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    • 21. 发明专利
    • DIGITAL ETCHING METHOD
    • JPH03110844A
    • 1991-05-10
    • JP24972589
    • 1989-09-26
    • RIKAGAKU KENKYUSHO
    • MEGURO TAKASHIHAMAGAKI MANABUHARA TAMIOAOYANAGI KATSUNOBU
    • C23F4/00G11B9/00G11B9/14H01L21/302
    • PURPOSE:To make it possible to obtain etching characteristics, which are stable and have a controllability in an atomic layer level, by a method wherein before a beam is projected, reactive gas is evacuated and the reactive gas which does not contribute to adsorption to the surfaces of solid materials is evacuated from the interior of a container. CONSTITUTION:This digital etching method is a method wherein reactive gas 2 is adsorbed to the surfaces of solid materials 1 in a container and after this gas is evacuated, an etching is controlled at an atomic layer level by repeating a process for projecting a charged particle beam or an optical beam 3. That is, by the adsorption of the gas 2 to the surfaces of the materials 1, the coupling of adsorbed solid atoms 1' with the materials 1 is weakened, then, the atoms 1' only weakened their coupling are etched through the materials 1 with the charged particle beam or the optical beam 3 which is projected. Thereby, stable etching characteristics which do not depend on the amount of the gas 2, which is fed, and the amount of the beam, which is projected, can be realized having a controllability at the atomic layer level.
    • 28. 发明专利
    • CONCAVED ECHELETTE GRATING AND ITS PROCESS
    • JPS55131730A
    • 1980-10-13
    • JP3880279
    • 1979-03-31
    • RIKAGAKU KENKYUSHOSHIMADZU CORP
    • AOYANAGI KATSUNOBUNANBA SUSUMUSANO KAZUO
    • G01J3/18G02B5/18G02B27/44
    • PURPOSE:To obtain an echelette grating with a single blaze angle by forming a lattice groove in a film provided on a concaved substrate, by making the grate- shaped film a mask for the substrate and by treating the substrate by ion or electron etching. CONSTITUTION:The film 3 is provided on the concaved grating substrate 2 and is coated with the photoresist 4. An interference fringe that is an original form of a diffraction grating is printed on the substrate, which is developed to leave the grate-shaped film 3. The film 3 plays a role of the mask in the ion or electron etching process. The etching rate is minimum when the process is performed in the direction perpendicular or approximately parallel to the incident direction of ions, and it is maximum in a face that makes a certain angle with the incident beam. Accordingly when the ion beam I is applied to the surface of the substrate at a proper angle beta as shown in Figure, the etching is carried out quickly in the direction perpendicular to the surface of substrate, and is carried out slowly in the direction perpendicular to the grate face, then the etching progresses as shown by (A), (B) and (C) in Figure, the asymmetric groove is formed. An alpha is a blaze angle.