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11. 发明专利

JP2006134982A Paste for solder jointing and solder jointing method 有权
标题翻译：焊接接头和焊接接头方法
公开(公告)号：JP2006134982A
公开(公告)日：2006-05-25
申请号：JP2004320232
申请日：2004-11-04
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： MAEDA KEN , SAKAI TADAHIKO
IPC分类号： H05K3/34 , B23K1/00 , B23K35/22 , B23K101/42
CPC分类号： H05K3/3484 , B23K35/0244 , B23K35/025 , B23K35/282 , B23K35/3006 , B23K35/3013 , B23K35/3613 , H05K3/3436 , H05K3/3463 , H05K3/3489 , H05K2201/0215 , H05K2201/0218 , H05K2201/10992 , Y02P70/613
摘要： PROBLEM TO BE SOLVED: To provide a paste for solder jointing and a solder jointing method capable of cooping with the solder junction and insulation.
SOLUTION: In the flux including metal powder used by interposition between a bump and a circuit electrode at the time of mounting electronic components by solder junction, a metal powder 8 mixed for improving solder wettability is constituted such that the surface of a core metal 8a formed with metal, such as tin and zinc. It is covered with a surface metal 8b formed with the precious metals, such as gold and silver. In the reflow process of solder junction, a surface metal 8bga is diffused into a core metal 8a by heating, and is taken in in the state of dissolution. At the time of the end of reflow, the core metal 8a is formed in an oxidized state on the surface of metal powder 8 so that it may be covered with oxide film 8c stabilized electrically. Consequently, the metal powder 8 does not remain as a residual substance after reflowing in the state of being easy to cause migration so as to cope with the solder junction and insulation.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供用于焊接接合的焊膏和能够与焊接接合部和绝缘体配合的焊接接合方法。解决方案：在通过焊接接合安装电子部件时，通过包括在凸块和电路电极之间插入的金属粉末的焊剂，构成为了提高焊料润湿性而混合的金属粉末8，使得芯的表面由金属形成的金属8a，例如锡和锌。它被形成有贵金属（例如金和银）的表面金属8b覆盖。在焊接接头的回流工艺中，表面金属8bga通过加热而扩散到芯金属8a中，并以溶解状态进入。在回流结束时，芯金属8a在金属粉末8的表面上以氧化状态形成，使得其可以被电气稳定的氧化物膜8c覆盖。因此，在容易发生迁移的状态下，金属粉末8在回流之后不会残留在残留物中，从而可以应对焊点和绝缘。版权所有（C）2006，JPO＆NCIPI

12. 发明专利

JP2005057285A Ball grid array package 审中-公开
标题翻译：球网阵列包
公开(公告)号：JP2005057285A
公开(公告)日：2005-03-03
申请号：JP2004223374
申请日：2004-07-30
申请人： Cts Corp , シーティーエス・コーポレーションCts Corporation
发明人： BLOOM TERRY R
IPC分类号： H01C13/02 , H01C1/144 , H01G4/232 , H01L21/48 , H01L23/12 , H01L23/31 , H01L23/498 , H05K3/32 , H05K3/34
CPC分类号： H01C1/144 , H01G4/232 , H01L21/486 , H01L23/3128 , H01L23/49816 , H01L23/49827 , H01L2224/16237 , H01L2924/01019 , H01L2924/19041 , H05K3/321 , H05K3/3436 , H05K2201/10234 , H05K2201/10992 , H05K2203/041 , Y02P70/613
摘要： PROBLEM TO BE SOLVED: To provide a ball grid array package including a substrate having top and bottom surfaces. SOLUTION: The package is characterized in that circuits components are arranged on the bottom surface; the circuit components have a pair of end portions; a pair of conductors are arranged on the bottom surface; the conductors are connected to the end portions of the circuit components; conductive epoxy covers a part of the conductors and a part of the bottom surface; the conductive epoxy electrically contacts with the conductors; balls are connected to the conductive epoxy; the conductive epoxy contacts between the conductors and the balls; the balls are preferably made of copper, and later treated by corrosion-resistance coating; and other embodiment in which the balls are removed and the through holes of the substrate are filled with the conductive epoxy is shown. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种包括具有顶表面和底表面的基底的球栅阵列封装。解决方案：封装的特征在于电路部件布置在底表面上; 电路部件具有一对端部; 一对导体布置在底面上; 导体连接到电路部件的端部; 导电环氧树脂覆盖导体的一部分和底表面的一部分; 导电环氧树脂与导体电接触; 球连接到导电环氧树脂; 导电环氧树脂在导体和球之间接触; 球优选由铜制成，然后用耐腐蚀涂层处理; 并且示出了其中移除滚珠并且衬底的通孔填充有导电环氧树脂的其它实施例。版权所有（C）2005，JPO＆NCIPI

13. 发明专利

JP2004179615A Solder connection structure and method for solder-connecting electronic part 有权
公开(公告)号：JP2004179615A
公开(公告)日：2004-06-24
申请号：JP2003178118
申请日：2003-06-23
申请人： Alps Electric Co Ltd , アルプス電気株式会社
发明人： KUBOKAWA TERUYOSHI , KOSAKA KUNIO , NOMURA TAKAFUMI
IPC分类号： H05K1/18 , B23K1/00 , B23K35/26 , B23K101/36 , H05K1/09 , H05K3/34
CPC分类号： H05K3/3463 , B23K1/0016 , B23K35/262 , H05K3/3447 , H05K2201/10992 , H05K2203/047
摘要： PROBLEM TO BE SOLVED: To provide a lead-free solder connection structure and a method for solder-connecting by which a non-heat resistance electronic part can be surely soldered at a low cost.
SOLUTION: A first solder part 14 made of tin-silver-copper based soldering material is respectively provided on a solder land 11 for surface mounting and a solder land 12 for lead terminal of a circuit board 10 wherein the lands 11 and 12 are formed on the same surface, and a terminal 21 of a chip-like electronic part 20 is mounted on the land 11 and it is heated to melt the first solder part 14 and connect it with the terminal 21. Next, a second solder part 15 made of tin-zinc based soldering material is provided on the first solder part 14 formed on the land 12, and a lead terminal 31 of a non-heat resistance electronic part 30 is inserted into a terminal hole 13 formed adjacent to the land 12, and then it is heated at lower temperature than the heating step to melt the second solder part 15 and connect it with the terminal 31.
COPYRIGHT: (C)2004,JPO

14. 发明专利

JP3385872B2 Solder supply method and solder supply device 失效
公开(公告)号：JP3385872B2
公开(公告)日：2003-03-10
申请号：JP24582496
申请日：1996-09-18
申请人：三菱電機株式会社
发明人：吾朗出田 , 照安達 , 実保弘田 , 純司藤野
IPC分类号： H01L21/60 , H01L21/68 , H01L23/485 , H05K3/12 , H05K3/34
CPC分类号： H05K3/3484 , H01L21/6835 , H01L24/11 , H01L24/13 , H01L2224/05155 , H01L2224/05166 , H01L2224/05644 , H01L2224/11003 , H01L2224/11005 , H01L2224/1111 , H01L2224/11334 , H01L2224/11822 , H01L2224/13099 , H01L2224/131 , H01L2224/13109 , H01L2224/13316 , H01L2224/16 , H01L2224/81193 , H01L2924/0001 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01033 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/15311 , H01L2924/19043 , H05K3/1216 , H05K3/3436 , H05K3/3463 , H05K3/3478 , H05K2201/0272 , H05K2201/035 , H05K2201/10734 , H05K2201/10984 , H05K2201/10992 , H05K2203/0338 , H05K2203/043 , H05K2203/0557 , H01L2924/00014 , H01L2924/0105 , H01L2924/00 , H01L2924/013
摘要： A method of depositing solder paste includes the steps of: superimposing a masking member having a plurality of through-holes and a supporting member on each other so that the supporting member covers the plurality of through-holes; filling cavity portions formed by the plurality of through-holes and the supporting member with solder paste; disposing an LSI chip and the masking member so that electrodes and the cavity portions are superimposed on each other respectively; and heating the solder paste so as to make the solder paste deposit on the electrodes.

16. 发明专利

JPWO2014083992A1 電子部品収納用容器および電子装置有权
标题翻译：电子部件储存容器和电子设备
公开(公告)号：JPWO2014083992A1
公开(公告)日：2017-01-05
申请号：JP2014550095
申请日：2013-10-29
申请人：京セラ株式会社
发明人：剛寒竹 , 剛寒竹
IPC分类号： H01L23/04 , H01L23/02
CPC分类号： H05K5/0217 , H01L23/057 , H01L23/10 , H01L2924/0002 , H01R13/405 , H05K5/069 , H05K2201/10984 , H05K2201/10992 , H01L2924/00
摘要：電子部品収納用容器は、底板1および底板1の中央部を取り囲む側壁2から成る凹部の内側に電子部品が収容される容器体と、入出力端子3とを備える。入出力端子3は、絶縁部材5とピン端子4と環状部材6とを備える。絶縁部材5は、側壁2に設けられた貫通孔2aを塞ぐようにして貫通孔2aの開口の周囲に接合されている。ピン端子4は、外周面に突出する鍔部4aを有し、絶縁部材5を貫通して鍔部4aが絶縁部材5に接合されている。環状部材6は、絶縁部材5の鍔部4aが接合された面と反対側において、ピン端子4aに通されてピン端子4の外周面および絶縁部材5に接合されている。ピン端子4の先端に加わる力によって絶縁部材5の接合部に生じる不具合を改善する。
摘要翻译：电子部件收容容器包括容器主体在其上的电子部件是被容纳由侧壁2包围底板1和底板1，以及输入和输出端子3的中央部的凹部的内侧。输入输出端子3，和环形构件6绝缘构件5和销端子4。绝缘部件5接合至的周边与通孔2a的开口，从而封闭在侧壁2上的通孔2a。销端子4具有凸缘部4a的外周面突出，通过绝缘部件5的凸缘部4a接合于绝缘构件5。环形构件6相对的一侧在其上的绝缘构件5的凸缘部4a接合的表面上，通过一个销端子4a通过被接合到所述外周面和销端子4的绝缘构件5。施加在销端子4的尖端上的力，以改善在绝缘构件5的接合部分中发生的问题。

17. 发明专利

JP2016128191A 異種電極接合用積層はんだ材及び電子部品の異種電極の接合方法审中-公开
标题翻译：电子部件异常电极接头和接头方法的层压焊料
公开(公告)号：JP2016128191A
公开(公告)日：2016-07-14
申请号：JP2016019838
申请日：2016-02-04
申请人：千住金属工業株式会社
发明人：渡辺光司 , 豊田実 , 富田智 , 杉野勉 , 菊池大地 , 大嶋大樹
IPC分类号： B23K35/26 , B23K1/00 , B23K1/19 , H05K3/34 , B23K101/42 , B23K103/12 , B23K103/18 , B23K35/14
CPC分类号： B23K35/0238 , B23K1/0016 , B23K1/19 , B23K35/0222 , B23K35/0233 , B23K35/26 , B23K35/262 , B23K35/268 , B23K35/28 , B23K35/40 , B32B15/01 , B32B15/018 , C22C1/00 , C22C11/06 , C22C12/00 , C22C13/00 , C22C13/02 , C22C21/14 , H05K3/3463 , B23K2201/42 , H05K2201/10992 , H05K2203/0405 , H05K2203/12 , Y10T428/12986
摘要：【課題】Cu電極又はCuめっきを施した電極とNi/Auめっき又はAg−Pdめっきを施された電極とを、接合界面における金属間化合物の形成を抑制して高い接合信頼性ではんだ接合する。【解決手段】Ni/Auめっき又はAg−Pd合金めっきを施された電極を有するパッケージを、Cu電極又はCuめっきが施された電極を有するプリント基板にはんだ接合する際に、Sn−Ag−Cu系はんだ材又はSn−Sb系はんだ材と、Sn−Ag−Cu−Ni系はんだ材又はSn−Pb系はんだ材との接合材である異種電極接合用積層はんだ材を加熱及び冷却することにより異種電極接合用積層はんだ材の内部に固相拡散層を形成し、Sn−Ag−Cu系はんだ材又はSn−Pb系はんだ材がCu電極に接するとともにSn−Ag−Cu−Ni系はんだ材又はSn−Cu系はんだ材がNi/Auめっき又はAg−Pd合金めっきを施された電極に接した状態で、Ni/Auめっき又はAg−Pd合金めっきを施された電極とCu電極又はCuめっきが施された電極とをはんだ接合する。【選択図】なし
摘要翻译：要解决的问题：为了连接Cu电极或镀Cu电极的电极和通过焊接以高接头可靠性焊接Ni / Au镀层或Ag-Pd镀层的电极，同时抑制在接合边界上形成金属间化合物。：当将具有Ni / Au电镀或Ag-Pd合金电镀的电极的组合件接合到具有Cu电极的印刷电路板或通过焊接施加有Cu电镀的电极时，用于异质电极接头的层压焊料作为Sn之间的接合材料 -Ag-Cu型焊料或Sn-Sb型焊锡材料和Sn-Ag-Cu-Ni型焊料或Sn-Pb型焊料被加热或冷却，从而在内部形成固相扩散层的用于异质电极接合的层压焊料材料和施加有Ni / Au电镀或Ag-Pd合金电镀的电极，并且通过焊接将Cu电极或施加有Cu电镀的电极焊接在Sn-Ag 将Cu型焊料或Sn-Pb型焊料与Cu电极接触，同时将Sn-Ag-Cu-Ni型焊料或Sn-Cu型焊料进入与施加Ni / Au电镀或Ag-Pd合金电镀的电极接触。选择图：无

18. 发明专利

JP2015527739A 流体自己組立のための二重はんだ層並びに電気部品基板及びその使用方法有权
标题翻译：双焊料层和电部件基板及其用于流体自组装的使用方法
公开(公告)号：JP2015527739A
公开(公告)日：2015-09-17
申请号：JP2015525577
申请日：2013-08-01
申请人：オスラム・シルバニア・インコーポレイテッド
发明人：ジェフェリー・シュール , アラン・レネフ , アダム・スコッチ
IPC分类号： H01L23/12 , H01L21/60 , H05K3/34
CPC分类号： H05K3/3431 , B23K1/0016 , B23K1/20 , B23K3/0684 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/95 , H01L24/97 , H01L33/62 , H01L2224/29082 , H01L2224/29105 , H01L2224/29113 , H01L2224/325 , H01L2224/83143 , H01L2224/83192 , H01L2224/8321 , H01L2224/83815 , H01L2224/83907 , H01L2224/95085 , H01L2224/95101 , H01L2224/95146 , H01L2224/97 , H01L2924/01322 , H05K1/111 , H05K3/3468 , H05K13/0465 , H05K2201/10992 , H05K2203/044 , H05K2203/047 , H05K2203/048 , H01L2924/00012 , H01L2924/0105
摘要：流体自己組立のための二重はんだ層、電気部品基板及びその使用方法について説明する。この二重はんだ層は、ベースはんだ層上に配置される自己組立はんだ層を備え、このベースはんだ層は、電機部品基板のはんだパッド上に配置される。自己組立はんだは、第1温度よりも低い液相線温度を有し、ベースはんだは、該第1温度よりも高い固相線温度を有する。自己組立はんだは、流体自己組立方法の間に第1温度で液化して、電気部品を基板に付着させる。付着後、基板を浴から取り出し、そして加熱し、それによって、ベースはんだと自己組立はんだが組み合わさって複合合金を形成し、これが該部品と基板上にあるはんだパッドとの間に最終的な電気はんだ接続部を形成する。
摘要翻译：用于流体自组装双焊料层，电组件板和使用的方法将描述其。这种双焊接层包括设置在所述基体钎焊层上的自组装焊料层，基焊料层设置在所述电元件基板的焊垫。自组装焊料的液相线温度比第一温度低时，基于焊料具有固相线温度比所述第一温度高。自组装焊料在流体自组装方法之间的第一温度液化以沉积在基板上的电气部件。在沉积之后，将基板从浴中取出，并加热，由此基地焊料和自组装焊料复合合金形成组合，最终的电之间，其上的所述部件和所述基板上的焊盘形成焊料连接。

19. 发明专利

JP5510795B2 Mounting structure of an electronic component mounting method of the electronic component and the substrate for electronic component mounting, 有权
公开(公告)号：JP5510795B2
公开(公告)日：2014-06-04
申请号：JP2009551450
申请日：2009-01-13
申请人：日本電気株式会社
发明人：明大内
IPC分类号： H01L21/60
CPC分类号： H05K3/3436 , H01L21/32 , H01L21/563 , H01L23/49811 , H01L23/49816 , H01L23/49866 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/11334 , H01L2224/1147 , H01L2224/16225 , H01L2224/2929 , H01L2224/29386 , H01L2224/32225 , H01L2224/73204 , H01L2224/75252 , H01L2224/83192 , H01L2224/83851 , H01L2924/00011 , H01L2924/00014 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/15787 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/351 , H05K3/321 , H05K3/4007 , H05K2201/0314 , H05K2201/0367 , H05K2201/10992 , Y02P70/613 , H01L2924/00 , H01L2924/3512 , H01L2924/05442 , H01L2224/81805 , H01L2224/05599
摘要： In an electronic component mounting structure, a semiconductor element (an electronic component) provided with an electrode pad and a board provide with an electrode pad corresponding to the electrode pad are connected via a conductive material portion. On a surface of the board, there is formed solder resist having an opening regulating an area of the electrode pad. The conductive material portion is formed to protrude from a surface of the solder resist. An elastic coefficient of the conductive material portion is lower than that of the solder resist. A solder bump and the conductive material portion are connected via a metal layer. The conductive material portion is formed to have an area larger than that of the opening of the solder resist. An edge of the conductive material portion is adhered to a portion of the surface of the solder resist. Thus, in a case of mounting an electronic component on a board by flip-chip connection, a reliability of connection can be secured.

20. 发明专利

JP2011198777A Solder bonding method and solder joint 审中-公开
标题翻译：焊接方法和焊接接头
公开(公告)号：JP2011198777A
公开(公告)日：2011-10-06
申请号：JP2008153860
申请日：2008-06-12
申请人： Nihon Superior Co Ltd , 株式会社日本スペリア社
发明人： NISHIMURA TETSUO , KOSHI MASUO , MASUDA JUNYA , YAMAMOTO KOJI
IPC分类号： H05K3/34 , B23K1/00 , B23K35/26 , B23K35/363 , B23K101/42 , C22C13/00
CPC分类号： B23K3/0623 , B23K35/262 , B23K2201/40 , H05K3/3436 , H05K3/3463 , H05K3/3484 , H05K2201/10734 , H05K2201/10992 , Y02P70/613
摘要： PROBLEM TO BE SOLVED: To suppress generation of voids by means of a conventional apparatus without using attached apparatuses such as a pressure reducing apparatus, in solder bonding which uses a BGA ball solder and a cream solder.SOLUTION: The ball solder and the cream solder, which have a relationship where a liquidus temperature of a ball solder alloy is lower than a solidus temperature of a solder alloy in the cream solder, are bonded by a reflow method. The liquidus temperature of the ball solder alloy and the solidus temperature of the solder alloy in the cream solder is at least 1°C or higher. The ball solder and the solder alloy used for the cream solder have a eutectic composition.
摘要翻译：要解决的问题：通过常规装置来抑制空隙的产生，而不使用诸如减压装置的装置，使用BGA球焊料和膏状焊料的焊接接合。解决方案：球焊和奶油焊料其中，焊接合金的液相线温度低于膏状焊料中焊料合金的固相线温度的关系，通过回流法接合。焊料合金的液相线温度和焊膏中的焊料合金的固相线温度为至少1℃以上。用于奶油焊料的球焊料和焊料合金具有共晶组成。

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