section calculates the relative positional relationship between the semiconductor chip 21 and the substrate 31, based on a first imaged picture obtained by the imaging section 10, in the first state and a second photographed image obtained by the imaging section 10 in the second state. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供能够精确地调节两个物体的相对位置的对准装置，同时减少成像部分的数量。解决方案：用于对准半导体芯片21和基板31的对准装置1包括工具23，台35，成像部10，反射镜41和43，切换控制部和计算部。反射镜41和43以这样的方式设置，即可插入和移出半导体芯片21和衬底31之间的间隙。切换控制部分在半导体芯片21周围的光学图像到达的第一状态之间切换成像部10经由反射镜41以及通过相对移动摄像部10和反射镜41,43而使基板31的光学图像经由反射镜43到达摄像部10的第二状态。计算部计算基于由成像部10获得的第一成像图像在第一状态下的半导体芯片21和基板31之间的相对位置关系，以及由第二状态的由成像部10获得的第二拍摄图像。版权所有（C）2011，JPO＆INPIT

35. 发明专利

JP2011051328A Pressurizing equipment and pressurizing process and device 有权
标题翻译：加压设备和加压过程和设备
公开(公告)号：JP2011051328A
公开(公告)日：2011-03-17
申请号：JP2010030439
申请日：2010-02-15
申请人： Bondtech Inc , ボンドテック株式会社
发明人： YAMAUCHI AKIRA
IPC分类号： B29C43/36 , B29C33/20 , B29C43/02 , B29C43/58 , B81C99/00 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To provide a pressurizing technique capable of controlling mutual clearance of pressurized objects more accurately. SOLUTION: A pressurizing equipment 1 is equipped with a stage 12, a head 22, a range finding sensor 33 and a piezoactuator 31, etc. The stage 12 and the head 22 are relatively movable in Z direction while countering separated in Z direction. Both objects to be pressurized 91 and 92 are set intervening between a pressurizing surface of stage 12 and a pressurizing surface of head 22. Both the objects to be pressurized 91 and 92 are arranged interposing a layer of flowable substance (thermosetting resin, etc.) in between. A mutual distance in Z direction of both the objects 91 and 92 is measured in a plurality of positions (e.g. three positions) within the plane parallel to XY plane by the range finding sensor 33, etc. Additionally, the pressurizing surface of stage 12 and the pressurizing surface of head 22 are moved relatively based on those measured results to that the mutual distances in the plurality of positions may respectively approach their target values. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供能够更精确地控制加压物体的相互间隙的加压技术。解决方案：加压设备1配备有台12，头22，测距传感器33和压电致动器31等。台12和头22在Z方向上相对移动，同时在Z方向上分离方向。要加压的物体91和92被设置在阶段12的加压表面和头部22的加压表面之间。要加压的物体91和92被布置成一层可流动的物质（热固性树脂等）之间。通过测距传感器33等在与XY平面平行的平面内的多个位置（例如3个位置）测量物体91,92的Z方向的相互距离。此外，台12的加压面基于这些测量结果，头22的加压表面相对移动，使得多个位置中的相互距离可以分别接近其目标值。版权所有（C）2011，JPO＆INPIT

36. 发明专利

JP2010247229A Joining device, joining method and semiconductor device 有权
标题翻译：接合装置，接合方法和半导体器件
公开(公告)号：JP2010247229A
公开(公告)日：2010-11-04
申请号：JP2010008207
申请日：2010-01-18
申请人： Bondtech Inc , ボンドテック株式会社
发明人： YAMAUCHI AKIRA
IPC分类号： B23K20/24 , B23K20/00 , B23K20/26 , C23C14/34 , C23C14/46
摘要： PROBLEM TO BE SOLVED: To provide a joining technique by which excellent joined condition is materialized by reducing deposits to an joined object. SOLUTION: The joining surfaces of joined objects 91, 92 are each activated by irradiating the joining surfaces with an energy wave (e.g., an atomic beam by beam irradiation parts 11, 12). Then, at least one of the joined objects 91, 92 subjected to surface activation treatment is moved. After the movement, from the side of the opposing space of the two faced joined objects 91, 92, an energy wave (e.g., an ion beam by a beam irradiation part 31) is emitted to the opposing space. As a result, the joining surfaces of the joined objects 91, 92 are activated, and the joined objects 91, 92 are approximated each other and joined. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种接合技术，通过减少对接合物的沉积物来实现优良的接合条件。解决方案：通过用能量波照射接合表面（例如，通过光束照射部分11,12的原子束），各个激活接合物体91,92的接合表面。然后，进行表面活化处理的接合对象91,92中的至少一个移动。在移动之后，从两个面对的连接对象91,92的相对空间的一侧，能量波（例如，光束照射部31的离子束）被发射到相对的空间。结果，接合对象91,92的接合表面被激活，并且接合对象91,92彼此近似并接合。版权所有（C）2011，JPO＆INPIT

37. 发明专利

JP2009220151A Joining method and device made by this method, joining apparatus, and substrate joined by this method 有权
标题翻译：通过本方法接合的接合方法和装置，接合装置和通过该方法接合的基板
公开(公告)号：JP2009220151A
公开(公告)日：2009-10-01
申请号：JP2008068032
申请日：2008-03-17
申请人： Bondtech Inc , ボンドテック株式会社
发明人： YAMAUCHI AKIRA
IPC分类号： B23K20/00 , B23K20/02 , B23K20/04 , B23K20/14 , H01L23/02
摘要： PROBLEM TO BE SOLVED: To provide a technique for encapsulating a prescribed atmosphere in a space formed by being surrounded in the contour with a joint part between the joining faces of two substrates thereby surely shielding the space from the outside atmosphere. SOLUTION: The outer peripheral joint parts 831b formed in a lid substrate 807 and a device substrate 808 are pressurized and temporarily joined to each other, so that a prescribed atmosphere can be encapsulated in the space surrounded with the outer peripheral joint parts 831b between the joining faces of both substrates 807, 808. Regular joining therefore can be surely performed between the inner joint parts 831a of the respective substrates 807, 808 by pressurizing the inner joint parts in the prescribed atmosphere inside the space. Consequently, the prescribed atmosphere is encapsulated in the space formed by being surrounded in the contour with the inner joint parts 831a between the joining faces of the respective substrates 807, 808 and simultaneously this space can be surely shielded from the outside atmosphere. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于在由两个基板的接合面之间的接合部分在轮廓中包围形成的空间中封装规定的气氛的技术，从而可靠地将外部空间屏蔽在外部气氛中。解决方案：形成在盖基板807和器件基板808中的外周接头部分831b被加压并暂时接合，使得规定的气氛可以被封装在由外周接头部分831b包围的空间中在两个基板807,808的接合面之间。通过在空间内的规定气氛中对内部接合部进行加压，能够可靠地在各基板807,808的内侧接合部831a之间进行规则接合。因此，规定的气氛被包封在由轮廓中包围的空间中，内侧接合部831a在各基板807,808的接合面之间，同时该空间可以确实地与外界气氛隔离。版权所有（C）2010，JPO＆INPIT

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