会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 28. 发明专利
    • Method of eliminating foreign material
    • 消除外来材料的方法
    • JP2009057195A
    • 2009-03-19
    • JP2007228068
    • 2007-09-03
    • Mitsubishi Rayon Co Ltd三菱レイヨン株式会社
    • TERAKAWA TETSUYA
    • B65H5/00B08B1/04B29C71/00
    • PROBLEM TO BE SOLVED: To provide a method of eliminating foreign materials capable of efficiently eliminating large chips, chips adhered in the state of sticking a protection film, and furthermore, foreign materials adhered to the protection film by static electricity.
      SOLUTION: This is a method of eliminating foreign materials adhered to an outer surface of a protection film of a plastic sheet conveyed, and coated with the protection film on the surface thereof. An adhesive roller A is brought in contact with an outer surface of the protection film of the plastic sheet coated with the protection film on the surface thereof so that the foreign materials adhered to the outer surface of the protection film are adhered to the adhesive roller A. Continuously, an adhesive roller B having adhesiveness higher than that of the adhesive roller A is brought in contact with the adhesive roller A, so that the foreign material is adhered to the adhesive roller B.
      COPYRIGHT: (C)2009,JPO&INPIT
    • 要解决的问题:提供一种消除能够有效地消除大芯片,在粘贴保护膜的状态下粘附的芯片的异物的方法,此外,通过静电附着到保护膜上的异物。 解决方案:这是消除附着在输送的塑料薄片的保护膜的外表面上的异物并在其表面上涂覆有保护膜的方法。 粘合辊A与其表面上涂覆有保护膜的塑料片的保护膜的外表面接触,使得粘附到保护膜的外表面的异物粘附到粘合辊A 连续地,具有比粘合辊A的粘合性高的粘合剂辊B与粘合辊A接触,从而异物附着在粘合辊B上。(C)2009, JPO和INPIT