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21. 发明专利

JPS60195958A Lead frame 失效
标题翻译：领导框架
公开(公告)号：JPS60195958A
公开(公告)日：1985-10-04
申请号：JP5094284
申请日：1984-03-19
申请人： Hitachi Ltd
发明人： SUGANO TOSHIO , KOIKE SHIYUNJI , KOMARU TAKESHI
IPC分类号： H01L23/50 , H01L23/495
CPC分类号： H01L23/49541 , H01L2924/0002 , H01L2924/00
摘要： PURPOSE:To enhance the reliability and dimensional stability by forming the tab hanging lead connector of a frame in a recess shape of the prescribed width, thereby obtaining a range necessary to cut the tab hanging lead after molding. CONSTITUTION:A portion necessary to insert a tab hanging lead cutting jig is obtained in advance as a recess shape 7 formed on a frame 1, thereby cutting sufficiently the lead 2 even if the frame 1 except the portion required for inserting the jig is increased in width. Therefore, even if a semiconductor device made of a package of the size near the frame 1 as shown by two-dotted chain line is manufactured, the leads 2 are effectively cut after molding, and the cavity formed in a mold is the same as the package 8. Thus, a distance from the end of the frame can be very shortened. Accordingly, a resin flash occurred therebetween can be reduced extremely.
摘要翻译：目的：通过将框架的突片悬挂引线连接器形成为规定宽度的凹部形状来提高可靠性和尺寸稳定性，从而获得在成型后切割突片悬挂线所需的范围。构成：作为形成在框架1上的凹部7，预先获得插入突片悬挂引线切割夹具所需的部分，从而即使除了插入夹具所需的部分之外的框架1增加，也能充分切断引线2 宽度。因此，即使制造由双点划线所示的靠近框架1的封装的半导体器件，在成型后有效地切割引线2，并且形成在模具中的空腔与因此，距离框架的端部的距离可以非常缩短。因此，可以极大地降低其间的树脂闪光。

22. 发明专利

JPS53102670A LEAD BENDING METHOD FOR GLASS CERAMIC PACKAGE TYPE SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS53102670A
公开(公告)日：1978-09-07
申请号：JP1711177
申请日：1977-02-21
申请人： HITACHI LTD
发明人： TAKASHIMA KAZUHISA , SUGANO TOSHIO , TANIMOTO MICHIO , FUJIOKA SHIYUNICHIROU , UEMATSU SHIYUNEI
IPC分类号： H05K13/04 , H01L21/60 , H01L23/50
摘要： PURPOSE:To prevent the production of crack in glass layer, by supporting the package at the lower surface and by depressing down the external part from the part bent due to the stress concentration for lead.

23. 发明专利

JP2013190111A Ventilation system, ventilation method and control device 有权
标题翻译：通风系统，通风方法和控制装置
公开(公告)号：JP2013190111A
公开(公告)日：2013-09-26
申请号：JP2012054515
申请日：2012-03-12
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： JOKO MASAYOSHI , SUGANO TOSHIO , YAMAMOTO TAKASHI , NIIZA YOSHIKAZU
IPC分类号： F24F7/007 , E21F1/00
摘要： PROBLEM TO BE SOLVED: To provide a ventilation system with high safety, a ventilation method and a control device.SOLUTION: A ventilation system includes: an inverter circuit 51c that has switching elements S1 to S6 and modulates a DC voltage to output an AC voltage; a motor 71b that is driven by an AC voltage supplied through the inverter circuit 51c; a jet fan with freely rotatable impellers that are rotated normally or reversely along with the drive of the motor 71b and are also rotatable freely by inertia or air flow while the motor 71b stops; and a control device 510 that outputs a control signal to the switching elements S1 to S6 to control the drive of the motor 71b. When starting the motor 71b from a stop state, the control device 510 starts the motor 71b after stopping the rotation of the impellers by performing DC braking of the motor 71b using an AC voltage for a preset first time.
摘要翻译：要解决的问题：提供具有高安全性的通风系统，通风方法和控制装置。解决方案：通风系统包括：具有开关元件S1至S6的逆变器电路51c，并调制DC电压以输出AC电压 ; 由通过逆变器电路51c提供的AC电压驱动的电动机71b; 具有可自由旋转的叶轮的喷射风扇，其随着电动机71b的驱动而正常或反向旋转，并且在电动机71b停止时也通过惯性或空气流自由旋转; 以及控制装置510，其向开关元件S1〜S6输出控制信号，以控制电动机71b的驱动。当从停止状态起动电动机71b时，控制装置510通过使用预先第一次的AC电压进行电动机71b的直流制动而停止叶轮的旋转来起动电动机71b。

24. 发明专利

JPH09120982A TAPE CARRIER 失效
公开(公告)号：JPH09120982A
公开(公告)日：1997-05-06
申请号：JP23165996
申请日：1996-09-02
申请人： HITACHI LTD , HITACHI TOBU SEMICONDUCTOR LTD
发明人： SUGANO TOSHIO , NAGAOKA KOJI , TSUKUI SEIICHIRO , WAKASHIMA YOSHIAKI , TANIMOTO MICHIO
IPC分类号： H01L21/60 , H01L21/603 , H01L23/12
摘要： PROBLEM TO BE SOLVED: To make it easy to handle a semiconductor chip in mounting and increase a mounting reliability of the semiconductor chip by forming the semiconductor chip to be inner-bonded to a device hole in such a thickness that it may not project beyond an extension line of a face of an insulator which is opposite to the one where a plurality of leads are formed. SOLUTION: One face of a semiconductor chip 5, 5' is sealed with resin and outer leads 4' are led out from a resin sealed section 8. Lest the outer leads 4' should be extended from an edge of a tape 1, an insulator 6 is installed around a device hole 3 at a rear face of the tape 1. The semiconductor chip 5, 5' which is to be inner-bonded in the device hole 3 is formed in such a thickness that it may not project beyond an extension line of a face of the insulator 6 which is opposite to the one where a plurality of leads 4 of the insulator are formed. By this method, the semiconductor chip is easy to handle in mounting and a mounting reliability of the semiconductor chip can be increased.

25. 发明专利

JPH08213541A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH08213541A
公开(公告)日：1996-08-20
申请号：JP29411695
申请日：1995-11-13
申请人： HITACHI LTD , HITACHI DEVICE ENG , HITACHI TOBU SEMICONDUCTOR LTD , AKITA DENSHI KK
发明人： WATANABE MASAYUKI , SUGANO TOSHIO , TSUKUI SEIICHIRO , ONO TAKASHI , WAKASHIMA YOSHIAKI
IPC分类号： H01L21/60 , H01L25/065 , H01L25/07 , H01L25/10 , H01L25/11 , H01L25/18 , H05K1/18 , H05K3/34 , H01L23/522 , H01L25/00
摘要： PURPOSE: To enhance semiconductor chips provided on a module board in mounting density by a method wherein bump electrodes of different functions are provided so as not to confront each other, and the semiconductor chips connected to different leads are formed into groups. CONSTITUTION: Eight semiconductor chips 4A and 4B and eight semiconductor chips 4C and 4D are mounted on the front and rear of a module board 1 respectively. The semiconductor chips 4A to 4D are made to form an SRAM, and the surfaces of the semiconductor chips where semiconductor elements or wirings are provided are molded with silicone rubber or resin 7. Bump electrodes 6 of solder, Au or the like are provided on the semiconductor chips 4A to 4D respectively, and leads 5A to 5D are connected to the bump electrodes 6 through a TAB method. The semiconductor chip 4A is stacked on the semiconductor chip 4B, the leads 5A and 5B of them of the same function are connected together with solder. On the rear side of the module board 1, the semiconductor chips 4C and 4D and leads 5C and 5D are disposed the same as above. A semiconductor chip of different function from the other semiconductor chips is a decoder 3, and one selected out of eight semiconductor chips is made to serve as a decoder on both the front and rear of a module board.

26. 发明专利

JPH0395800A MEMORY MODULE 失效
公开(公告)号：JPH0395800A
公开(公告)日：1991-04-22
申请号：JP23112889
申请日：1989-09-06
申请人： HITACHI LTD
发明人： SAITO KAZUO , SUGANO TOSHIO , SAKAI OSAMU
IPC分类号： G11C29/00 , G11C11/401 , G11C29/04
摘要： PURPOSE:To enable operation convenience of a memory module same as a memory module using a satisfactory memory by providing a control circuit to switch and select access operation to a defective memory cell according to the level of a signal to be supplied from the external address input terminal of an address bit for nonselection of defective memory cell. CONSTITUTION:A control circuit 2 to include the two defective memory cells, for which the level of a specified address bit is limited so as not to select one part of defective memory cells M1-M16, at least and to execute the switch and selection of the access operation to the defective memory cells M1-M16 according to the level of the address bit to be supplied from external address input terminals A0-A10 for specified address bit is provided. Accordingly, it is possible to exclusive limit for forcedly setting the specified external address input terminals A0-A10 on a substrate 1 to a prescribed logical level corresponding to a defective position or controlling such level forcing timing from an external part. Thus, the operation convenience of the memory module can be obtained same as the memory module using the satisfactory memory.

27. 发明专利

JPS6147657A Lead frame 失效
标题翻译：领导框架
公开(公告)号：JPS6147657A
公开(公告)日：1986-03-08
申请号：JP16781884
申请日：1984-08-13
申请人： Hitachi Ltd
发明人： SUGANO TOSHIO , KOIKE SHUNJI , KOMARU TAKESHI
IPC分类号： H01L23/50 , H01L23/495
CPC分类号： H01L23/49541 , H01L2924/0002 , H01L2924/00
摘要： PURPOSE:To improve reliability of semiconductor device by attaching a pellet where bonding pads are arranged almost continuously along opposed two sides of tab. CONSTITUTION:Regarding the second lead 7b which is the second lead counted in the right or left from the centers respective of opposed two sides 3a, 3b of tab 3 or successive leads among the leads 7 corresponding to the external lead 4 extended near the side 3a among two opposed sides of tab 3, the internal end portion is extended up to the position exceeding the left side end 3c and the internal end portion is arranged almost along the left wide end 3c. Thereby, in the case that a pellet 9 where the bonding pads 8 are arranged almost continuously is attached to the tab 3 of lead frame along opposed two sides in the vertical direction for opposed two sides 3a, 3b of tab 3, the internal end portions of leads 7a, 7b, 7c and bonding pads 8a, 8b, 8c can be wire-bonded in the very closed condition.
摘要翻译：目的：通过连接贴片几乎连续地布置在接片的两侧的连接片，提高半导体器件的可靠性。构成：关于第二引线7b，其是从对应于相对的两个侧面3a，3b的中心的右侧或从左侧计算的第二引线，或者对应于在侧面3a附近延伸的外部引线4的引线7中的连续引线在突片3的两个相对的两侧中，内端部延伸到超过左侧端部3c的位置，并且内端部几乎沿左宽端部3c布置。因此，在接头焊盘8几乎连续地配置的小丸9的情况下，在凸片3的相对的两侧3a，3b的上下方向上相对的两侧安装引线框架的突片3，内端部引线7a，7b，7c和接合焊盘8a，8b，8c可以在非常闭合的状态下被引线接合。

28. 发明专利

JPH0280819A GEAR COUPLING DEVICE 失效
公开(公告)号：JPH0280819A
公开(公告)日：1990-03-20
申请号：JP22974588
申请日：1988-09-16
申请人： HITACHI LTD
发明人： SUGANO TOSHIO
IPC分类号： F16D3/18 , F16N17/02
摘要： PURPOSE:To improve the reliability of a machine device as a whole by filling an initial-stage closed space zone with a lubricating oil and providing a space zone for allowing increased pressure caused by the reduction in the volume of the initial-stage closed space zone to escape. CONSTITUTION:External gears are provided on hubs 3 each fitted on a driving shaft 1 and a driven shaft 2 while providing an internal gear close to both ends of the sleeves 4 of hub outer cylinders, and flexibility is given to the engagement between the teeth of both. The closed volume of the initial-stage closed space zone in a coupling is filled with a specific quantity of lubricating oil by removing an oil feeding plug 8. An oil sump chamber 10 functions as a second space zone for allowing raised pressure caused by reduced volume to escape at the time of the reduction in volume of the initial-stage closed space zone accompanying the thermal expansion of the gear coupling. Thereby, even if an operator overfills the lubricating oil by mistake, no failure of a machine device itself will take place, improving reliability.

29. 发明专利

JPS6379398A MULTILAYER INTERCONNECTION BOARD 失效
公开(公告)号：JPS6379398A
公开(公告)日：1988-04-09
申请号：JP22360186
申请日：1986-09-24
申请人： HITACHI LTD , HITACHI TOBU SEMICONDUCTOR LTD
发明人： SUGANO TOSHIO , NIIOKA HISAMI
IPC分类号： H05K3/46

30. 发明专利

JPS60200559A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS60200559A
公开(公告)日：1985-10-11
申请号：JP5611284
申请日：1984-03-26
申请人： HITACHI LTD , HITACHI MICROCUMPUTER ENG , HITACHI IRUMA DENSHI KK
发明人： SUGANO TOSHIO , OOKUBO CHIKAO , TSUKUI SEIICHIROU , YAMAURA SHIYUUICHI , FUJII YASUHIKO , TADA MASAHIRO
IPC分类号： H01L23/50 , H01L25/10 , H01L25/11 , H01L25/18 , H05K1/18 , H05K3/34
摘要： PURPOSE:To perform mounting of semiconductor device parts in high density by on both side surfaces of a mounting substrate so that the same external connecting terminals are disposed symmetrical at the acute surfaces. CONSTITUTION:The terminal A of a lead 5 of a package 29 of a normal pattern is soldered to a conductor 32 on the surface of the upper layer 31 of a mounting substrate 30, and a terminal B is soldered to a conductor 33 on the surface of the layer 31. On the other hand, a package 34 of mirror pattern is mounted on the back surface of the substrate 30. The lead 27 of the package 34 is formed in a reverse direction, and a terminal soldered to a conductor 36 on the surface of the lower layer 35 of the substrate 30 becomes a terminal A common to the terminal A. Further, a terminal of the package 34 solder to a conductor 37 on the surface of the lower layer 35 of the substrate 30 is common to the terminal B. Thus, when the package 39 of the normal pattern and the package 34 of the mirror pattern are mounted on both side surfaces of the substrate 30, the same external connecting terminals of the parts 29, 34 of a semiconductor device is disposed at mirror-symmetrical position.

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