专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

21. 发明专利

JPH08213531A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH08213531A
公开(公告)日：1996-08-20
申请号：JP1568195
申请日：1995-02-02
申请人： HITACHI LTD
发明人： YOSHIDA ISAMU , SAEKI JUNICHI , TSUNODA SHIGEHARU , ENDO TSUNEO , DOBASHI YOSHIO
IPC分类号： H01L25/18 , H01L23/50 , H01L25/04
摘要： PURPOSE: To provide a semiconductor device which is improved in heat dissipating properties to dissipate out heat released from a semiconductor element. CONSTITUTION: A board 1 is mounted on a frame-shaped tab 2, and a semiconductor element 3 is mounted on the board 1 and sealed up with a molding resin 4, heat dissipating leads 8 are provided to the frame-shaped tab 2 extending towards the ends of the outline sides of the resin 4, and the parts of the heat dissipating leads 8 protruding from the resin 4 are formed identical in the shape to outer leads 6.

22. 发明专利

JPH08125051A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH08125051A
公开(公告)日：1996-05-17
申请号：JP26342994
申请日：1994-10-27
申请人： HITACHI LTD
发明人： SAEKI JUNICHI , SERIZAWA KOJI , YOSHIDA TORU , TSUNODA SHIGEHARU , YOSHIDA ISAMU , OJI KAZUYA
IPC分类号： H01L21/60 , H01L23/02 , H01L23/12 , H01L23/50
摘要： PURPOSE: To realize multipin and low heat resistance package of a low cost by performing primary connection for an LSI chip with an insulation film wherein a wiring pattern is formed on a surface and by performing secondary connection for a terminal on the insulation film and a substrate with a gold wire. CONSTITUTION: The rear of an LSI chip 1 with the face down is bonded to a tab lead 2 and a hanging lead 3 is extended from an end part of the tab lead 2 toward below the outside and is adhered to an end part of an upper surface of a lamination wiring board 4. An electrode terminal of the chip 1 is extracted by a beam lead 5 and a tip thereof is primarily connected with an insulation film 6. A wiring part of the insulation film 6 and a terminal 7 of an upper surface of the substrate 4 are secondarily connected with a gold line 8. Thereby, multipin face-down BGA package of a low cost which is excellent in heat dissipation can be realized.

23. 发明专利

JPH05102216A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH05102216A
公开(公告)日：1993-04-23
申请号：JP26180791
申请日：1991-10-09
申请人： HITACHI LTD
发明人： YOSHIDA ISAMU , SAEKI JUNICHI , TSUNODA SHIGEHARU , NISHI KUNIHIKO
IPC分类号： H01L21/56
摘要： PURPOSE:To provide the technique with which a semiconductor element can be sealed in the state having no defects of molding such as shifting of an insert, penetrating void and the like. CONSTITUTION:A mold resin piece 5, which was molded in advance, is provided on the cavity part of the lower mold 2, a lead frame 3, on which a semiconductor element 4 is mounted, is formed, molded and the shifting of an insert can be suppressed.

24. 发明专利

JPH03173445A MANUFACTURE AND MANUFACTURING EQUIPMENT FOR SEMICONDUCTOR PLASTIC PACKAGE 失效
公开(公告)号：JPH03173445A
公开(公告)日：1991-07-26
申请号：JP31067589
申请日：1989-12-01
申请人： HITACHI LTD , HITACHI MACH & ENG LTD
发明人： NAKAMURA SHOZO , KANEDA AIZO , TSUNODA SHIGEHARU , NOZAWA KATSUTOSHI , KUBOTA RYUJI , HASEBE AKIO
IPC分类号： H01L21/56
摘要： PURPOSE:To reduce residual stress and prevent the generation of resin cracks, by performing secondary curing in a heat holding state without cooling after mold opening. CONSTITUTION:A molded object 4 molded by a molding machine 1 in a zone I is released from the mold simultaneously to mold opening, and sent to a zone II via a taking-out lever 5 and a distribution truck 7. A bar 9 receives the molded object and mounts it on a conveyer 16. The molded object 4 is moved in a heating vessel 11 and subjected to heat treatment for secondary curing. The molding object 4 after heating is transferred to a cooling equipment 17 in a zone III and cooled by a fan 23. The molded object 4 after cooling is transferred to a taking-out position of vessel outside in a zone IV by the conveyer 16.

25. 发明专利

JPH033908B2 失效
公开(公告)号：JPH033908B2
公开(公告)日：1991-01-21
申请号：JP19894482
申请日：1982-11-15
申请人： HITACHI LTD
发明人： SAEKI JUNICHI , TSUNODA SHIGEHARU , KANEDA AIZO , YOKONO ATARU
IPC分类号： G01N11/00 , B29C43/00 , B29C45/00 , B29C45/02 , B29C45/26 , B29C45/76 , G01N33/44

26. 发明专利

JPH0144489B2 失效
公开(公告)号：JPH0144489B2
公开(公告)日：1989-09-28
申请号：JP16539280
申请日：1980-11-26
申请人： HITACHI LTD
发明人： SAEKI JUNICHI , KANEDA AIZO , TSUNODA SHIGEHARU , OOTSUKI KEIZO , SUZUKI AKIRA
IPC分类号： G01N11/00 , B29B13/00 , B29C33/00 , B29C33/44 , B29C45/40 , B29K105/20 , B29L31/34 , G01N19/04 , H01L21/56 , H01L21/66

27. 发明专利

JPS62247306A OPTICAL WAVEGUIDE ELEMENT 失效
公开(公告)号：JPS62247306A
公开(公告)日：1987-10-28
申请号：JP8992386
申请日：1986-04-21
申请人： HITACHI LTD
发明人： SATO HIDEMI , HIYOSHI YASUO , KANEDA AIZO , TSUNODA SHIGEHARU
IPC分类号： G02B6/13 , G02B6/12
摘要： PURPOSE:To obtain an optical waveguide element having good stability with ease, high accuracy and low loss at a low cost by irradiating an electron beam to a thin metallic film formed on a chalcogenide glass substrate to diffuse the metal in the irradiated part into the chalcogenide glass substrate, thereby forming a prescribed flush type three-dimensional optical waveguide. CONSTITUTION:A substrate made of As2S3 having 2.4 refractive index is used as the optically polished chalcogenide glass substrate 1 and a thin Ag film is formed to 500Angstrom as the thin metallic film 2 by vacuum deposition on the substrate. The vacuum deposition is executed under the conditions of 40 deg.C substrate temp., 5X10 mmHg vacuum degree and 5Angstrom /S film forming speed. The electron beam 3 having 50kV acceleration voltage and 0.7mum spot diameter is then irradiated onto the thin metallic film 2 and the unnecessary thin metallic film is removed by etching, by which the flush-type three-dimensional optical waveguide 4 having 3mum both width and depth and 2.44 refractive index is formed.

28. 发明专利

JPS61151504A OPTICAL MULTIPLEXER/DEMULTIPLEXER FOR OPTICAL COMMUNICATION 失效
公开(公告)号：JPS61151504A
公开(公告)日：1986-07-10
申请号：JP27304584
申请日：1984-12-26
申请人： HITACHI LTD
发明人： TSUNODA SHIGEHARU , SATO HIDEMI , KANEDA AIZO
IPC分类号： G02B6/293 , G02B6/28
摘要： PURPOSE:To reduce considerably the number of parts of an optical multiplexer/ demultiplexer, to improve the processability and to reduce considerably the unit price of parts by producing glass blocks in accordance with the number of wavelengths to be demultiplexed or multiplexed. CONSTITUTION:Interference film filters 11-14 for reflection which reflect wavelengths lambda1-lambda4 or permit them to transmit through respectively are stuck or vapor-deposited to one surface of blocks 10 and 9. The optical signal lambda1 out of optical signals lambda1-lambda4 incident from an input port 1 is reflected on the interference film filter 11 for lambda1 reflection and is transmitted to the first port 2. The other optical signals lambda2-lambda4 are transmitted through the interference film filter 11, and the optical signal lambda2 out of transmitted optical signals lambda2-lambda4 is reflected on the interference film filter 12 for lambda2 reflection and is transmitted to the second port 3. The outer optical signals lambda3 and lambda4 are transmitted through the interference film filter 12 and are reflected on interference film filters 13 and 14 similarly and are transmitted to the third port 7 and the fourth port 8 respectively, and thus, all optical signals lambda1-lambda4 are demultiplexed. They are multiplexed through the reverse course.

29. 发明专利

JPS6167803A Optical multiplexer/demultiplexer 失效
标题翻译：光学多路复用器/解复用器
公开(公告)号：JPS6167803A
公开(公告)日：1986-04-08
申请号：JP18967584
申请日：1984-09-12
申请人： Hitachi Ltd
发明人： HIYOSHI YASUO , SATO HIDEMI , KANEDA AIZO , TSUNODA SHIGEHARU
IPC分类号： G02B6/12 , G02B6/28 , G02B6/293
CPC分类号： G02B6/12004
摘要： PURPOSE:To reduce the number of the constituent parts as well as the size and to attain stabilization to vibration from the outside by irradiating electron beams on the thin film of chalcogens glass formed on a substrate so as to form flat microlenses and microgratings. CONSTITUTION:A silicon oxide film 9, the thin film 10 of chalcogens glass having microlenses 13 and microgratings 14-1-14-4 formed by irradiating electron beams, a protective film and a thin metallic film are successively laminated on a silicon substrate 8. Light from an optical fiber 1 is introduced into the glass film 10 through a rodlike lens 4, converted into parallel rays of light through the microlens 13 on the inlet side, and passed through the microgratings 14-1-14-4 to branch the multiplex wavelengths lambda1-lambda4 into the separate wavelengths. When single light having wavelengths lambda1-lambda4 is incident on the glass film 10 from each port, the wavelengths are multiplexed.
摘要翻译：目的：为了减少构成部件的数量和尺寸，并且通过在形成在基板上的硫属元素玻璃的薄膜上照射电子束来实现来自外部的振动的稳定性，以形成平坦的微透镜和微光栅。构成：通过照射电子束，保护膜和薄金属膜形成的具有微透镜13和微孔14-1-14-4的硫属玻璃的薄膜10依次层叠在硅基板8上。来自光纤1的光通过棒状透镜4被引入到玻璃膜10中，通过入口侧的微透镜13转换成平行光线，并通过微光栅14-1-14-4分支多路复用波长λ1-λ4进入分离的波长。当具有波长λ1-λ4的单个光从每个端口入射到玻璃膜10上时，波长被多路复用。

30. 发明专利

JPS5988656A APPARATUS FOR INSPECTING THERMOSETTING RESIN 失效
公开(公告)号：JPS5988656A
公开(公告)日：1984-05-22
申请号：JP19894482
申请日：1982-11-15
申请人： HITACHI LTD
发明人： SAEKI JIYUNICHI , TSUNODA SHIGEHARU , KANEDA AIZOU , YOKONO ATARU
IPC分类号： G01N11/00 , B29C43/00 , B29C45/00 , B29C45/02 , B29C45/26 , B29C45/76 , G01N33/44
摘要： PURPOSE:To accurately and rapidly detect the fluidized and cured state of the resin in each part of a mold, by detecting resin pressure during fluidization, a plunger falling speed and a fluidized leading end position. CONSTITUTION:A resin tablet thrown in a mold 1 is pressed by a plunger 3 to be converted to molten resin and carried to a cavity 7 through a gate 6. Pulse voltage is outputted from a pulse generator 16 by the order of a microcomputer 14 to cyclically open and close the electromagnetic relief valve 17 of a molding machine. Resin pressure and the displacement of the plunger 3 are detected by pressure detectors 8, 9, 10 and a displacement detector 11 and the data in the following state of pressure change is stored in a computer 14. At the point of time when the signal from the pressure detector 10 is not followed to the signal of the pulse generator 16, the computer 14 performs the operation of viscosity and a gate seal state on the basis of the stored data and the result thereof is outputted by a printer 18.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式