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11. 发明专利

JP2009105204A Base for receiving wiring circuit board, device for connecting wiring circuit board using the base, and connecting method 有权
标题翻译：用于接收电路板的基座，用于使用基座连接接线电路板的装置和连接方法
公开(公告)号：JP2009105204A
公开(公告)日：2009-05-14
申请号：JP2007275184
申请日：2007-10-23
申请人： Sony Chemical & Information Device Corp , ソニーケミカル&インフォメーションデバイス株式会社
发明人： SAITO MASAO
IPC分类号： H05K3/36 , H05K3/00
CPC分类号： H05K3/361 , H05K3/323 , H05K2203/0173 , H05K2203/0195 , H05K2203/0278 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/5317
摘要： PROBLEM TO BE SOLVED: To attain uniform thermo-compression bonding to a wiring circuit board having an electronic component mounted on its rear surface to establish reliable ACF connection. SOLUTION: Flexible printed circuit boards 4, 5 are compressed against a mother board 1 having an electronic component 6 mounted thereon by the use of a thermo-compression bonding head 12, and an anisotropic conductive adhesive film is heated to establish ACF connection between the mother board 1 and the flexible printed circuit boards 4, 5 as connection-target members. At this time, a receiving base 13 is formed of a resilient material such as silicone rubber and has a recess 13a corresponding to the electronic component 6 in shape at a mounting position of the electronic component 6 on the mother board 1, and thermo-compression bonding is carried out in such a state that the rear surface of the mother board 1 is supported by the receiving base 13. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了实现与安装在其后表面上的电子部件的布线电路板的均匀热压接，以建立可靠的ACF连接。解决方案：柔性印刷电路板4,5通过使用热压接头12而被压靠在具有安装在其上的电子部件6的母板1上，并且各向异性导电粘合剂膜被加热以建立ACF连接在母板1和柔性印刷电路板4,5之间作为连接目标构件。此时，接收基座13由诸如硅橡胶的弹性材料形成，并且在母板1上的电子部件6的安装位置具有对应于电子部件6的凹部13a，并且热压缩在母板1的后表面被接收基座13支撑的状态下进行接合。（C）版权所有（C）2009，JPO＆INPIT

12. 发明专利

JPWO2006101155A1 電子部品の実装方法および電子回路装置有权
公开(公告)号：JPWO2006101155A1
公开(公告)日：2008-09-04
申请号：JP2007509319
申请日：2006-03-23
申请人：松下電器産業株式会社
发明人：山下　嘉久 , 嘉久山下 , 靖治辛島 , 靖治辛島 , 孝史北江 , 孝史北江 , 中谷　誠一 , 誠一中谷 , 小島　俊之 , 俊之小島 , 小松　慎五 , 慎五小松
IPC分类号： H01L21/60
CPC分类号： H01L21/6835 , B30B5/02 , B30B15/065 , H01L24/11 , H01L24/16 , H01L24/29 , H01L24/75 , H01L24/81 , H01L24/83 , H01L25/0655 , H01L25/16 , H01L25/50 , H01L2221/68354 , H01L2224/05568 , H01L2224/05573 , H01L2224/13099 , H01L2224/131 , H01L2224/16225 , H01L2224/29111 , H01L2224/29139 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/75314 , H01L2224/7598 , H01L2224/8121 , H01L2224/81815 , H01L2224/83192 , H01L2224/83224 , H01L2224/83886 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01009 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15724 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/30105 , H05K3/303 , H05K3/305 , H05K3/323 , H05K3/341 , H05K3/3442 , H05K3/3484 , H05K2201/10636 , H05K2201/10674 , H05K2201/10977 , H05K2203/0173 , Y02P70/611 , Y02P70/613 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , H01L2924/01083 , H01L2924/00 , H01L2924/00015 , H01L2924/0665 , H01L2224/05599
摘要：本発明は、導体配線と接続端子とが設けられた配線基板(1)の主面に、はんだ粉、対流添加剤および前記はんだ粉の溶融温度で流動性を有する樹脂を含む樹脂組成物(3)を塗布する工程と、受動部品を少なくとも1つ含む複数の電子部品(7),(8),(9)からなり、各電子部品は電極端子を有する電子部品群を用意し、前記接続端子と前記電極端子とを位置合わせして、前記電子部品群を前記樹脂組成物表面に当接させる工程と、少なくとも前記樹脂組成物を加熱して、前記はんだ粉を溶融させるとともに前記対流添加剤により前記はんだ粉を前記接続端子と前記電極端子との間に自己集合させ、前記接続端子と前記電極端子とをはんだ接続する工程と、前記樹脂組成物中の前記樹脂を硬化させて前記電子部品群それぞれと前記配線基板とを前記樹脂により接着固定する工程とを含み、バンプをあらかじめ形成することなく、実装工程を大幅に簡略化することを可能にする。

13. 发明专利

JP4938471B2 Through-hole processing equipment and the through-hole machining method of green sheet 有权
公开(公告)号：JP4938471B2
公开(公告)日：2012-05-23
申请号：JP2007009066
申请日：2007-01-18
申请人：アルプス電気株式会社
发明人：裕司作間 , 清一横山
IPC分类号： H05K3/00 , B26F1/02 , B28B1/48 , H05K3/46
CPC分类号： B26D7/1836 , B26F1/02 , B26F1/24 , B26F2210/08 , H05K1/0306 , H05K3/005 , H05K2203/0108 , H05K2203/0143 , H05K2203/0173 , Y10T83/943 , Y10T83/9459 , Y10T156/1056

14. 发明专利

JP4879890B2 Connection method of circuit board 有权
公开(公告)号：JP4879890B2
公开(公告)日：2012-02-22
申请号：JP2007517861
申请日：2006-05-24
申请人：パナソニック株式会社
发明人：啓之鈴木
IPC分类号： H05K1/14
CPC分类号： H01L23/49833 , H01L23/057 , H01L2224/16 , H01L2924/07811 , H01L2924/3025 , H05K3/284 , H05K3/361 , H05K2201/10371 , H05K2201/10977 , H05K2203/0173 , H05K2203/0195 , H05K2203/0278 , H05K2203/1572 , Y10T29/49126 , H01L2924/00

16. 发明专利

JP2009515355A Assembling method of the optical element to the substrate 审中-公开
公开(公告)号：JP2009515355A
公开(公告)日：2009-04-09
申请号：JP2008539560
申请日：2006-11-03
申请人：コーニンクレッカフィリップスエレクトロニクスエヌヴィ
发明人：ヨーゼフアンドレアスシューグ
IPC分类号： H01L33/60
CPC分类号： H05K3/303 , H01L21/6835 , H01L24/26 , H01L24/83 , H01L33/60 , H01L2221/68309 , H01L2224/83801 , H01L2924/01015 , H01L2924/01033 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H05K3/341 , H05K2201/10106 , H05K2203/0173 , Y02P70/613 , Y10T156/10 , H01L2924/00
摘要： The present application relates to assembling a lighting element (20) onto a substrate (28). To enable exact positioning of the lighting element (20) and further optical components (30), there is provided aligning the lighting element (20) with a support element (22) within one mounting plane P using an auxiliary carrier (24), surface mounting the lighting element (20) together with the support element (22) onto a substrate (28) within one step e.g. by reflow soldering, and mounting a further component (30) onto the support element (22) such that no mechanical stress is applied to the lighting element (20).

17. 发明专利

JPWO2006126586A1 回路基板の接続構造および回路基板の接続方法有权
公开(公告)号：JPWO2006126586A1
公开(公告)日：2008-12-25
申请号：JP2007517861
申请日：2006-05-24
申请人：松下電器産業株式会社
发明人：鈴木　啓之 , 啓之鈴木
IPC分类号： H05K1/14
CPC分类号： H01L23/49833 , H01L23/057 , H01L2224/16 , H01L2924/07811 , H01L2924/3025 , H05K3/284 , H05K3/361 , H05K2201/10371 , H05K2201/10977 , H05K2203/0173 , H05K2203/0195 , H05K2203/0278 , H05K2203/1572 , Y10T29/49126 , H01L2924/00
摘要：電子部品を実装可能な面積を拡大できるとともに製造工程を簡略化できる回路基板の接続構造および回路基板の接続方法を提供する。回路基板の接続構造30は、第1回路基板31の裏面32Bに設けられた裏面回路パターン43(図3参照)と、裏面回路パターン43に実装された第1の電子部品45,第2の電子部品46とを備える。この回路基板の接続方法は、第1、第2の回路基板31,35の接続工程にあたって第1の電子部品45,第2の電子部品46の頂部45A,46Aに対して個別に接触する第1、第2の接触面56,57と、受けベース51に接触するとともに第1回路基板31に対して平行な受け面58とを備える加圧治具55を第1の電子部品45,第2の電子部品46の頂部45A,46Aと受けベース51との間に介装する。

18. 发明专利

JP2008021959A Through-hole machining apparatus of green sheet, and through-hole machining method of the same 有权
标题翻译：绿板通孔加工设备及其同孔加工方法
公开(公告)号：JP2008021959A
公开(公告)日：2008-01-31
申请号：JP2007009066
申请日：2007-01-18
申请人： Alps Electric Co Ltd , アルプス電気株式会社
发明人： SAKUMA YUJI , YOKOYAMA SEIICHI
IPC分类号： H05K3/00 , B26F1/02 , B28B1/48 , H05K3/46
CPC分类号： B26D7/1836 , B26F1/02 , B26F1/24 , B26F2210/08 , H05K1/0306 , H05K3/005 , H05K2203/0108 , H05K2203/0143 , H05K2203/0173 , Y10T83/943 , Y10T83/9459 , Y10T156/1056
摘要： PROBLEM TO BE SOLVED: To provide a green sheet through-hole machining apparatus, and a through-hole machining method, that allow deterioration of positional precision of through-holes after perforation to be readily prevented. SOLUTION: A releasing plate 4 made of a metallic thin plate, etc. is removably placed on an upper face 3a of a lower base 3. Then, a green sheet 1 is interposed between the lower base 3 and an upper base 5 and the upper base 5 is pressed by a pressurizing roller 7 to press down the green sheet 1 toward the releasing plate 4. Then, the green sheet 1 is punched by projections 3b to perforate through-holes 2. After that, the green sheet 1 is removed from the lower base 3 together with the releasing plate 4. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供能够容易地防止穿孔后的通孔的位置精度劣化的生坯片通孔加工装置和通孔加工方法。解决方案：由金属薄板等制成的释放板4可拆卸地放置在下基座3的上表面3a上。然后，生片1插入在下基座3和上基座5之间上部基座5被加压辊7按压以将生片1向释放板4压下。然后，通过突起3b冲压生坯片1以穿孔通孔2.然后，生片1 与释放板4一起从下底座3移除。版权所有（C）2008，JPO＆INPIT

19. 发明专利

JP2006294974A Electronic equipment and its manufacturing method 有权
标题翻译：电子设备及其制造方法
公开(公告)号：JP2006294974A
公开(公告)日：2006-10-26
申请号：JP2005115625
申请日：2005-04-13
申请人： Denso Corp , 株式会社デンソー
发明人： NAKANO TETSUO , MAEDA YUKIHIRO
IPC分类号： H05K1/18 , H01L25/04 , H01L25/18 , H05K3/32
CPC分类号： H05K3/3405 , H01L2224/16225 , H01L2924/00014 , H01L2924/19105 , H01L2924/19107 , H05K3/0061 , H05K3/3415 , H05K3/3421 , H05K5/0069 , H05K2201/09745 , H05K2201/10189 , H05K2201/10446 , H05K2203/0173 , H01L2224/0401
摘要： PROBLEM TO BE SOLVED: To eliminate an interference factor at the time of connecting a wiring board with a connector member and to fully ensure a connecting space even if a build is miniaturized in electronic equipment in which the wiring board and the connector member are electrically connected by a bonding wire and are loaded in a case.
SOLUTION: A connector member 30 is constituted as a terminal installation side 33 whose opposite side of an outer connecting side 32 is flat. A pad 23 to which a wire 40 is connected is provided on one plane 21 of a wiring board 20. The pad 23 is electrically connected with a terminal 31 by the wire 40. The wiring board 20 and the connector member 30 are mutually connected and integrated, and are loaded and furnished in a case 10 in the state that one plane 21 of the wiring board 20 and the terminal installation side 33 are faced to the case 10. On the loading side 12 of the case 10 there is provided a recess 13 for containing the wire 40.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了消除在将布线板与连接器构件连接时的干扰因素，并且即使在电路设备中构造小型化也能充分确保连接空间，其中布线板和连接器构件通过接合线电连接并被装载到壳体中。解决方案：连接器构件30构成为外连接侧32的相对侧平坦的端子安装侧33。在布线板20的一个平面21上设置连接有导线40的焊盘23.焊盘23通过导线40与端子31电连接。布线基板20和连接器部件30相互连接，一体化，并且在布线板20的一个平面21和端子安装侧33面对壳体10的状态下在壳体10中装载和布置。在壳体10的装载侧12上设置有凹部包含导线40的13。版权所有（C）2007，JPO＆INPIT

20. 发明专利

JPS579240B1 JPS579240B1 - 失效
公开(公告)号：JPS579240B1
公开(公告)日：1982-02-20
申请号：JP3566872
申请日：1972-04-08
IPC分类号： H01C1/01 , H01G2/06 , H01G13/00 , H05K3/30 , H05K3/34 , H05K13/04 , H05K1/18
CPC分类号： H05K3/306 , H05K3/301 , H05K3/3447 , H05K13/04 , H05K2201/10424 , H05K2201/10454 , H05K2201/10651 , H05K2203/0173 , Y10T29/49139 , Y10T29/53174 , Y10T29/53265

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