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21. 发明专利

JP2013101953A Battery pack containing pcm using safety member 有权
标题翻译：使用安全会员的包含PCM的电池组
公开(公告)号：JP2013101953A
公开(公告)日：2013-05-23
申请号：JP2013000701
申请日：2013-01-07
申请人： Lg Chem Ltd , エルジー・ケム・リミテッド
发明人： PARK YOUNGSUN , LEE JON SUK , AHN KEUNPYO , KIM CHUNYEON , HA JOUNG HO , WAKEBE MASAYUKI
IPC分类号： H01M2/34 , H01M2/10 , H01M2/30 , H01M2/36
CPC分类号： H01M2/34 , H01M2/0404 , H01M10/0525 , H01M10/425 , H01M10/4257 , H01M2010/4271 , H01M2200/00 , H01M2200/103 , H01M2200/106 , H01M2220/30 , H05K1/0201 , H05K3/222 , H05K3/341 , H05K2201/10022 , H05K2201/10181 , H05K2201/1028 , Y02E60/122
摘要： PROBLEM TO BE SOLVED: To provide a battery pack including a protection circuit module (PCM) electrically connected to a battery cell, wherein the PCM is provided with a safety device of which a circuit is cut off when temperature is high or a large amount of current flows.SOLUTION: Disclosed herein is a battery pack including a battery cell having an electrode assembly of a cathode/separator/anode structure mounted in a battery case together with an electrolyte in a sealed state, and a protection circuit module (PCM) 150 electrically connected to the battery cell, wherein the PCM is provided with a safety device of which a circuit is cut off when temperature is high or a large amount of current flows.
摘要翻译：要解决的问题：提供一种电池组，其包括电连接到电池单元的保护电路模块（PCM），其中PCM设置有当温度高时切断电路的安全装置或大量电流流动。解决方案：本文公开了一种电池组，其包括电池单元，其具有阴极/隔板/阳极结构的电极组件，阴极/隔板/阳极结构与密封状态的电解质一起安装在电池壳体中，以及保护电路模块（PCM）150 电连接到电池单元，其中PCM设置有当温度高或电流大时电路被切断的安全装置。版权所有（C）2013，JPO＆INPIT

22. 发明专利

JP5034453B2 Electronic component built-in multilayer board 有权
公开(公告)号：JP5034453B2
公开(公告)日：2012-09-26
申请号：JP2006310578
申请日：2006-11-16
申请人：株式会社デンソー
发明人：大伊藤 , 板橋　　徹
IPC分类号： H05K3/46
CPC分类号： H05K1/181 , H05K1/0227 , H05K1/023 , H05K1/0231 , H05K1/0233 , H05K1/0295 , H05K1/185 , H05K2201/093 , H05K2201/09663 , H05K2201/09954 , H05K2201/10022 , H05K2201/1003 , H05K2201/10151 , H05K2201/10189 , H05K2203/1572 , Y02P70/611 , Y10T29/4913

23. 发明专利

JP4865182B2 Printed circuit board and memory modules for memory module 有权
公开(公告)号：JP4865182B2
公开(公告)日：2012-02-01
申请号：JP2002262735
申请日：2002-09-09
申请人：三星電子株式会社Samsung Electronics Co.,Ltd.
发明人：光燮金 , 基顕高
IPC分类号： H01L25/00 , H01L25/04 , G11C5/04 , H01L25/18 , H05K1/02 , H05K7/10
CPC分类号： H05K1/023 , G11C5/04 , H01L2924/0002 , H05K1/0231 , H05K1/0246 , H05K2201/10022 , H05K2201/10522 , H05K2201/10689 , H01L2924/00

24. 发明专利

JP4744578B2 The constant temperature of the crystal oscillator 有权
公开(公告)号：JP4744578B2
公开(公告)日：2011-08-10
申请号：JP2008244373
申请日：2008-09-24
申请人：日本電波工業株式会社
发明人：学伊藤
IPC分类号： H03B5/32 , H01L23/34 , H03H9/02
CPC分类号： H05K1/0201 , G05D23/1906 , G05D23/24 , H01L2924/0002 , H03L1/028 , H03L1/04 , H05K2201/09781 , H05K2201/10022 , H05K2201/10083 , H05K2203/1105 , H05K2203/165 , H01L2924/00

26. 发明专利

JP2011077224A Insulation circuit board, and power semiconductor device or inverter module using the insulation circuit board 有权
标题翻译：绝缘电路板和功率半导体器件或使用绝缘电路板的逆变器模块
公开(公告)号：JP2011077224A
公开(公告)日：2011-04-14
申请号：JP2009225903
申请日：2009-09-30
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： MATSUMOTO KEIKI , KUSUKAWA JUNPEI
IPC分类号： H01L23/12 , H01L25/07 , H01L25/18
CPC分类号： H05K1/056 , H01L23/142 , H01L23/49844 , H01L23/62 , H01L23/647 , H01L25/072 , H01L25/18 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , H05K1/0204 , H05K1/0256 , H05K1/0257 , H05K1/0262 , H05K1/053 , H05K2201/0154 , H05K2201/0162 , H05K2201/0209 , H05K2201/0761 , H05K2201/09781 , H05K2201/10022 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an insulation circuit board, reducing concentration of electric fields at the ends of wiring patterns, suppressing partial discharge and having high reliability, in a high voltage insulation circuit board to be used in power devices such as power converters including, for example, power semiconductor devices, inverter modules and the like.
SOLUTION: The insulation circuit board includes a metal base substrate and wiring patterns formed on at least one face of the metal base substrate with an insulating layer disposed therebetween. Between two adjacent wiring patterns having a potential difference among the wiring patterns, one or more wiring patterns or conductors are arranged, wherein the wiring patterns or conductors are brought into contact with the insulating layer and have a potential that is in between the potential difference between the two adjacent wiring patterns. The insulation circuit board reduces concentration of electric fields at the ends of the wiring patterns on which a high voltage is applied, thereby improving a partial discharge resistant characteristic.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种绝缘电路板，在用于诸如电力设备的功率器件中使用的高压绝缘电路板中，减少布线图案末端的电场浓度，抑制局部放电和高可靠性功率转换器包括例如功率半导体器件，逆变器模块等。解决方案：绝缘电路板包括金属基底基板和在金属基底基板的至少一个表面上形成有布置在其间的绝缘层的布线图案。在布线图案之间具有电位差的两个相邻布线图案之间，布置一个或多个布线图案或导体，其中布线图案或导体与绝缘层接触，并且具有介于两者之间的电位差之间的电位两个相邻的布线图案。绝缘电路板减少施加高电压的布线图案的端部处的电场的集中，从而提高耐局部放电特性。版权所有（C）2011，JPO＆INPIT

27. 发明专利

JPWO2009011423A1 無線ＩＣデバイス有权
公开(公告)号：JPWO2009011423A1
公开(公告)日：2010-09-24
申请号：JP2009523685
申请日：2008-07-18
申请人：株式会社村田製作所
发明人：加藤　登 , 登加藤 , 聡石野 , 聡石野 , 猛片矢 , 猛片矢 , 育平木村 , 育平木村 , 伸郎池本 , 伸郎池本 , 雄也道海 , 雄也道海
IPC分类号： H01Q1/44 , G06K19/07 , G06K19/077 , H01Q1/50
CPC分类号： G06K19/07779 , G06K19/06187 , G06K19/0723 , G06K19/07749 , G06K19/07756 , G06K19/07773 , G06K19/07783 , G06K19/07784 , G06K19/07786 , H01L23/49838 , H01L23/552 , H01L23/66 , H01L2223/6677 , H01L2224/48091 , H01L2224/48227 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01Q1/36 , H01Q1/38 , H01Q1/42 , H01Q1/44 , H01Q7/00 , H01Q9/16 , H01Q9/30 , H01Q13/10 , H05K1/0216 , H05K1/0237 , H05K1/0239 , H05K1/141 , H05K1/16 , H05K1/181 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10098 , H05K2201/10371 , H05K2201/10522 , H01L2924/00014 , H01L2924/00
摘要：放射特性の低下を招来することなく小型化を達成できる無線ICデバイスを得る。送受信信号を処理する無線ICチップ(5)と、インダクタンス素子を含む給電回路を設けた給電回路基板(10)とからなる電磁結合モジュール(1)を備えた無線ICデバイス。給電回路基板(10)には給電回路と電磁界結合する外部電極が設けられ、該外部電極はシールドケース(28)又は配線ケーブルと電気的に接続されている。シールドケース(28)又は配線ケーブルが放射板として機能し、シールドケース(28)又は配線ケーブルで受信された信号によって無線ICチップ(5)が動作され、該無線ICチップ(5)からの応答信号がシールドケース(28)又は配線ケーブルから外部に放射される。放射板として機能する金属部品はプリント配線基板(20)上に設けたグランド電極であってもよい。

28. 发明专利

JP2009295643A Multilayer printed circuit board 有权
标题翻译：多层印刷电路板
公开(公告)号：JP2009295643A
公开(公告)日：2009-12-17
申请号：JP2008145181
申请日：2008-06-02
申请人： Toshiba Corp , 株式会社東芝
发明人： OKANO SUKEMUTSU
IPC分类号： H05K3/46 , H05K1/02
CPC分类号： H05K1/0234 , H05K1/0298 , H05K3/0005 , H05K2201/09236 , H05K2201/09354 , H05K2201/10022 , H05K2201/10446
摘要： PROBLEM TO BE SOLVED: To provide a multilayer printed circuit board having a high EMI suppression effect. SOLUTION: On each of first to sixth wiring layers 101 to 106 composing the multilayer printed circuit board, an EMI suppression wiring 200 is formed in a substantial loop shape. The EMI suppression wiring 200 is wired along the peripheries of each of circuit layers 101 to 106 and spirally formed. COPYRIGHT: (C)2010,JPO&INPIT

30. 发明专利

JP2008016470A Printed circuit board 有权
标题翻译：印刷电路板
公开(公告)号：JP2008016470A
公开(公告)日：2008-01-24
申请号：JP2006183025
申请日：2006-07-03
申请人： Aica Kogyo Co Ltd , Nec Corp , アイカ工業株式会社 , 日本電気株式会社
发明人： ARAI NOBUHIRO , TANAKA AKIHIRO
IPC分类号： H05K1/02 , H05K1/18
CPC分类号： H05K1/0234 , H05K1/0231 , H05K2201/09236 , H05K2201/09309 , H05K2201/10022 , H05K2201/10159
摘要： PROBLEM TO BE SOLVED: To achieve stable operation of a high-speed DRAM in a printed circuit board in which the high-speed DRAM and a memory controller are mounted. SOLUTION: In the printed wiring board 1 in which the high-speed DRAM 42 and the memory controller 41 are mounted; a serial connection circuit consisting of a capacitor 45 and a resistor 46 has almost the same resistance value as that of characteristic impedance of a VTT power supply pattern, and is provided between the VTT power supply pattern 20 as a connection destination of a parallel termination resistor 44 of a memory bus wiring 43 and a GND pattern 30. With this configuration, the serial connection circuit can consume a high-frequency noise generated or propagating in the VTT power supply pattern due to an operation between the high-speed DRAM and the memory controller 41. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了在安装有高速DRAM和存储器控制器的印刷电路板中实现高速DRAM的稳定操作。解决方案：在安装有高速DRAM42和存储器控制器41的印刷电路板1中，由电容器45和电阻46组成的串联电路具有与VTT电源图案的特性阻抗几乎相同的电阻值，并且设置在作为并联终端电阻的连接目的地的VTT电源图案20之间 44的存储器总线布线43和GND图案30.由于这种配置，串行连接电路可以消耗由于高速DRAM和存储器之间的操作而在VTT电源模式中产生或传播的高频噪声控制器41.版权所有（C）2008，JPO＆INPIT

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