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1. 发明专利

JPH0367475B2 失效
公开(公告)号：JPH0367475B2
公开(公告)日：1991-10-23
申请号：JP14988485
申请日：1985-07-10
申请人： MITSUBISHI ELECTRIC CORP
发明人： KASHIBA YOSHIHIRO , MACHIDA KAZUMICHI
IPC分类号： B23K11/26

2. 发明专利

JPH0215973B2 失效
公开(公告)号：JPH0215973B2
公开(公告)日：1990-04-13
申请号：JP2115881
申请日：1981-02-13
申请人： MITSUBISHI ELECTRIC CORP
发明人： MACHIDA KAZUMICHI , SAITO TAKASHI
IPC分类号： H01H11/06 , B23K11/00

3. 发明专利

JPH01102993A PACKAGING OF ELECTRONIC PARTS BY REFLOW SOLDERING 失效
公开(公告)号：JPH01102993A
公开(公告)日：1989-04-20
申请号：JP26254987
申请日：1987-10-15
申请人： MITSUBISHI ELECTRIC CORP
发明人： NAKAOKA YASUYUKI , HIROTA SANEYASU , MACHIDA KAZUMICHI , TAMURA KEIICHI
IPC分类号： H05K3/34
摘要： PURPOSE:To control formation of bridge by printing cream solder in a land section at a position corresponding to the root direction rather than to connection edge of a lead terminal and by making the land section before a lead terminal connection substantially free from cream solder. CONSTITUTION:A cream solder 3 is dislocatedly printed so that it does not exist substantially before the edge of a connection 6 of a lead terminal 5. If an electronic part 4 is mounted on a substrate 1 having thus printed cream solder then heated by steam, the cream solder 3 melts. The cream solder 3 flows in front of the land section to complete meniscus and the flow from the edge of the connection 6 to the root is controlled. Formation of defective bridge is prevented in this way.

4. 发明专利

JPS6335099B2 失效
公开(公告)号：JPS6335099B2
公开(公告)日：1988-07-13
申请号：JP1709481
申请日：1981-02-06
申请人： MITSUBISHI ELECTRIC CORP
发明人： MACHIDA KAZUMICHI
IPC分类号： H05K3/34 , B23K1/002 , B23K1/005 , H01L21/60

5. 发明专利

JPS6321592B2 失效
公开(公告)号：JPS6321592B2
公开(公告)日：1988-05-07
申请号：JP18727981
申请日：1981-11-19
申请人： MITSUBISHI ELECTRIC CORP
发明人： MACHIDA KAZUMICHI , SAITO TAKASHI
IPC分类号： B23K11/24

6. 发明专利

JPS6352109A PARTS FOR OPTICAL COMMUNICATION AND ITS MANUFACTURE 失效
公开(公告)号：JPS6352109A
公开(公告)日：1988-03-05
申请号：JP19668086
申请日：1986-08-22
申请人： MITSUBISHI ELECTRIC CORP
发明人： KASHIBA YOSHIHIRO , SAITO TAKASHI , MACHIDA KAZUMICHI
IPC分类号： G02B6/42
摘要： PURPOSE:To easily obtain parts for optical communication having excellent transfer characteristics, by providing a base section which supports an optical fiber under a fixed condition, supporting table having an adjusting section, and supporting member which supports the adjusting section under a fixed condition. CONSTITUTION:Solder 3 is melted on a soldering base section 5b and the positions of an optical fiber 1 and luminous element 2 are adjusted by means of a tweezers-like jig fitted to an XY-table, etc. Then the position adjusting jig is removed after the solder 3 solidifies. Thereafter, moving adjustment is performed by holding the adjusting section 5c of a supporting table 5, but the soldering base section 5b is moved by using a coupled section 5d which is weakened in strength as a fulcrum since the supporting table 5 is fixed to a base by means of a fixed section 5a. The distance from the light receiving end of the optical fiber 1 to the fulcrum is short when it is compared with the distance from the adjusting section 5c of the supporting table 5 to the fulcrum and the movement of the adjusting section 5c appears on the light receiving axis of the optical fiber 1 after contraction.

7. 发明专利

JPS62256447A CAPILLARY CHIP FOR WIRE BONDING 失效
公开(公告)号：JPS62256447A
公开(公告)日：1987-11-09
申请号：JP10060686
申请日：1986-04-28
申请人： MITSUBISHI ELECTRIC CORP
发明人： SUGIMURA TOSHIHARU , HIROTA SANEYASU , MACHIDA KAZUMICHI
IPC分类号： H01L21/60
摘要： PURPOSE:To provide wire bonding in a good junction state even if the distance between adjacent electrodes is small by a method wherein the title chip is provided with a ball bonding part and a stitch bonding part with the stitch bonding surface thereof partly notched. CONSTITUTION:When an electrode 3 of a miniaturized semiconductor chip 2 and a bonding area of copper alloy lead 4 are connected by a copper wire 1 with thermal pressure fixing process jointly using ultrasonic, the direction of copper wire 1 interconnecting the electrode 3 on semiconductor chip to the lead 4 is limited to the ranged of A to A and B to B. Therefore, the title chip can be contracted into the shape comprising a ball bonding part ball bonding one end of copper wire 1 onto the electrode 3 and stitch bonding part encircling the ball bonding part and stitch bonding the copper wire 1 only in the interconnecting direction within the specified ranges on the lead 4. Through these procedures, the distance between adjacent electrodes ball-bonded in conformity to the shape of end pressurized part of contracted capillary chip 5 can be shortened.

8. 发明专利

JPS62174930A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS62174930A
公开(公告)日：1987-07-31
申请号：JP1734986
申请日：1986-01-28
申请人： MITSUBISHI ELECTRIC CORP
发明人： HIROTA SANEYASU , MACHIDA KAZUMICHI
IPC分类号： H01L21/607 , H01L21/60
摘要： PURPOSE:To obtain the semiconductor derive in which a metal wire and an electrode can be bonded in an excellent manner without inflicting damage on the electrode and a semiconductor chip by a method wherein a thin film, the quality of which is controlled in such a manner that the depth of concavity will be formed in the prescribed limits when the prescribed pressure is applied to the pure copper ball of the prescribed diameter, is used as the electrole provided on the semiconductor chip. CONSTITUTION:The quality of the electrode 13 on a semiconductor chip 2 is controlled under various conditions, and using a capillary 5, a pure copper ball 14 of 70-75mum in diameter is pressed to said electrode 13 under the following conditions: at the temperature of 350 deg.C, at the load of 150gf, at the frequency of supersonic oscillation of 60KHz, and at the half amplitude of 0.07-0.14mum. The amount of deformation, the depth of a concavity in other words, of the electrode 13 is measured, the film quality for bondability is evaluated based on the judgement indicating whether the depth is in the range of 0.1-0.6mum, and the condition of quality control is established. The quality of the electrode 13 on the semiconductor chip 2 is controlled under the established condition of quality control, the ball 10a of a copper wire 10 is bonded to the electrode 13 on the semiconductor chip 2 using a capillary chip 5 and supersonic oscillation, and at the same time, the other end of the copper wire 10 is stitch-bonded to a lead 4.

9. 发明专利

JPS62150729A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS62150729A
公开(公告)日：1987-07-04
申请号：JP29108285
申请日：1985-12-24
申请人： MITSUBISHI ELECTRIC CORP
发明人： HIROTA SANEYASU , MACHIDA KAZUMICHI , SHIMOTOMAI MASAAKI , OMAE SEIZO
IPC分类号： H01L21/60
摘要： PURPOSE:To obtain a semiconductor device in which a metal wire and an electrode can be satisfactorily contacted with each other without damaging the electrode and the semiconductor chip by tempering the electrode on the semiconductor chip with a predetermined condition. CONSTITUTION:An electrode 13 on a semiconductor chip 2 is composed of a thin film which is so tempered as to have a deformation, i.e. the depth D of a recessed part within the range of 0.1-0.6mum when pressed by a pure copper ball 14 with the diameter of 70-75mum with a pressure of 200-300gf. As the thin film tempered under such tempering condition is employed, the electrode 13 and the semiconductor chip 2 are not damaged and the electrode and a metal wire can be contacted satisfactorily with each other so that an economical metal wire can be used in place of a gold wire.

10. 发明专利

JPS62136842A MANUFACTURE OF SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS62136842A
公开(公告)日：1987-06-19
申请号：JP27865385
申请日：1985-12-10
申请人： MITSUBISHI ELECTRIC CORP
发明人： MACHIDA KAZUMICHI , HIROTA SANEYASU , SHIBUYA YOKO , SHIMOTOMAI MASAAKI
IPC分类号： H01L21/60
摘要： PURPOSE:To improve the joining properties of both a wire and a surface to be joined of an electrode, and to apply a base-metal wire such as copper as the wire by irradiating at least one of the wire or the surface to be joined of the electrode by excitation beams before a wire bonding process of during said process. CONSTITUTION:An aluminum electrode 3 is formed onto a semiconductor chip 2. A surface to be joined as the surface of the aluminum electrode 3 is irradiated by laser beams 12, thus activating the surface. High voltage is applied between a copper wire 10 and a discharge electrode in wire bonding. Consequently, discharge is generated between the tip section of the wire 10 and the discharge electrode and an arc is shaped, the tip section of the wire 10 is given heat and said tip section is melted, and the volume of the melting section is increased gradually while a globular shape is kept. The tip section of the wire and the discharge electrode are joined through the same method as conventional methods.

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