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    • 21. 发明专利
    • METHOD OF POLISHING SUBSTRATE
    • JP2004006965A
    • 2004-01-08
    • JP2003280927
    • 2003-07-28
    • HITACHI CHEMICAL CO LTD
    • KURATA YASUSHIASHIZAWA TORANOSUKEHIRAI KEIZOAKAHORI SATOHIKOOTSUKI HIROTOHANAZONO MASANOBU
    • B24B37/00B24B37/005H01L21/304
    • PROBLEM TO BE SOLVED: To solve the problems wherein a process control based on a polishing time is hard to carry out, and a buried film is hard to be flat enough due to dishing in a recess CMP technique for forming a shallow trench isolation, a metal-embedded interconnect line, and the like so as to provide a method of polishing a substrate, which is capable of removing the excessive film layers of an silicon oxide film and an embedded film of metal or the like, performing a flattening operation efficiently with high accuracy, and easily carrying out a process control. SOLUTION: The substrate polishing method is a method of polishing a substrate with a polishing agent containing abrasive particles and an additive agent which gives a polishing pressure-dependent inflection point to a polishing speed. Provided that the polishing pressure is represented by P, the above polishing method comprises a first process of polishing the substrate with the polishing agent whose loading gives an inflection point to the polishing speed at a pressure P', wherein the pressure P' and the polishing pressure P are set so as to satisfy a formula P'>P, and a second process of polishing the substrate with the polishing agent whose loading gives an inflection point to the polishing speed at a pressure P", wherein the pressure P" and the polishing pressure P are set so as to satisfy a formula P" COPYRIGHT: (C)2004,JPO
    • 28. 发明专利
    • MANUFACTURE OF FE16N2 FILM
    • JPH0417315A
    • 1992-01-22
    • JP11986690
    • 1990-05-11
    • HITACHI LTD
    • KOMURO MATAHIROKOZONO YUZOHANAZONO MASANOBU
    • C23C14/06H01F10/18H01F41/20
    • PURPOSE:To obtain a manufacturing method of a ferromagnetic film containing Fe16N2 whose vapor-deposition speed is 500Angstrom /sec or lower and whose saturation flux density is 2.2T or higher by a method wherein Fe is vapor-deposited, in an atmosphere containing a specific amount or higher of NH3 gas, on a material whose lattice constant number is within a specific range. CONSTITUTION:Fe is vapor-deposited, in a gas atmosphere containing 0.5% or higher of NH3, on a material whose lattice constant is 5.653Angstrom or higher and 6.058Angstrom or lower; and a ferromagnetic film containing Fe16N2 whose film saturation flux density is 2.2T or higher is epitaxially grown. For example, a vacuum is produced at about 1X10 Torr before a vapor-deposition operation; after that, a gas containing 0.5% or higher of NH3 is introduced; the vacuum degree during the vapor-deposition operation is set to 1X10 to 1X10 Torr; and Fe is vapor-deposited by using an electron beam. At this time, one part of NH3 is dissociated by the electron beam, and nitrogen ions creep into the lattice of Fe. A single crystal such as GaAs, AlAs, InAs or the like or a single crystal into which they are properly mixed is used as s substrate, and a substrate temperature is set at 100 to 400 deg.C.