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21. 发明专利

JP2009096050A Liquid droplet jetting apparatus 有权
标题翻译：液体喷射式喷射装置
公开(公告)号：JP2009096050A
公开(公告)日：2009-05-07
申请号：JP2007269173
申请日：2007-10-16
申请人： Brother Ind Ltd , ブラザー工業株式会社
发明人： KUBO TOMOYUKI , IMAI KOJI
IPC分类号： B41J2/045 , B41J2/055 , B41J2/16
CPC分类号： B41J2/1609 , B41J2/14209 , B41J2/1623 , B41J2/1631 , B41J2002/14217 , B41J2002/14225 , B41J2002/14306 , B41J2002/14419 , B41J2002/14491 , H05K1/092 , H05K3/245 , H05K3/3452 , H05K3/363 , H05K2201/09427 , H05K2201/099 , H05K2203/0465 , Y10T29/49401
摘要： PROBLEM TO BE SOLVED: To prevent short circuit from occurring at soldering of the electrode land of a wiring member to the surface electrode of an actuator. SOLUTION: The wiring member 11 include a substrate 55, a conductive wire material 64 provided on one surface of the substrate 55, and a covering member 59 covering the conductive wire material 64. The conductive wire material 64 has an electrode land 61 connected to a surface electrode 50, and a conductive wire 60 continuous with the electrode land 61. The covering member 59 has a first covering layer 56 which has a first opening 56a for exposing the electrode land 61, and a second covering layer 57 having a second opening 57a covering the first covering layer 56 and communicating with the first opening 56a. The second opening 57a is greater than the first opening 56a. The area of the surface electrode 50 is larger than an exposed area of the individual electrode land 61. The surface electrode 50 is projected partially toward an outside of the electrode land 61. The surface electrode 50 and the electrode land 61 are connected by solder 58 through the first and second openings 56a and 57a. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了防止在将配线构件的电极焊盘焊接到致动器的表面电极处发生短路。布线构件11包括衬底55，设置在衬底55的一个表面上的导线材料64以及覆盖导线材料64的覆盖构件59.导线材料64具有电极焊盘61 连接到表面电极50和与电极接合部61连续的导电线60.覆盖部件59具有第一覆盖层56，该第一覆盖层56具有用于暴露电极焊盘61的第一开口56a和具有第二覆盖层57的第二覆盖层57，第二开口57a覆盖第一覆盖层56并与第一开口56a连通。第二开口57a大于第一开口56a。表面电极50的面积大于单个电极焊盘61的露出面积。表面电极50部分地朝向电极焊盘61的外侧突出。表面电极50和电极焊盘61通过焊料58连接通过第一和第二开口56a和57a。版权所有（C）2009，JPO＆INPIT

22. 发明专利

JP2008275418A Wiring board and electric current detector 审中-公开
标题翻译：接线板和电流检测器
公开(公告)号：JP2008275418A
公开(公告)日：2008-11-13
申请号：JP2007118731
申请日：2007-04-27
申请人： Omron Corp , オムロン株式会社
发明人： NAGASHIMA ATSUSHI
IPC分类号： G01R15/14 , G01R19/00 , H05K3/34
CPC分类号： H05K3/3421 , G01R1/203 , H05K1/111 , H05K3/222 , H05K2201/09281 , H05K2201/09381 , H05K2201/09909 , H05K2203/0465 , H05K2203/167 , Y02P70/611 , Y02P70/613
摘要： PROBLEM TO BE SOLVED: To provide a wiring board and an electric current detector for accurately detecting a potential difference in a shunt resistance and a detected electric current without being affected by soldering. SOLUTION: Lands for thereon mounting rectangular faces of the shunt resistance on its both end parts comprise: lands 11 and 12 each having a rectangular portion and disposed at a prescribed space centering on a center line CL; and lands 13 and 14 whose areas are smaller than those of the lands 11 and 12, each disposed on one end part of the land 11 or 12, and connected to the lands 11 and 12, respectively. Wiring patterns for detecting the potential difference between the both end parts of the shunt resistance comprise: a wiring pattern 21 connected to the land 13 and led out from the land 13 toward the land 14; a wiring pattern 22 connected to the land 14 and led out from the land 14 toward the land 13; and wiring patterns 23 and 24 connected to the wiring patterns 21 and 22, respectively, and led out in one direction. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于在不受焊接影响的情况下精确地检测分流电阻和检测电流的电位差的布线板和电流检测器。解决方案：在其两端部安装分流电阻的矩形面的地面包括：每个具有矩形部分并且以以中心线CL为中心的规定空间设置的平台11和12; 以及其面积小于焊盘11和12的焊盘区域13和14，每个焊盘13和14分别设置在焊盘11或12的一个端部，并分别连接到焊盘11和12。用于检测分流电阻的两端部之间的电位差的接线图案包括：连接到焊盘13并从焊盘13引导到焊盘14的布线图案21; 连接到焊盘14并从焊盘14引导到焊盘13的布线图案22; 以及分别连接到布线图案21和22并沿一个方向引出的布线图案23和24。版权所有（C）2009，JPO＆INPIT

23. 发明专利

JP2008192859A Semiconductor device and its manufacturing method 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：JP2008192859A
公开(公告)日：2008-08-21
申请号：JP2007026209
申请日：2007-02-06
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： OMORI HIROHARU , OIDA SHIGEJI
IPC分类号： H01L23/12
CPC分类号： H05K3/3436 , H01L21/4853 , H01L23/49816 , H01L23/49838 , H01L23/49866 , H01L24/48 , H01L2224/451 , H01L2224/48227 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/15311 , H01L2924/181 , H05K3/3463 , H05K2201/094 , H05K2203/0465 , Y02P70/613 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： PROBLEM TO BE SOLVED: To increase a bonding strength of each ball electrode, in a semiconductor device in which an electronic circuit is constituted by jointing a semiconductor element to an electrode on a surface of a circuit substrate having two or more electrodes on both front and rear faces, and a ball electrode for external connection is arranged on two or more electrodes on the rear face. SOLUTION: Nickel and gold platings are applied in this order sequentially to each surface of two or more electrode portions 5 on the rear face of a circuit substrate 1. Each ball electrode on the electrode portions 5 is formed at an interface by alloy formation, where a solder ball 6 made of solder containing tin, silver and copper, and no lead, is heated and melted on the electrode portion 5. Out of them, the interface intensity of the ball electrode on the electrode portion 5a on the perimeter portion of the substrate is increased by cooling from the side of the electrode portion 5a in the heating and melting time of the solder ball 6. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了增加每个球电极的接合强度，在通过将半导体元件连接到具有两个或更多个电极的电路基板的表面上的电极构成电子电路的半导体器件中前后表面均设有两个或更多个电极上的外部连接用球形电极。解决方案：依次将镍和金电镀施加到电路基板1的背面上的两个或更多个电极部分5的每个表面上。电极部分5上的每个球形电极通过合金形成在界面处形成，其中由含有锡，银和铜的焊料制成的焊锡球6并且没有引线在电极部分5上被加热和熔化。其中，球形电极在周边的电极部分5a上的界面强度通过在焊球6的加热和熔化时间内从电极部分5a的侧面冷却来增加基板的一部分。（C）2008，JPO＆INPIT

25. 发明专利

JP3480826B2 Electronic module manufacturing method, the inter-substrate bonding method, cone shape solder forming method, and the substrate 有权
公开(公告)号：JP3480826B2
公开(公告)日：2003-12-22
申请号：JP2000006956
申请日：2000-01-14
申请人：インターナショナル・ビジネス・マシーンズ・コーポレーション
发明人：キャシリーン・アン・サタルター , シャジー・フォーク , ジョン・ユー・ニッカーボッカー , スコット・アイラ・ランゼンタール , スディピタ・クマー・ロイ , ピーター・ジェフリー・
IPC分类号： B23K1/00 , H01L21/60 , H01L23/48 , H01L23/485 , H05K3/24 , H05K3/30 , H05K3/34
CPC分类号： H01L24/81 , H01L24/11 , H01L24/13 , H01L2224/0401 , H01L2224/05666 , H01L2224/05671 , H01L2224/0603 , H01L2224/06505 , H01L2224/10135 , H01L2224/11002 , H01L2224/11472 , H01L2224/1184 , H01L2224/13017 , H01L2224/13019 , H01L2224/13082 , H01L2224/13111 , H01L2224/13116 , H01L2224/1403 , H01L2224/14505 , H01L2224/16058 , H01L2224/16238 , H01L2224/81136 , H01L2224/81139 , H01L2224/8121 , H01L2224/81815 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15787 , H01L2924/351 , H05K3/303 , H05K3/3436 , H05K3/3457 , H05K3/3473 , H05K2201/10992 , H05K2201/2036 , H05K2203/0113 , H05K2203/0465 , Y02P70/613 , H01L2924/00 , H01L2924/01083 , H01L2924/013 , H01L2924/00013 , H01L2924/00014
摘要： A method of forming non-spherically shaped solder interconnects, preferably conical, for attachment of electronic components in an electronic module. Preferably, the solder interconnects of the present invention are cone shaped and comprise of depositing a first solder followed by a second solder having a lower reflow temperature than the first solder. Warm placement of the electronic component at a somewhat elevated temperature than room temperature but less than the solder reflow temperature reduces the force required during placement of a semiconductor chip to a substrate. After warm placement, reflow of the module occurs at the lower reflow temperature of the second solder. The conical shape of the solder interconnects are formed by a heated coining die which may also coin a portion of the interconnects with flat surfaces for stand-offs. The ability of the cone shaped solder interconnects to meet the opposing surface of a chip or substrate at different heights accommodates the camber typically associated with chip and substrate surfaces.

28. 发明专利

JP6349734B2 品質管理装置、品質管理方法、およびプログラム有权
公开(公告)号：JP6349734B2
公开(公告)日：2018-07-04
申请号：JP2014004106
申请日：2014-01-14
申请人：オムロン株式会社
发明人：田中真由子 , 藤井心平 , 森弘之
IPC分类号： H05K3/34
CPC分类号： H05K3/341 , G01N2021/95646 , H05K1/0269 , H05K3/3426 , H05K3/3442 , H05K13/0817 , H05K13/083 , H05K2203/0465 , H05K2203/162 , Y02P70/613

29. 发明专利

JP2017195378A パワーモジュールの製造方法审中-公开
公开(公告)号：JP2017195378A
公开(公告)日：2017-10-26
申请号：JP2017101088
申请日：2017-05-22
申请人：東芝マテリアル株式会社 , 株式会社東芝
发明人：加藤寛正
IPC分类号： H05K3/38 , H01L23/13 , H01L23/12 , C04B37/02 , B23K1/00 , B23K1/19 , B23K35/30 , C22C5/06 , H05K1/09
CPC分类号： H05K3/062 , B23K1/0016 , C04B37/026 , H01L21/44 , H01L23/15 , H01L23/3735 , H05K3/06 , H05K3/38 , B23K2201/36 , C04B2235/658 , C04B2235/96 , C04B2235/9607 , C04B2237/125 , C04B2237/126 , C04B2237/127 , C04B2237/343 , C04B2237/366 , C04B2237/368 , C04B2237/706 , H01L2924/0002 , H05K1/0306 , H05K2201/0355 , H05K2203/013 , H05K2203/0392 , H05K2203/0465 , H05K2203/0545 , H05K2203/125 , H05K2203/167 , H05K3/067 , H05K3/202 , H05K3/3484 , Y10T29/49156
摘要：【課題】空隙等による欠陥の少ないろう材はみ出し部を有し、耐熱サイクルが向上されたセラミックス回路基板を提供すること。【解決手段】一実施形態に係るセラミックス回路基板は、セラミックス基板(1)と、銅回路板(5)と、ろう材はみ出し部(4a)とを備える。銅回路板(5)は、セラミックス基板(1)の少なくとも一方の面に、Ag、Cu及びTiを含むろう材層を介して接合されている。ろう材はみ出し部(4a)は、銅回路板(5)の側面から外側にはみ出したろう材層で形成されている。ろう材はみ出し部(4a)中のTi相およびTiN相の合計は3質量%以上で、かつセラミックス基板と銅回路板の間に介在されたろう材層4b中のTi相およびTiN相の合計量と異なっている。ろう材はみ出し部(4a)における1個当たりの面積が200μm 2 以下の空隙が1つ以下(0を含む)である。【選択図】図6

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