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21. 发明专利

JP2004103936A Power semiconductor device and manufacturing method thereof 审中-公开
公开(公告)号：JP2004103936A
公开(公告)日：2004-04-02
申请号：JP2002265587
申请日：2002-09-11
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： KASHIBA YOSHIHIRO , NAKAO KAZUNARI , CHIBA HIROSHI , KAMIGAI YASUMI , FUKADA MASAKAZU
IPC分类号： H01L23/473 , H01L25/07 , H01L25/18
CPC分类号： H01L2224/45015 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00011 , H01L2924/13055 , H01L2924/00 , H01L2924/00014 , H01L2924/2076 , H01L2924/01005 , H01L2924/01004
摘要： PROBLEM TO BE SOLVED: To provide a low-cost power semiconductor device possessing both favorable heat radiation characteristics and compactness.
SOLUTION: There are provided a power semiconductor device body (B in Fig.) on which a power semiconductor element 1 whose heating density is high is mounted, and a heat sink (A in Fig.) which releases heat from the power semiconductor element 1. A metal wire 8 of the heat sink is formed on a metal layer 3b, and contacts a cooling fluid. The metal wire 8 is enclosed with a cover 9 so that the cooling fluid is held. The metal wire 8 contacts the cooling fluid. The heat shifts from the metal wire 8 to the fluid so that the heat generated at the power semiconductor element 1 is efficiently released.
COPYRIGHT: (C)2004,JPO

22. 发明专利

JP2003001378A Die device 有权
标题翻译： DIE设备
公开(公告)号：JP2003001378A
公开(公告)日：2003-01-07
申请号：JP2001189535
申请日：2001-06-22
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： TANAKA SHIGEYUKI , KASHIBA YOSHIHIRO , WATANUKI KAORU
IPC分类号： B22D18/04 , B22C9/06 , B22D17/22 , B29C33/04 , B29C45/73
CPC分类号： B29C45/73
摘要： PROBLEM TO BE SOLVED: To provide a die device capable of improving a cooling effect of a die even the die reaches a high temperature.
SOLUTION: In the die device, a cavity face 12 is formed in a mobile side die 11 along a shape of a forming body, a space part 13 is provided on a back face side of the cavity face 12, and a fitting tool 15 for a mobile side die for fitting the mobile side die 11 to a die device seat 14 so as to surround the space part 13. An extrusion member 16 for separating the forming body from the cavity face 12 is fitted to a hydraulic cylinder 18 with a fitting tool for an extrusion member. A pipe 19b having a plurality of jetting nozzles 19a is inserted inside the space part 13 at the opposed position against a back face side 11a of the cavity face 12 from the fitting tool 15 and connected to a pump 21 for feeding a cooling liquid through a valve 20.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：为了提供一种能够提高模具的冷却效果的模具，即使模具达到高温。解决方案：在模具装置中，沿着成形体的形状在移动侧模具11中形成空腔面12，在空腔面12的背面侧设置有空间部13，以及用于用于将移动侧模具11装配到模具装置座14以便围绕空间部分13的移动侧模具。用于将成形体与腔体表面12分离的挤出构件16被装配到具有配件的液压缸18 用于挤压构件的工具。具有多个喷射喷嘴19a的管19b在相对位置处插入到空腔部13的相对位置处，从配合工具15抵靠空腔面12的背面侧11a，并连接到泵21，供给冷却液通过阀门20。

23. 发明专利

JP2002033445A SEMICONDUCTOR DEVICE INCLUDING POWER ELEMENTS 失效
公开(公告)号：JP2002033445A
公开(公告)日：2002-01-31
申请号：JP2000214275
申请日：2000-07-14
申请人： MITSUBISHI ELECTRIC CORP
发明人： FUJINO JUNJI , HAYASHI KENICHI , MURAKAMI KOHEI , KASHIBA YOSHIHIRO , MURAKAMI EISHIN
IPC分类号： H01L25/07 , H01L25/18
摘要： PROBLEM TO BE SOLVED: To reduce the time and the cost required for production per semiconductor device to provide a semiconductor device having high productivity. SOLUTION: The semiconductor device is formed of two or more power elements disposed on a main frame. At least active surfaces of the power elements are mutually connected through a metal connecting frame. The power elements are connected to the frame using a conductive resin.

24. 发明专利

JP2001153886A PROBE CARD, AND TESTER PROVIDED WITH SAME 失效
公开(公告)号：JP2001153886A
公开(公告)日：2001-06-08
申请号：JP33668299
申请日：1999-11-26
申请人： MITSUBISHI ELECTRIC CORP
发明人： TAKEMOTO MEGUMI , MAEKAWA SHIGEKI , KASHIBA YOSHIHIRO , WATANABE YUETSU
IPC分类号： G01R31/26 , G01R1/067 , G01R1/073 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To restrain deposit of a fused material onto probe needles, and to make restorable the increase of contact resistance caused by oxidation of the deposited fused material. SOLUTION: The plural probe needles are provided to contact with one electrode pad of a probe card, the plural probe needles are connected in parallel to be brought into the same potential so as to make a current flowing in the probe needles half or less, and heating by Joule heat is reduced thereby to prevent fusion of aluminium which is a constitutive material for the electrode pad.

25. 发明专利

JPH11201377A VACUUM HEAT INSULATING PANEL 失效
公开(公告)号：JPH11201377A
公开(公告)日：1999-07-30
申请号：JP431398
申请日：1998-01-12
申请人： MITSUBISHI ELECTRIC CORP
发明人： NAKADEGUCHI SHINJI , HISAMORI YOICHI , KASHIBA YOSHIHIRO , FUJISHIRO AKIHIRO , NISHIMOTO YOSHIO
IPC分类号： F16L59/06 , F25D23/06
摘要： PROBLEM TO BE SOLVED: To provide a vacuum heat insulating panel with high stable heat insulating performance. SOLUTION: An inside film 3 is provided with a first thermally fused layer 6 forming the surface on a core material 2 side and a second thermally fused layer 7 forming the surface on an outside film 4 side. The outside film 4 is provided with a third thermally fused layer 9 forming the surface on the inside film 3 side. The second thermally fused layer 7 of the inside film 3 and the third thermally fused layer 9 of the outside film 4 positioned on the same side of the core material 2 are fused together.

26. 发明专利

JPH1032218A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH1032218A
公开(公告)日：1998-02-03
申请号：JP18618296
申请日：1996-07-16
申请人： MITSUBISHI ELECTRIC CORP
发明人： NAKAJIMA YASUSHI , KASHIBA YOSHIHIRO
IPC分类号： H01L23/36 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device in which the life of a junction part until peel-off break is prolonged and which has high reliability, by joining a peripheral portion of a surface electrode of a semiconductor element with an external electrode through a wire. SOLUTION: A semiconductor device has a semiconductor element 1 having an electrode 6 formed on the surface thereof, an external electrode 5 provided on the outside of the semiconductor element 1, and a plurality of wires 7 for joining the surface electrode 6 with the external electrode 5. Each of the wires 7 joins the peripheral portion of the surface electrode 6 with the external electrode 5. For example, the semiconductor element 1 is fixed on an insulating radiation board 2, and the insulating radiation board 2 is fixed on a heat sink 8. Each of the wires 7 continuously joins two positions on the peripheral portion of the surface electrode 6 on the semiconductor element 1 and the external electrode 5 on the insulating radiation board 2. Thus, since the junction parts of the wires 7 may avoid a high-temperature region of the semiconductor element 1 so as to enable reduction in thermal stress, the life of the junction parts may be prolonged.

27. 发明专利

JPH09105592A PLATE LAMINATED HEAT EXCHANGER AND PRODUCTION FOR THE SAME 失效
公开(公告)号：JPH09105592A
公开(公告)日：1997-04-22
申请号：JP25875195
申请日：1995-10-05
申请人： MITSUBISHI ELECTRIC CORP
发明人： NAKADEGUCHI SHINJI , KASHIBA YOSHIHIRO , HISAMORI YOICHI , MATSUKI MASATOSHI
IPC分类号： F28F3/08 , B23K1/00 , F28D9/02
摘要： PROBLEM TO BE SOLVED: To prevent the passages of heat exchanging plates from being closed by excessive brazing materials when the heat exchanging plates 8, intermediate plates and end plates are laminated and brazed. SOLUTION: At least one face of adjacent heat exchanging plates 8. intermediate plates 9 and end plates 10 is plated with a nickel brazing material including phosphor. While the respective plates 8 to 10 are laminated, the temperature of a furnace is raised so that the reaction layers of copper and nickel of the respective plates 8 to 10 are formed and the plates 8 to 10 are bonded together. Thus, since molten layers during brazing can be made thin and uniformly formed during brazing, the brazing material can be prevented from closing passages 8a during brazing.

28. 发明专利

JPH098223A SEMICONDUCTOR POWER MODULE AND ITS MANUFACTURE 失效
公开(公告)号：JPH098223A
公开(公告)日：1997-01-10
申请号：JP15053595
申请日：1995-06-16
申请人： MITSUBISHI ELECTRIC CORP
发明人： YAMAGUCHI TETSUJI , YAMAMOTO YASUHIRO , KAWATO HISASHI , KASHIBA YOSHIHIRO , NAKADEGUCHI SHINJI , FUJIWARA MICHIO
IPC分类号： H01L25/07 , H01L25/18
摘要： PURPOSE: To make the manufacture of a semiconductor power module easier without deteriorating the heat radiating efficiency of its main circuit so that the manufacturing cost can be reduced by fixing each of a plurality of terminals which inputs and outputs a main current or electric signals to a frame body by burying part of the terminals in the frame body. CONSTITUTION: Terminals 14a and 14b are formed in plate-like states bent in L-shapes and their upright sections are buried in the side wall section of a frame body 102 except head parts which are protruded from the upper end face of the side wall section of the frame body 102. The other horizontal sections are buried in the bottom face section of the frame body 102 so that their upper surfaces can be exposed and can be flush with the upper surface of the bottom face section of the frame body 102 and a control circuit board 101 is fixed to the upper surface of the bottom face section of the frame body 102 with adhesive 7. In addition, the terminal 14b is electrically connected to a prescribed part of wiring formed on the upper surface of the board 101 through a bonding wire. Therefore, the manufacturing process of a semiconductor power module can be made easier and, at the same time, the manufacturing cost of the module can be reduced.

29. 发明专利

JPH0677368A SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH0677368A
公开(公告)日：1994-03-18
申请号：JP22842392
申请日：1992-08-27
申请人： MITSUBISHI ELECTRIC CORP
发明人： KASHIBA YOSHIHIRO
IPC分类号： H01L23/373 , H01L23/473
摘要： PURPOSE:To obtain a low-cost device capable of efficiently relieving a heat generation of a semiconductor in a simple structure concerning a semiconductor device for mounting the semiconductor with a large heat generation such as a large power semiconductor device. CONSTITUTION:Circuit conductors 2A, 2B and 2C for mounting a semiconductor device 3 are stacked on one side of a ceramic insulator 1 and are joined. Also, rear members 2a and 2b are stacked on the other opposed side of the ceramic insulator 1 and are joined. At least either the circuit conductors or the rear members are formed of a stacked structure having water channels 20 capable of passing a liquid through the inside. The stacked structure is formed of an alloy constrained member consisting mainly of copper member and molybdenum or tungsten.

30. 发明专利

JPH0527516B2 失效
公开(公告)号：JPH0527516B2
公开(公告)日：1993-04-21
申请号：JP12574387
申请日：1987-05-25
申请人： MITSUBISHI ELECTRIC CORP
发明人： MACHIDA KAZUMICHI , KASHIBA YOSHIHIRO , IDETA GORO
IPC分类号： B23K11/14

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