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21. 发明专利

JPS5795853A FORMATION OF ALUMINUM OXIDE FILM 失效
公开(公告)号：JPS5795853A
公开(公告)日：1982-06-14
申请号：JP17210880
申请日：1980-12-08
申请人： HITACHI LTD
发明人： MATSUYAMA HARUHIKO , NAKATANI MITSUO
IPC分类号： C03C17/25 , C01F7/02 , C01F7/30
摘要： PURPOSE:To form an aluminum oxide film with superior properties as a protective film on the surface of a glass substrate for a liq. crystal display element by coating the substrate surface with a specified org. material and an aluminum compound and carrying out calcination. CONSTITUTION:The surface of a glass substrate for a liq. crystal display element is coated with a soln. prepared by dissolving an org. compound capable of coordinating to metal such as alginic acid or polymethacrylic acid in a solvent such as water, alcohol or ethylene glycol at 0.5-50% concn., and the coated substrate is dipped in a soln. prepared by dissolving an aluminum compound such as aluminum chloride or aluminum bromide in water, alcohol or the like. The substrate surface may be coated with a soln. contg. said org. compound and said aluminum compound. The coated substrate is then calcined at 500- 1,000 deg.C to form an aluminum oxide film with superior performance as a transparent protective film.

22. 发明专利

JPS56129261A THIN FILM-FORMING COATING LIQUID COMPOSITION 失效
公开(公告)号：JPS56129261A
公开(公告)日：1981-10-09
申请号：JP3273580
申请日：1980-03-17
申请人： HITACHI LTD , HITACHI CHEMICAL CO LTD
发明人： NAKATANI MITSUO , SHIYOUJI FUSAJI , WATANABE TAKESHI , SUDOU RIYOUICHI , YOKONO ATARU , ISOGAI TOKIO , MATSUYAMA HARUHIKO , AZUMA KAZUFUMI
IPC分类号： C08L83/00 , C03C17/30 , C08L83/04 , C09D183/04
摘要： PURPOSE:To provide the titled compsn. which produces a good coating film which has a uniform thickness and is pinhole-free, and is suitable for use in the production of an insulating coating film, an oriented film, etc., by adding a specified amount of dimethylpolysiloxane to a soln. consisting of a ladder type organosilicon polymer and a solvent. CONSTITUTION:0.01-10wt% Dimethylpolysiloxane (C) is blended with a soln. consisting of 0.5-20wt% ladder type organosilicon polymer (A) having phenyl group [e.g. a polyphenylsilsesquioxane having a relative viscosity (in 1wt% benzene soln. at 30 deg.C) of 1.1-3.0] and 99.5-80wt% solvent (B) having a b.p. of not lower than 180 deg.C. By the blending of dimethylpolysiloxane, a coating film which is pinhole-free and has a uniform thickness, can be obtd. when the compsn is coated on the surfaces of glass, SiOx and metal oxides by printing method.

23. 发明专利

JPS56111691A TRANSFER PRINTING DEVICE 失效
公开(公告)号：JPS56111691A
公开(公告)日：1981-09-03
申请号：JP1357980
申请日：1980-02-08
申请人： HITACHI LTD
发明人： NAKATANI MITSUO , MATSUYAMA HARUHIKO , SATOU NOBUO
IPC分类号： B41C3/06 , B41M3/12 , B41N1/06 , B41N7/00 , C09D11/00 , C09D11/033 , C09D11/10 , C09D11/102
摘要： PURPOSE:To obtain a printing device which prints a thin film on a substrate with high accuracy by a method wherein an ink composed of a specific siloxane polymer and a solvent is supplied onto a relief printing composed of a specific fluoro containing copolymer to perform a transfer printing on a printied matter to be printed. CONSTITUTION:An ink composed of polymer siloxane (example: polyphenyl-silsesquioxane) expressed by a formula I (R is alkyl, phenyl) and one of solvents expressed by a formula II (R is an organic group; n is 3-8) and a formula III is supplied from an ink pot 1 into an ink mixing roll 10 to mix and thereafter, the ink is supplied to a relief printing 5 composed of a propyrene hexafluoride-copolymer vinylidene fluoride on a plate copper 4 by means of an ink supplying roll 9. And then, this is transferred and printed onto a printed matter to be printed 7 on a substrate moving base 11 to produce a printed matter.

24. 发明专利

JPS5498806A PREPARATION OF SCREEN BLOCK FOR PRINTING 失效
公开(公告)号：JPS5498806A
公开(公告)日：1979-08-04
申请号：JP437078
申请日：1978-01-20
申请人： HITACHI LTD
发明人： NAKATANI MITSUO , KUROKI TAKASHI , MATSUYAMA HARUHIKO , YABUSHITA AKIRA , HONDA YOSHINORI
IPC分类号： G03F7/12 , B41C1/14

25. 发明专利

JP2002171062A ELECTRONIC COMPONENT AND ITS MANUFACTURING METHOD 失效
公开(公告)号：JP2002171062A
公开(公告)日：2002-06-14
申请号：JP2000365975
申请日：2000-11-30
申请人： HITACHI LTD
发明人： YAMADA OSAMU , HORIKOSHI MUTSUMI , MATSUYAMA HARUHIKO , ONO TAKAYUKI
IPC分类号： H05K1/09 , H01L23/12 , H01L23/14 , H01L25/04 , H01L25/18 , H05K1/18 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To form a contact connection type an input/output electrode of high quality at a low cost. SOLUTION: This electronic component has a glass ceramic substrate 10, which has Cu electrode pads 11 which are exposed to the outside and contact connection type input/output electrode 20 which are formed on the respective electrode pad 11. Each contact connection type input/output electrode 20 is formed, by jointing a laminated metal body 21 to an electrode pad 11 of the glass ceramic substrate 10 by using Sn solder 22.

26. 发明专利

JPH10135634A MULTILAYER WIRING BOARD AND ITS MANUFACTURE 失效
公开(公告)号：JPH10135634A
公开(公告)日：1998-05-22
申请号：JP5502991
申请日：1991-03-19
申请人： HITACHI LTD
发明人： YOKONO ATARU , ARIMA HIDEO , INOUE TAKASHI , KITAMURA NAOYA , MATSUYAMA HARUHIKO , OKA HITOSHI , SHOJI FUSAJI , KATAOKA FUMIO , MUROOKA HIDEYASU , KYOI MASAYUKI
IPC分类号： H01L21/48 , H01L27/01 , H05K3/10 , H05K3/24 , H05K3/46
摘要： PURPOSE: To considerably reduce man-hours and read time by removing both a resist layer and a base metal layer simultaneously, forming the multilayer wiring of skeleton structure, filling the space of the multilayer with varnish in a non-solvent state and forming an insulating layer. CONSTITUTION: The base metal layer 2 constituted of a sputter thin film is formed on the base substrate 1 and thick film resist 3 is applied on the base metal layer 2 and a hole 4 is opened in accordance with a desired via hole arrangement pattern. A conductor 5 having the same height as thick film resist 3 is formed at the upper part of the base metal layer 2 exposed at the base part of the hole 4 as the via hole and the multilayer wiring of thirty layers with skeleton structure is formed as the process of one cycle. The space of multilayer wiring is filled with heat resistant non-solvent varnish having a cyclobutene ring, the insulating layer is formed and a fixed board fixed for reinforcement is removed.

27. 发明专利

JPH0685100A MULTILAYER MODULE CIRCUIT SUBSTRATE 失效
公开(公告)号：JPH0685100A
公开(公告)日：1994-03-25
申请号：JP23061892
申请日：1992-08-31
申请人： HITACHI LTD
发明人： YABUSHITA AKIRA , MATSUZAKI EIJI , MATSUYAMA HARUHIKO
IPC分类号： H01L21/3205 , H01L21/822 , H01L23/12 , H01L23/14 , H01L23/52 , H01L27/04 , H05K1/00 , H05K1/16
摘要： PURPOSE:To make the distribution of the temperature of a heat treatment uniform, to realize a film having a uniform quality, and to improve the accuracy of a resistance value and the stability thereof by causing a thin-film resistance element of a metal silicide film to be incorporated within a thin-film wiring circuit, in a multilayer module substrate in which thick films and thin films are formed in multilayer. CONSTITUTION:In a thick-film/thin-film hybrid circuit substrate for use in a computer, in which a thin film multilayer circuit composed of deposited interlayer insulating films 21-23 which are made of an organic film such as polyimide is formed on a thick film multilayer circuit substrate 1, a thin-film resistance element 4 which is incorporated in a thin film wiring circuit as a terminating resistor is made of a metal silicide film. Specifically, after spin-coating, a silicon thin film 420 is formed on the interlayer insulating film 21, made of polyimide-based resin, that has been subjected to a heat treatment. A metal thin film 421 is formed on the silicon thin film. This is then subjected to a heat treatment within an oven filled with an atmosphere of nitrogen, so that a chrome silicide thin film 422 is formed between the thin films 420 and 421. Thereafter, it is subjected to a wet etching treatment, whereby a predetermined pattern of a thin film resistance element 4 is formed and an internal electrode 41 and an external electrode 43 are also formed.

28. 发明专利

JPH05335196A 失效
公开(公告)号：JPH05335196A
公开(公告)日：1993-12-17
申请号：JP13454992
申请日：1992-05-27
申请人： HITACHI LTD
发明人： NISHIKAME MASASHI , MATSUYAMA HARUHIKO , YOSHIMOTO MITSUO
IPC分类号： G03F1/00 , G03F1/68 , H01L21/027 , H01L21/28 , G03F1/08
摘要： PURPOSE:To enable a negative photosensitive resin to be exposed to light without forming the image of a foreign object with an unmodified conventional device by a method wherein a photomask pattern is formed based on the calculation of the size of a foreign object attached to the photomask. CONSTITUTION:A pattern 5, where a required figure is enlarged along a certain direction to be larger than the maximum length of the projection of a foreign object expected to be attached to a photomask 1, is provided. The pattern 5 is transferred onto a negative photosensitive resin 6 on a substrate 8, the photomask 1 and the substrate 8 are aligned with each other, and then the photosensitive resin 6 is exposed to light. Then, the photomask 1 is made to move in a certain direction by a distance longer than the maximum length of the projection of a foreign object attached to the photomask 1, and then the photosensitive resin 6 is exposed to light again. By this setup, a cleanable photomask can be designed without using a pellicle, an aligning operation can be carried out at once, a conventional device is not required to be modified, and the image of a foreign object on a photomask is not formed.

29. 发明专利

JPH0381311B2 失效
公开(公告)号：JPH0381311B2
公开(公告)日：1991-12-27
申请号：JP14320482
申请日：1982-08-20
申请人： HITACHI LTD
发明人： MATSUYAMA HARUHIKO , NAKATANI MITSUO , OKUNAKA MASAAKI , YOKONO ATARU , ISOGAI TOKIO , SAITO TADASHI , MIDORIKAWA SUMYUKI
IPC分类号： H01L31/04 , H01L21/28 , H01L31/0224

30. 发明专利

JPH02252786A HEAT-RESISTANT ADHESIVE 失效
公开(公告)号：JPH02252786A
公开(公告)日：1990-10-11
申请号：JP7567789
申请日：1989-03-28
申请人： HITACHI LTD , HITACHI CHEMICAL CO LTD
发明人： MATSUYAMA HARUHIKO , SHOJI FUSAJI , HONDA ATSUSHI , AIZAWA TERUKI
IPC分类号： C09J179/08 , H01B3/30
摘要： PURPOSE:To obtain a heat-resistant adhesive capable of giving high bonding strength under low bonding pressure and suitable for die bonding by using as constituent either an end-capped polyimide precursor or an imide compound prepared therefrom. CONSTITUTION:A heat-resistant adhesive containing either an end-capped polyimide precursor or an imide compound prepared therefrom. An example of the polyimide precusor is a compound of formula I (wherein Ar is a group of, e.g. formula II or III; Ar is a group of, e.g. formula IV or V; R is methyl, ethyl, propyl, butyl or phenyl; R is methyl, ethyl, butyl, phenyl, methoxy, ethoxy, propoxy, butoxy or phenoxy; R is methylene, ethylene, propylene, butylene or phenylene; m is 0, 1, 2 or 3; n is 1 to 100). The heat-resistant adhesive thus obtained is capable of giving high bonding strength under low bonding pressure and suitable for die bonding.

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