专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2011041970A Lead-free solder joining material 审中-公开
标题翻译：无铅焊接接合材料
公开(公告)号：JP2011041970A
公开(公告)日：2011-03-03
申请号：JP2009193081
申请日：2009-08-24
申请人： Nihon Superior Co Ltd , 株式会社日本スペリア社
发明人： NISHIMURA TETSUO
IPC分类号： B23K35/26 , B23K1/00 , B23K101/42 , C22C13/00 , C22F1/00 , C22F1/16 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a versatile solder joining material which is usable for a power module with a high calorific value to be used for a power device or the like for driving and controlling an on-vehicle motor and the other electric motors, has excellent heat resistance properties or the like, and particularly, has excellent heat shock resistance, by a simple method.
SOLUTION: Cu and Ni having surplus concentrations are positively acted on an Sn matrix present in a lead-free solder alloy which becomes a master alloy 1 so as to form an intermetallic compound in the solder alloy, control is performed in such a manner that the intermetallic compound is made present in the solder alloy, an intermetallic compound is made present also in a solder joint, and melting at a temperature higher than the liquidus temperature of the lead-free solder alloy as the master alloy is achieved. Further, by adding Ga, the effect of improving the elongation properties in the solder joint is imparted together and thus, the material is made usable for the power module or the like to be used for the on-vehicle device in which durability of the soldered part is thought as important from a use environment accompanied with a severe temperature change.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种多功能的焊料接合材料，其可用于具有高发热量的功率模块，用于驱动和控制车载电动机的功率器件等，另一种电马达，具有优异的耐热性等，特别是通过简单的方法具有优异的耐热冲击性。解决方案：具有多余浓度的Cu和Ni对存在于无铅焊料合金中的Sn基体起积极作用，该Sn基体成为母合金1，以在焊料合金中形成金属间化合物，控制在这样的金属间化合物存在于焊料合金中的情况下，金属间化合物也存在于焊接接头中，并且在实现作为母合金的无铅焊料合金的液相线温度以上的温度下熔融。此外，通过添加Ga，可以将提高焊点的伸长性的效果赋予一体，从而能够将该材料用于将被用于焊接的耐久性的车载装置的动力模块等部分被认为是重要的使用环境伴随着严重的温度变化。版权所有（C）2011，JPO＆INPIT

2. 发明专利

JP2009168569A Monitoring system of molten metal 有权
标题翻译：金属监测系统
公开(公告)号：JP2009168569A
公开(公告)日：2009-07-30
申请号：JP2008005743
申请日：2008-01-15
申请人： Nihon Superior Co Ltd , 株式会社日本スペリア社
发明人： NISHIMURA TETSUO
IPC分类号： G01N25/04 , B23K1/00 , B23K1/08 , G05B23/02
摘要： PROBLEM TO BE SOLVED: To monitor a state or the like of molten metal during operation in a remote place. SOLUTION: This system communicates a monitor having a host computer to a monitoring object having an individual computer on a network. The individual computer measures melting temperature of a molten metal tub at a suitable interval, and uploads the measured temperature to the host computer. A metal sample is sampled from the molten metal tub, a lot signal including the specified monitoring object and the sampling time is applied to the sample, the sample is analyzed, and the analysis data is input into the host computer with the lot signal. The host computer analyzes the uploaded melting temperature and the analysis data with a previously provided analysis program, and downloads this analysis result to the monitoring object. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：在远程操作中监视熔融金属的状态等。解决方案：该系统将具有主计算机的监视器与具有网络上的单个计算机的监视对象进行通信。个别计算机以适当的间隔测量熔融金属桶的熔化温度，并将测得的温度上传到主计算机。从熔融金属桶中取出金属样品，将包含指定监测对象的许多信号和采样时间应用于样品，分析样品，并将分析数据以批号信号输入主机。主机通过先前提供的分析程序分析上传的熔解温度和分析数据，并将该分析结果下载到监控对象。版权所有（C）2009，JPO＆INPIT

3. 发明专利

JP2013013916A Intermetallic compound-containing lead-free solder alloy and method of manufacturing the same 审中-公开
标题翻译：含金属化合物的无铅焊料合金及其制造方法
公开(公告)号：JP2013013916A
公开(公告)日：2013-01-24
申请号：JP2011148600
申请日：2011-07-04
申请人： Nihon Superior Co Ltd , 株式会社日本スペリア社
发明人： NISHIMURA TETSUO
IPC分类号： B23K35/26 , B23K1/00 , B23K1/20 , B23K31/02 , B23K101/40 , B23K101/42 , C22C13/00 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a lead-free solder alloy having excellent heat resistance and spacer behavior as a jointing material which is used for an IC package that requires heat resistance at a high temperature, a power module which generates a large amount of heat for controlling driving of an onboard motor or other electric motors, or the like, and to provide a method of easily manufacturing the lead-free solder alloy.SOLUTION: In a manufacturing process for a lead-free solder alloy whose basic composition is Sn-Cu, a solder alloy having a composition which contains a liquid phase of high temperature is heated to a liquidus-line temperature or higher, to be melted entirely. Then, in order that an intermetallic compounds whose main component is CuSnis generated and grown, the melted alloy is cooled while the temperature condition is controlled to thereby generate an intermetallic compound such as CuSn. After that, solder jointing is performed in a temperature condition in which the intermetallic compound, whose main component is CuSnthat contains the solder alloy containing the intermetallic compound, does not disappear, thereby allowing solder jointing giving a solder junction part that contains the intermetallic compound.
摘要翻译：要解决的问题：为了提供具有优异的耐热性和间隔物性能的无铅焊料合金作为用于需要高温耐热性的IC封装的接合材料，产生大的功率模块用于控制车载电动机或其他电动机的驱动的热量等，并且提供容易制造无铅焊料合金的方法。解决方案：在其基本组成为Sn-Cu的无铅焊料合金的制造方法中，具有含有高温液相的组成的焊料合金被加热至液相线温度或更高，至完全融化然后，为了使主要成分为Cu 6 Sn 5 的金属间化合物生长并生长，将熔融的合金冷却同时控制温度条件从而产生诸如Cu 5 的金属间化合物。之后，在主要成分为Cu 6 Sn 5 的金属间化合物的温度条件下进行焊接，含有含有金属间化合物的焊料合金，不会消失，从而允许焊接接合，形成含有金属间化合物的焊料接合部分。版权所有（C）2013，JPO＆INPIT

4. 发明专利

JP2010274326A Joined structure of solder joint 审中-公开
标题翻译：焊接接头的接合结构
公开(公告)号：JP2010274326A
公开(公告)日：2010-12-09
申请号：JP2009146973
申请日：2009-05-29
申请人： Nihon Superior Co Ltd , 株式会社日本スペリア社
发明人： NISHIMURA TETSUO
IPC分类号： B23K35/26 , C22C13/00
摘要： PROBLEM TO BE SOLVED: To pay attention to the present conditions that solder joining having solder joining properties having high heat dissipation properties, electroconductivity or the like in the joint as new solder properties has not been proposed using a solder alloy, particularly, using a lead-free solder alloy, and to provide a solder joined structure of a solder joint having high heat dissipation properties and electroconductive properties in joining using a solder alloy.
SOLUTION: In the case solder joining is performed using a solder alloy, an element having an effect of refining an intermetallic compound is added to the solder alloy to be used by a specified amount, thus the grains of the intermetallic compound to be formed are made more fine and flattened, and the grain size of the intermetallic compound is controlled. Further, in an Sn-Cu-based solder alloy as one of a lead-free solder alloy, regarding the addition amounts of Cu and Ni when Ni is added as a refining element, that of Cu is controlled to 0.001 to 7.6 wt.% and that of Ni is controlled to 0.001 to 6 wt.%, and the balance Sn (including inevitable impurities), thus the grain size of the intermetallic compound to be formed can be made microparticles.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了注意当前的条件，即焊料合金在新的焊接性能方面尚未提出使用焊料合金，特别是在焊接合金中没有提出具有焊接接合特性的焊料接合性能，焊接接合性能，导电性等的情况，使用无铅焊料合金，并且提供具有高散热性能的焊料接合结构和使用焊料合金的接合中的导电性能。
解决方案：在使用焊料合金进行焊料接合的情况下，将具有精炼金属间化合物的作用的元素添加到要使用的焊料合金中一定量，因此金属间化合物的晶粒为形成得更细且平坦，并且控制金属间化合物的晶粒尺寸。此外，在作为无铅焊料合金之一的Sn-Cu系焊料合金中，关于添加Ni时的Cu和Ni的添加量作为精制元素，Cu的控制为0.001〜7.6重量％ Ni的比例控制在0.001〜6重量％，余量为Sn（含有不可避免的杂质），因此可形成要形成的金属间化合物的粒径。版权所有（C）2011，JPO＆INPIT

5. 发明专利

JP2014136219A Solder for aluminum, and solder joint 有权
标题翻译：铝合金和焊接接头
公开(公告)号：JP2014136219A
公开(公告)日：2014-07-28
申请号：JP2013004315
申请日：2013-01-15
申请人： Nihon Superior Co Ltd , 株式会社日本スペリア社
发明人： NISHIMURA TETSUO , FUKAMI TAKUO , MIYAOKA YUKINORI , SUENAGA MASAKAZU , NISHIMURA TAKATOSHI
IPC分类号： B23K35/26 , B23K1/19 , B23K101/36 , B23K103/10 , C22C13/00
摘要： PROBLEM TO BE SOLVED: To provide a solder joining material of a lead-free composition and a solder joint using the lead-free solder, excellent in corrosion resistance against salt water or the like, and having high reliability.SOLUTION: A solder joining material and a solder joint having the effect excellent in corrosion resistance against water or the like and excellent in joining strength, are achieved by using a lead-free solder alloy composed of 2 wt.% or more of Cu, 1.5 wt.% or more of Ag, and a residual part of Sn. The content of Cu can be reduced by further adding Sb to a main component of the present invention.
摘要翻译：要解决的问题：提供使用无铅焊料的无铅组合物和焊接接头的焊料接合材料，对盐水等的耐腐蚀性优异，并且具有高可靠性。解决方案：焊料接合材料并且通过使用由2重量％以上的Cu，1.5重量％以上的Cu，1.5重量％以上的无铅焊料合金，可以实现具有优异的耐水等性能，优异的接合强度的焊点， Ag和Sn的残留部分。通过向本发明的主要成分进一步添加Sb可以减少Cu的含量。

6. 发明专利

JP2014015654A Method for producing nanoparticle, production device therefor and automatic production device therefor 有权
标题翻译：生产纳米材料的方法，其生产装置及其自动生产装置
公开(公告)号：JP2014015654A
公开(公告)日：2014-01-30
申请号：JP2012152959
申请日：2012-07-06
申请人： Applied Nanoparticle Laboratory Corp , 株式会社応用ナノ粒子研究所 , Nihon Superior Co Ltd , 株式会社日本スペリア社
发明人： KOMATSU AKIO , NISHIMURA TETSUO
IPC分类号： B22F9/24 , B01J19/00 , B82Y40/00
摘要： PROBLEM TO BE SOLVED: To provide a method for producing nanoparticles capable of continuously mass-producing nanoparticles having a uniform particle diameter, and capable of freely regulating production time, a production device therefor and an automatic production device therefor.SOLUTION: The nanoparticle production device comprises: reaction tubes 30 and 40 to be filled with a solvent 11 same as a raw material liquid 18 for nanoparticle production; a temperature controller 22 of controlling the temperature of the solvent 11 of the reaction tubes 30, 40 to the synthesis temperature of the nanoparticles 26; the inflow edges 30e, 40e of the reaction tubes to be fed with the raw material liquid 18; rotors 35, 45 of forming spiral flows e, j along the inside faces of the outer circumferential walls 30h, 40h of the reaction tubes while mixing the fed raw material liquid 18 and the solvent 11 of the reaction tubes 30, 40; and the outflow edges 30f, 40f of the reaction tubes 30, 40 of forming the nanoparticles 26 from the raw material substance 12 in the spiral flows e, j and exhausting a produced liquid 65 including the nanoparticles 26.
摘要翻译：要解决的问题：提供一种能够连续生产具有均匀粒径的纳米粒子并能够自由调节生产时间的纳米粒子的制造方法及其制造装置及其自动生产装置。解决方案：纳米粒子生产装置包括：反应管30和40，填充与用于制备纳米颗粒的原料液18相同的溶剂11; 将反应管30,40的溶剂11的温度控制为纳米颗粒26的合成温度的温度控制器22; 要供给原料液18的反应管的流入边缘30e，40e; 在反应管30,40的混合进料原料液18和溶剂11的同时，沿着反应管的外周壁30h，40h的内表面形成螺旋流e，j的转子35,45; 并且从螺旋状的原料物质12形成纳米颗粒26的反应管30,40的流出边缘30f，40f流动e，j并排出包含纳米颗粒26的生成液65。

7. 发明专利

JP2013132673A Joint material used for joining utilizing near-infrared ray, and joining method 审中-公开
标题翻译：用于加入近红外辐射的接合材料和接合方法
公开(公告)号：JP2013132673A
公开(公告)日：2013-07-08
申请号：JP2011285806
申请日：2011-12-27
申请人： Nihon Superior Co Ltd , 株式会社日本スペリア社
发明人： NISHIMURA TETSUO
IPC分类号： B23K1/005 , B23K35/14 , C23C22/05
摘要： PROBLEM TO BE SOLVED: To provide a solder material and a brazing material capable of improving working efficiency and achieving energy-saving joining by melting the solder material and the brazing material in a short period of time, in joining by near-infrared ray irradiation or the like, and to provide a joining method using the solder material and the brazing material.SOLUTION: In joining utilizing the near-infrared ray irradiation, the surface of the solder material and the brazing material of a joint material as a body to be irradiated is processed so as to absorb the irradiated near-infrared ray efficiently, so that melting rate of the solder material and the brazing material acting as the joint material is accelerated, and joining can be ended in a short period of time. For example, as surface processing, it is possible to adopt a method for coloring the joint material surface to black or the like, or a method for applying or sticking a component capable of absorbing the near-infrared ray to the joint material surface directly or indirectly.
摘要翻译：要解决的问题：为了提供能够在短时间内熔化焊料材料和钎料的工作效率提高并实现节能接合的焊料和钎料，通过近红外线照射或并且提供使用焊料材料和钎料的接合方法。解决方案：在使用近红外线照射的接合中，焊料的表面和作为被照射体的接合材料的钎焊材料被加工以有效吸收照射的近红外线，从而加速作为接合材料的焊料材料和钎料的熔化速度，并且能够在短时间内结束接合。例如，作为表面处理，可以采用将接合材料表面着色为黑色等的方法，或者将能够吸收近红外线的成分直接施加或粘贴在接合材料表面上的方法，或者间接地

8. 发明专利

JP2008142721A Lead-free solder alloy 有权
标题翻译：无铅焊接合金
公开(公告)号：JP2008142721A
公开(公告)日：2008-06-26
申请号：JP2006329946
申请日：2006-12-06
申请人： Nihon Superior Co Ltd , 株式会社日本スペリア社
发明人： NISHIMURA TETSUO
IPC分类号： B23K35/26 , C22C13/00
CPC分类号： H01L24/83 , H01L2224/83101 , H01L2924/01322 , H01L2924/10253 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a lead-free solder alloy which does not cause fracture and cracks on soldered portions even under the circumstances accompanied by severe temperature change, and can form the same stable soldered portion as that by a conventional lead-free solder alloy by developing a solder alloy which is lead-free and contains Sn as a base material.
SOLUTION: The lead-free solder alloy is composed of 2 wt.% or less of Cu, 0.002 to 0.2 wt.% of Ni, 0.001 to 1 wt.% of Ga, and the remainder of Sn. Excellent elongation is provided to the solder alloy by adding Ga. The stress caused in the solder can be absorbed by the elongation of the solder, and the stable soldered portion can be formed.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供即使在伴随严重的温度变化的情况下也不会在焊接部分上产生断裂和裂纹的无铅焊料合金，并且可以形成与常规引线相同的稳定的焊接部分通过开发无铅焊料合金并含有Sn作为基材的无焊料合金。
解决方案：无铅焊料合金由Cu，0.002〜0.2重量％的Ni，0.001〜1重量％的Ga和Sn的余量组成。通过添加Ga向焊料合金提供优异的伸长率，焊料中引起的应力可以被焊料的伸长率吸收，并且可以形成稳定的焊接部分。版权所有（C）2008，JPO＆INPIT

9. 发明专利

JP2012020331A Joining structure 审中-公开
标题翻译：接合结构
公开(公告)号：JP2012020331A
公开(公告)日：2012-02-02
申请号：JP2010162267
申请日：2010-07-16
申请人： Nihon Superior Co Ltd , 株式会社日本スペリア社
发明人： NISHIMURA TETSUO
IPC分类号： B23K1/19 , B23K1/20 , B23K35/26 , B23K101/36 , B23K103/12 , C22C13/00 , H01L31/042 , H05K3/24 , H05K3/34
CPC分类号： Y02E10/50
摘要： PROBLEM TO BE SOLVED: To provide a solder joining structure capable of maintaining excellent durability and high reliability for a long time by using a Sn-Zn based lead-free solder alloy even when a material to be joined is a copper material.SOLUTION: An intermetallic compound is formed at a solder joining interface to improve joining characteristics by having a structure where a material 2 to be joined composed of the copper material and the solder alloy are not directly brought into contact with each other or having a structure constituted of a material 1 to be joined other than the copper material and the solder alloy in the joining structure using the Sn-Zn based lead-free solder alloy 3. Dissimilar metal contact corrosion generated among the constituting metals of the Sn-Zn based lead-free solder alloy 3 and the material 2 to be joined is prevented and the high reliability is maintained at a solder joining part. Oxidation of a solder surface is suppressed by adding an element with antioxidant effect such as Mn to the Sn-Zn based solder alloy, and a joining structure excellent in the durability can be obtained.
摘要翻译：要解决的问题：即使当待接合的材料是铜材料时，通过使用Sn-Zn基无铅焊料合金来提供能够长时间保持优异的耐久性和高可靠性的焊料接合结构。解决方案：在焊料接合界面处形成金属间化合物，以通过具有这样的结构来提高接合特性，其中由铜材料和焊料合金构成的待接合材料2不直接彼此接触或具有由使用Sn-Zn类无铅焊料合金的接合结构中的铜材料以外的被连接材料1和焊料合金构成的结构3.在Sn-Zn的构成金属中产生的异种金属接触腐蚀无铅焊料合金3和待接合材料2被防止，并且在焊料接合部分保持高的可靠性。通过向Sn-Zn基焊料合金中添加具有抗氧化效果的元素来抑制焊料表面的氧化，并且可以获得耐久性优异的接合结构。版权所有（C）2012，JPO＆INPIT

10. 发明专利

JP2012016740A Solder shape for additional supply to solder bath and solder composition adjusting method 审中-公开
标题翻译：用于添加焊膏和焊接组合物调整方法的焊接形状
公开(公告)号：JP2012016740A
公开(公告)日：2012-01-26
申请号：JP2010156616
申请日：2010-07-09
申请人： Nihon Superior Co Ltd , 株式会社日本スペリア社
发明人： NISHIMURA TETSUO
IPC分类号： B23K35/40 , B22F3/02 , B22F3/24 , B23K1/08 , B23K35/14 , B23K35/26 , B23K35/28 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide an efficient adjusting method of a melting solder composition in a solder bath.SOLUTION: Sn powder and/or Zn powder is made to be a main component, metal powder of components prepared to the Sn powder and/or the Zn powder is added and mixed, and thereafter is compressed and solidified to mold lead-free solder (hereinafter called pellet) with a necessary shape that is prepared to a lead-free solder pellet for additional supply, so that high temperature dissolving operation during manufacturing can be resolved and the lead-free solder pellet can be obtained in a short time. When preparing melting solder composition in a dip solder bath using the lead-free solder pellet obtained by the method, the lead-free solder pellet that is fed is in a state that powder of each composition is combined, so that it is dissolved in a shorter time than alloy (ingot) manufactured by a conventional casting manufacturing method after dissolution, so as to enable adjustment of a solder component.
摘要翻译：要解决的问题：提供在焊料槽中熔化焊料组合物的有效调节方法。解决方案：将Sn粉末和/或Zn粉末作为主要成分，添加并混合制备成Sn粉末和/或Zn粉末的成分的金属粉末，然后压缩固化，具有必要形状的无铅焊料（以下称为颗粒），其制备成用于附加供应的无铅焊料颗粒，从而可以解决制造过程中的高温溶解操作，并且可以在短时间内获得无铅焊料颗粒。当使用通过该方法获得的无铅焊料块在浸焊焊料槽中制备熔融焊料组合物时，所供给的无铅焊料颗粒处于组合各组合物的粉末的状态，使其溶解在比通过常规铸造制造方法制造的合金（锭）更短的时间，以便能够调整焊料成分。版权所有（C）2012，JPO＆INPIT

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式