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    • 24. 发明专利
    • PACKAGING MATERIAL FOR ELECTRONIC PARTS CUSTODY BAGS
    • JPS6490743A
    • 1989-04-07
    • JP24926387
    • 1987-10-02
    • FUJITSU LTDFUJIMORI KOGYO CO
    • OTAGURO HIROYUKISHINJO MAMORUHIRATA JUNICHI
    • H01B17/64B32B7/02B32B7/12B32B15/08B65D85/38B65D85/86
    • PURPOSE:To obtain a packaging material having an excellent antistatic property, stable air-tightness and stable moisture vapor resistance, by forming an antistatic layer on the outside of a synthetic resin film layer and an air-tight and moisture-vapor- resistant layer inside of the said synthetic resin film layer, and laminating in turn the said synthetic resin film layer as the outermost layer, a synthetic resin film layer having a metal foil and a hot-glueable resin layer. CONSTITUTION:A packaging material 10 used for manufacturing electronic parts custody bags is the material made by laminating in turn a synthetic resin film layer 1, having an antistatic layer 1A formed on its outside and an air-tight and moisture- vapor-resistant layer 1B formed on its inside, as the outermost layer, a synthetic resin layer 3 having a metal foil 3A and a hot-glueable resin layer 4. The synthetic resin film layer 1 is a film of polyester, nylon etc., and the antistatic layer 1A is made by solving an antistatic agent such as anionic activator and the like in a solvent to make a solution and coating the surface of the said synthetic resin film layer 1 with the solution. The air-tight and moisture-vapor-resistant layer 1B is formed by coating the opposite side to the antistatic layer 1A of the synthetic resin film layer 1 with polyvinyliden chloride. For the antistatic purpose, carbon black, a various kinds of surfactants etc. may be added to and mixed with the heat bonding resin layer 4.