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21. 发明专利

JP2003127062A DRESSING METHOD AND DRESSING DEVICE FOR DIAMOND WHEEL 审中-公开
公开(公告)号：JP2003127062A
公开(公告)日：2003-05-08
申请号：JP2001327333
申请日：2001-10-25
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： YOKOYAMA NOBUYUKI , IZUNO CHIZUO
IPC分类号： B24B53/00 , B24B53/013
摘要： PROBLEM TO BE SOLVED: To solve the problem in the conventional dressing method of a diamond wheel using fixed particles that diamond grains are worm and dulled simultaneously with dressing. SOLUTION: The dressing method and the dressing device for the diamond wheel are to remove binders from the diamond wheel by immersing the diamond wheel turning at a peripheral velocity of 3400-5400 m/min in a mixed liquid of an abrasive and a grinding liquid or by spraying the mixed liquid onto the diamond wheel turning at a high-speed to make the abrasive hit against the face to be dressed of the diamond wheel at a high-speed. A good dressing shape can be formed under the different binder removal conditions at the front and back in the turning direction due to different hitting powers to the faces to be dressed at the front and back in the turning direction.

22. 发明专利

JP2000317822A POLISHING DEVICE AND POLISHING METHOD 失效
公开(公告)号：JP2000317822A
公开(公告)日：2000-11-21
申请号：JP12319999
申请日：1999-04-28
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： HIRATANI TATSUO , IZUNO CHIZUO
IPC分类号： B24B37/10 , B24B37/04
摘要： PROBLEM TO BE SOLVED: To prevent a work from being scratched by sticking the polishing surface plate and the processing surface of the work when it is taken out after polishing by a method to process the work by grinding the polishing surface plate and the work. SOLUTION: This is a method to polish the surface of a work 12 by grinding with a polishing surface plate 5 supplying polishing agent. In this method, the work 12 is polished by the polishing surface plate 5. After the polishing, a polishing surface plate stopping mechanism stops the polishing surface plate 5 at prescribed position. A shaft transfer mechanism 17 moves a shaft 14 attached on the polishing surface plate 5 to protrude on the processed surface 51 of the polishing surface plate 5 and to separate the work 12 from the processed surface 51.

23. 发明专利

JP2000317810A FLUID POLISHING APPARATUS 失效
公开(公告)号：JP2000317810A
公开(公告)日：2000-11-21
申请号：JP12319899
申请日：1999-04-28
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： IZUNO CHIZUO , SHIRAFUJI YOSHINORI , HIRATANI TATSUO
IPC分类号： B24B37/00
摘要： PROBLEM TO BE SOLVED: To manufacture a small-diameter and small-curvature lens and a lens forming metal mold surface with high accuracy and at a high grade by controlling a flow of slurry jetted from a pore provided in the tip of a polishing tool to a fixed flow and moving the polishing tool near by the surface of an object to be polished at a fixed stay time. SOLUTION: At the time of jetting slurry 4 obtained by previously mxing water 8 and fine abrasive grains 7 at a fixed ratio forcibly from a pore 3 to be strongly applied to the surface 5 to be polished, the fine abrasive grains 7 cause the polishing action to the surface of the surface 5 to be polished. An object 1 to be polished and a polishing tool are controlled to be relatively rotated or reciprocated so that the stay time of the polishing tool is controlled to make a pore 3 stay uniformly to the surface 5 to be polished. The liquid feed pressure and the flow of the slurry 4 are controlled so that the polishing tool is a little floated from the surface 5 to be polished to attain satisfactory polishing action of the fine abrasin grains 7. At this time, it is necessary to prevent such a movement locus control that a specified part of the pore 3 polihses a specified part of the surface 5 to be polished.

24. 发明专利

JP2000151321A MANUFACTURE OF PIEZOELECTRIC DEVICE 失效
公开(公告)号：JP2000151321A
公开(公告)日：2000-05-30
申请号：JP32714298
申请日：1998-11-17
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： HIRATANI TATSUO , IZUNO CHIZUO , SUGIMOTO MASAHITO
IPC分类号： H01L41/22 , H01L41/313 , H03H3/02 , H03H9/02 , H03H9/17
摘要： PROBLEM TO BE SOLVED: To highly precisely thin a piezoelectric body and to facilitate handling by jointing a piezoelectric body member to a substrate member and working a flat part facing the junction face of the jointed piezoelectric member. SOLUTION: An adhesive is applied on the surface of a substrate member 3, the substrate member 3 is rotated at high speed, and a uniform adhesion layer is formed. A piezoelectric body 2 is overlapped on the adhesion layer so as to joint them. A face opposite to a junction face, to which the piezoelectric body 2 of the substrate member 3 is jointed, is held to a vacuum chuck plate and the piezoelectric body 2 is thinned to prescribed thickness by a single-face polishing method. A working surface 10 side of the piezoelectric body 2 is held, and plural opening parts 11 are formed in the substrate member 3. Exciting electrodes are formed in the center position of the opening part 11 on the working surface 10 side of the thinned piezoelectric body 2 and the center position of the opening part 11 on the surface of the piezoelectric body 2 exposed to the opening part 11. A member is divided after the exciting electrode is formed, and a separate piezoelectric oscillator is obtained.

25. 发明专利

JPH11291161A POLISHING METHOD 失效
公开(公告)号：JPH11291161A
公开(公告)日：1999-10-26
申请号：JP9564498
申请日：1998-04-08
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： HIRATANI TATSUO , IZUNO CHIZUO
IPC分类号： B24B37/04 , B24B37/07 , B24B37/30 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To miniaturize a cleaning device, and to reduce a quantity of cleaning liquid by polishing a workpiece by installing a holding jig of the workpiece on a plate plane. SOLUTION: A workpiece 12 is adhered/fixed to a holding jig 13 far smaller than a plate 11. In this case, a foreign matter sticking to the holding jig 13 and the workpiece 12 is removed by ultrasonic cleaning by a small quantity of cleaning liquid. Next, the holding jig 13 to which the workpiece 12 is adhered/ fixed is installed on the plate 11. This plate 1, the holding jig 13 and the workpiece 12 adhered/fixed to the holding jig 13 are arranged in a polishing device in an integrated state, and polishing work is performed on the surface of the workpiece 12 while slidingly joining them to each other by rotating a polishing surface plate 5 and the plate 11 while supplying an abrasive 10. Rough polishing and finishing polishing are performed as the polishing. Finishing polishing is performed unit the whole surface of a stopper 26 arranged on the plate 11 contacts with the polishing surface plate so that a fluctuation in flatness/ parallelism and a thickness of the workpiece 12 is set not more than about 1 μm.

26. 发明专利

JPH09233391A BUMP, BUMP FORMING METHOD AND INFRARED RAY SENSOR 失效
公开(公告)号：JPH09233391A
公开(公告)日：1997-09-05
申请号：JP3942996
申请日：1996-02-27
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： HAYASHI YOSHITAKE , IZUNO CHIZUO
IPC分类号： G01J1/02 , H04N5/30 , H04N5/33
摘要： PROBLEM TO BE SOLVED: To manufacture an infrared ray sensor with a small heat loss and to improve the sensitivity and the response characteristic by heading, pressing and bonding an infrared ray sensing element and a signal processing device element. SOLUTION: A film of a thin film pyroelectric element 11 is formed on an MgO single crystal substrate 12 through sputtering and then pattern- processed. Then a film of an electrode 10 is formed on the pyroelectric element 11, and a gold indium lamination bump 3 is formed. Then only upper part of the electrode is left on the pyroelectric element 11 by photolithography processing. Succeedingly, a polyimide film is coated to form a support film. After the infrared ray sensing element and a signal processing device element MPX9 configtured as above are aligned, then heated, pressed and bonded. After mount of a hybrid, the MgO single crystal substrate 12 being a component of the infrared ray sensing element is etched from the rear side, the substrate under the pyroelectric element 11 is removed and a film of an NiCr light receiving electrode 13 is formed. Thus, the hybrid junction type infrared ray sensor with a small heat loss is obtained and the sensitivity and the response characteristic are improved.

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