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11. 发明专利

JP2008234996A Anisotropic conductive sheet, its manufacturing method, wiring board connection body, wiring board module, and electronic apparatus 审中-公开
标题翻译：各向异性导电板及其制造方法，接线板连接体，接线板模块和电子设备
公开(公告)号：JP2008234996A
公开(公告)日：2008-10-02
申请号：JP2007072687
申请日：2007-03-20
申请人： Sumitomo Electric Ind Ltd , Sumitomo Electric Printed Circuit Inc , 住友電工プリントサーキット株式会社 , 住友電気工業株式会社
发明人： KOYAMA KEIJI , YAMAMOTO MASAMICHI , MIKAGE MASANARI , BOKU TATSUTAMA , NAKAMA KOKI
IPC分类号： H01R43/00 , H01B5/16 , H01B13/00 , H01R11/01 , H05K1/14 , H05K3/32
摘要： PROBLEM TO BE SOLVED: To provide an anisotropic conductive sheet excelling in usability while responding to reduction of a pitch as an electric connection medium between wiring boards; and its manufacturing method.
SOLUTION: This anisotropic conductive sheet A is formed by sticking a first sheet 10 and a second sheet 20 on each other. The respective sheets 10 and 20 have base material films 11 and 21, outer adhesive layers 12 and 22, and inner adhesive layers 13 and 23, respectively. The respective base material films 11 and 21 are provided with tapered through-holes 16 and 26 expanding toward a second surface from a first surface, and conductive parts 17 and 27 embedding the through-holes, respectively. Since the two conductive parts connected to each other are connected on the large-diameter side, drop-out of the upper conductive part is prevented by the lower conductive part.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供优异的可用性的各向异性导电片，同时响应于线路板之间作为电连接介质的间距的减小; 及其制造方法。解决方案：该各向异性导电片A通过将第一片10和第二片20彼此粘合而形成。各片10和20分别具有基材膜11和21，外粘合层12和22以及内粘合层13和23。各个基材膜11和21设置有从第一表面向第二表面扩展的锥形通孔16和26，并且分别嵌入通孔的导电部17和27。由于彼此连接的两个导电部件连接在大直径侧，所以通过下部导电部件防止上部导电部件的脱落。版权所有（C）2009，JPO＆INPIT

12. 发明专利

JP2008098302A Wiring board, wiring board connector and its manufacturing process 审中-公开
标题翻译：接线板，接线板连接器及其制造工艺
公开(公告)号：JP2008098302A
公开(公告)日：2008-04-24
申请号：JP2006276863
申请日：2006-10-10
申请人： Sumitomo Electric Ind Ltd , 住友電気工業株式会社
发明人： YAMAMOTO MASAMICHI , BOKU TATSUTAMA
IPC分类号： H05K1/14 , H01R9/11 , H01R43/00 , H05K1/02 , H05K3/36
摘要： PROBLEM TO BE SOLVED: To make electrical interconnection of conductors and of resins at insulating portions with a required force, and to separate them as required without causing any damage on the conductor. SOLUTION: The wiring board 20 having a plurality of conductor lines 22 arranged while spaced apart from each other as joints 23 comprises plated contacts 24 having an arcuate surface provided on the surface of the conductor lines 22 at the joint 20, and a bonding resin portion 25 filling at least the gap between the plated contacts 24b at the joint 23 wherein the plated contacts 24b and the bonding resin portion 25 are bonded to the joint 33 of other wiring board 30 and connected therewith. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：使导体和树脂在绝缘部分以所需的力进行电气互连，并根据需要分离，而不会对导体造成任何损坏。解决方案：具有布置成彼此间隔开的多个导体线22的布线板20作为接头23包括在接头20处设置在导体线22的表面上的具有弧形表面的电镀触点24，以及接合树脂部25至少填充接合部23处的电镀触点24b之间的间隙，其中电镀触点24b和接合树脂部25接合到另一布线板30的接头33并与其连接。版权所有（C）2008，JPO＆INPIT

13. 发明专利

JP2008084607A Film for connecting wiring board and method of connecting wiring board 有权
标题翻译：用于连接接线板的电路和连接接线板的方法
公开(公告)号：JP2008084607A
公开(公告)日：2008-04-10
申请号：JP2006261421
申请日：2006-09-26
申请人： Sumitomo Electric Ind Ltd , 住友電気工業株式会社
发明人： TOSHIOKA HIDEAKI , YAMAMOTO MASAMICHI
IPC分类号： H01R11/01 , B32B27/18 , H01B1/22 , H05K1/14 , H05K3/32
摘要： PROBLEM TO BE SOLVED: To provide a film for connecting wiring boards which provides sufficient adhesion reliability and does not cause poor connection even when the sum of heights of electrodes facing each other is larger than 30 μm, and a method of connecting wiring boards to bond two wiring boards having wired circuits on substrate surfaces using the film for connecting wiring boards, thereby connecting the wired circuits of two wiring boards to each other.
SOLUTION: In the film for connecting wiring boards consisting of a thermosetting resin composition in which conductive particles are dispersed, the curing reactivity increases from one surface of a film toward the other surface, or increases from both surfaces of the film toward the center. In the method of connecting wiring boards, the film for connecting wiring boards is held between the two wiring boards having wired circuits on a surface of the substrate, heated and pressed.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种连接线路板的膜，其提供足够的粘附可靠性，并且即使当彼此相对的电极的高度之和大于30μm时也不会导致不良连接，以及连接布线使用所述用于连接线路板的膜将基板表面上具有布线电路的两个布线板接合，从而将两个布线板的布线电路彼此连接。解决方案：在由导电颗粒分散的热固性树脂组合物组成的连接布线板的膜中，固化反应性从膜的一个表面向另一个表面增加，或者从膜的两个表面增加到中央。在连接布线板的方法中，用于连接布线板的膜保持在具有布线电路的两个布线板之间，加热和加压。版权所有（C）2008，JPO＆INPIT

14. 发明专利

JP2006073397A Anisotropic conductive film and its manufacturing method 审中-公开
标题翻译：各向异性导电膜及其制造方法
公开(公告)号：JP2006073397A
公开(公告)日：2006-03-16
申请号：JP2004256787
申请日：2004-09-03
申请人： Sumitomo Electric Ind Ltd , 住友電気工業株式会社
发明人： YAMAMOTO MASAMICHI , KASHIWABARA HIDEKI , TOSHIOKA HIDEAKI
IPC分类号： H01R11/01 , C09J9/02 , C09J163/00 , H01R43/00
摘要： PROBLEM TO BE SOLVED: To provide an anisotropic conductive film of which time stability while stored at a room temperature is excellent, in other words, of which pot life is long, and free from deterioration of reliability of electric insulation and its manufacturing method.
SOLUTION: The anisotropic conductive film is made from anisotropic adhesive agent in which conductive particles are dispersed in adhesive agent composition containing epoxide resin of which molecule weight is less than 500, epoxide resin of which molecule weight is equal to or more than 500 including two or more epoxide bases in a molecule and latent hardening agent as essential ingredients. The anisotropic conductive film and its manufacturing method are characterized in that the content amount of solvent constituent for dissolving the epoxide resin is equal to or less than 1,000 ppm.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种各向异性导电膜，其在室温下储存时的时间稳定性优异，换句话说，其使用寿命长，并且不会劣化电绝缘及其制造的可靠性方法。解决方案：各向异性导电膜由各向异性粘合剂制成，其中导电颗粒分散在分子量小于500的环氧树脂的粘合剂组合物中，分子量等于或大于500的环氧树脂包括分子中的两个或多个环氧化物碱和潜在硬化剂作为必需成分。各向异性导电膜及其制造方法的特征在于，溶解环氧树脂的溶剂成分的含量等于或小于1,000ppm。版权所有（C）2006，JPO＆NCIPI

15. 发明专利

JP2015015322A 接着シート、電気部品及びその製造方法有权
标题翻译：粘合片，电子元件及其制造方法
公开(公告)号：JP2015015322A
公开(公告)日：2015-01-22
申请号：JP2013140215
申请日：2013-07-03
申请人：住友電工プリントサーキット株式会社 , Sumitomo Electric Printed Circuit Inc , 住友電気工業株式会社 , Sumitomo Electric Ind Ltd
发明人： KIMURA MICHIHIRO , UCHIDA YOSHIFUMI , KITANI SATOSHI , YAMAMOTO MASAMICHI
IPC分类号： H01L23/373 , C09J7/00 , C09J201/00
摘要：【課題】本発明は、対向して配設される被接着部材の接着において、機械的接着強度と熱伝導性とを共に向上することが可能な接着シートを提供することを目的とする。【解決手段】本発明に係る接着シートは、熱伝導性接着層を備え、少なくとも厚さ方向に熱伝導性を発現する接着シートであって、上記熱伝導性接着層が、厚さ方向に連続する熱伝導性ペースト製のバンプと、このバンプの周囲に充填される接着剤層とを有することを特徴とする。上記バンプは、熱伝導性接着層の表面及び裏面の少なくとも一方に近接又は表出するとよい。上記バンプの断面形状は、台形状であるとよい。上記接着剤層が熱伝導性粒子を含有し、その熱伝導性粒子の含有量が20体積%以下であることが好ましい。上記熱伝導性接着層は、電気絶縁性を有するとよい。【選択図】図1
摘要翻译：要解决的问题：提供一种能够提高机械粘合强度和导热性的粘合片，在彼此相对配置的粘结部件的粘合中。粘合片根据本发明的粘合片是一种粘合片，导电粘合剂层，并且至少在其厚度方向上具有导热性。导热粘合剂层包括：其厚度方向连续的凸块，由导热浆制成; 以及填充在凸块周围的粘合剂层。凸起可以与导热粘合剂层的前表面和后表面中的至少一个相邻或暴露。凸块的横截面形状可以是梯形的。优选地，粘合剂层含有导热性粒子，导热性粒子的含量为20体积％以下。导热粘合剂层可具有电绝缘性能。

16. 发明专利

JP2014220085A フラットケーブルの分岐構造、分岐フラットケーブル及び分岐フラットケーブルの製造方法审中-公开
标题翻译：平板电缆的分支结构，分支平面电缆和分支平板电缆的制造方法
公开(公告)号：JP2014220085A
公开(公告)日：2014-11-20
申请号：JP2013098019
申请日：2013-05-07
申请人：住友電気工業株式会社 , Sumitomo Electric Ind Ltd
发明人： MIKAGE MASANARI , YAMAMOTO MASAMICHI , KOYAMA KEIJI
IPC分类号： H01B7/08 , H01B7/00 , H01B13/00 , H01R12/61 , H01R43/00 , H01R43/02
CPC分类号： H01B13/00 , H01B7/00 , H01B7/08 , H01R12/61 , H01R43/00 , H01R43/02
摘要：【課題】本発明は、交差するフラットケーブルの導体同士を容易かつ確実に接続することができるフラットケーブルの分岐構造を提供することを目的とする。【解決手段】ストライプ状に配設される複数の第1導体を有するフラットケーブル本体と、ストライプ状に配設される複数の第2導体を有するフラットケーブル分岐体とを交差するよう重ね合わせ、複数の第1導体と複数の第2導体とを任意の組合せで導通させるフラットケーブルの分岐構造であって、対向配設されかつ少なくとも対向面側が露出した第1導体及び第2導体間に積層される接続シートを備え、この接続シートが、第1導体及び第2導体の導通を図る組合せに係る第1交差部毎に配設される導電性バンプと、導電性バンプ以外の領域に積層される基材層とを備え、基材層が絶縁樹脂層とその両面に積層される一対の接着剤層とを有し、絶縁樹脂層の軟化温度が接着剤層の軟化温度より大きいことを特徴とする。【選択図】図1
摘要翻译：要解决的问题：提供扁平电缆的分支结构，使得相交的扁平电缆的导体彼此容易且可靠地连接。扁平电缆的分支结构包括扁平电缆主体，其具有多个第一以带状形式布置的导体和扁平电缆分支体，其具有以条状形式布置的多个第二导体，其相交地重叠，使得在第一导体和第二导体之间以任何组合实现导电。连接片层叠在第一导体和第二导体之间，它们彼此相对并且至少在相对的面侧暴露。连接片包括布置成用于第一导体和第二导体之间的导电组合的每个第一交点的导电凸块，以及层压在除了导电凸块之外的区域上的衬底层。衬底层包括层压在绝缘树脂层两侧的绝缘树脂层和一对粘合剂层。绝缘树脂层的软化温度高于粘合剂层的软化温度。

17. 发明专利

JP2013151706A Adhesive for connecting electrode 审中-公开
标题翻译：用于连接电极的胶粘剂
公开(公告)号：JP2013151706A
公开(公告)日：2013-08-08
申请号：JP2013103590
申请日：2013-05-16
申请人： Sumitomo Electric Ind Ltd , 住友電気工業株式会社
发明人： YAMAMOTO MASAMICHI , KASHIWABARA HIDEKI
IPC分类号： C09J129/14 , C09J7/00 , C09J9/02 , C09J11/06 , C09J163/00
摘要： PROBLEM TO BE SOLVED: To provide an adhesive for connecting an electrode, capable of striking a balance between adhesiveness and repairability, and having long-term storage stability.SOLUTION: An adhesive for connecting an electrode contains polyvinyl butyral, an epoxy resin, a latent curing agent and electroconductive particles, wherein the polyvinyl butyral has a molecular weight of ≥10,000 and ≤70,000 and a ≥20 mol% and ≤40 mol% hydroxy group concentration.
摘要翻译：要解决的问题：提供一种连接电极的粘合剂，能够在粘合性和可修复性之间达到平衡，并且具有长期的保存稳定性。解决方案：用于连接电极的粘合剂包含聚乙烯醇缩丁醛，环氧树脂，潜在的固化剂和导电颗粒，其中聚乙烯醇缩丁醛的分子量≥10,000和≤70,000，羟基浓度≥20mol％和≤40mol％。

18. 发明专利

JP2011166174A Connection method, connection structure and electronic apparatus 有权
标题翻译：连接方法，连接结构和电子设备
公开(公告)号：JP2011166174A
公开(公告)日：2011-08-25
申请号：JP2011113499
申请日：2011-05-20
申请人： Sumitomo Electric Ind Ltd , Sumitomo Electric Printed Circuit Inc , 住友電工プリントサーキット株式会社 , 住友電気工業株式会社
发明人： YAMAMOTO MASAMICHI , NAKATSUGI KYOICHIRO , YAMAGUCHI TAKASHI , KAWAKAMI SHIGEKI , KIMURA MICHIHIRO
IPC分类号： H05K3/34 , H01L21/60 , H05K3/32
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a connection method and an electronic apparatus for realizing an adhesive connection structure at low cost, while the manufacturing step is simplified.
SOLUTION: A mother substrate 20 has a rigid substrate 21, an adhesive connection electrode 22 and a solder connection electrode 26 disposed on the rigid substrate 21. The surface of each of electrodes 22, 26 is covered with an organic film 25, which is an anti-oxidation film formed by OSP process. An adhesive connection structure C is formed by a preliminary connection with an adhesive 30, followed by solder reflow to form a solder connection structure D. In that case, connection is performed so that the increase in the connection resistance between the electrode 12 and 22, before and after the solder reflow process are secured so as to be within a predetermined range, and the increase in the connection resistance after the solder reflow process is suppressed, while conduction of each electrodes 22, 26 is secured; and the solder connection structure and the adhesive connection structure are formed smoothly.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种以低成本实现粘合剂连接结构的连接方法和电子设备，而制造步骤简化。解决方案：母基板20具有刚性基板21，粘合剂连接电极22和布置在刚性基板21上的焊接连接电极26.每个电极22,26的表面被有机膜25覆盖，其是通过OSP工艺形成的抗氧化膜。通过与粘合剂30的初步连接形成粘合剂连接结构C，然后通过焊料回流形成焊料连接结构D.在这种情况下，进行连接，使得电极12和22之间的连接电阻的增加，在焊料回流工艺之前和之后被确保为在预定范围内，并且在确保每个电极22,26的导通时，抑制了在回流焊工艺之后的连接电阻的增加; 并且焊接连接结构和粘合剂连接结构平滑地形成。版权所有（C）2011，JPO＆INPIT

19. 发明专利

JP2011109026A Method of manufacturing wiring board connected body, and wiring body 审中-公开
标题翻译：制造接线板连接体和接线体的方法
公开(公告)号：JP2011109026A
公开(公告)日：2011-06-02
申请号：JP2009265366
申请日：2009-11-20
申请人： Sumitomo Electric Ind Ltd , 住友電気工業株式会社
发明人： YAMAMOTO MASAMICHI , NAKATSUGI KYOICHIRO , OKUDA YASUHIRO
IPC分类号： H05K3/36 , H05K1/14
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board connected body reducing manufacturing cost of the wiring board connected body by adopting a wiring board of low heat resistance, and to provide a wiring body used therein.
SOLUTION: The method includes a first adhesive layer forming step of forming a first adhesive layer 103 containing one of a thermosetting resin and a curing agent in a connection area including the first electrode of a first wiring board 8, a second adhesive layer forming step of forming a second adhesive layer 102 including the other of the thermosetting resin and the curing agent in a connection area including second electrodes 11b, 12b of a second wiring board 10, a positioning step of positioning the first wiring board and second wiring board by bringing the first electrode into opposition to the second electrode and bringing the first adhesive layer into face contact with the second adhesive layer, and a connecting step of pinching the first adhesive layer and second adhesive layer between the first wiring board and second wiring board to react the thermosetting resin with the curing agent to electrically conduct the first electrode to the second electrode and bonding together the first wiring board and second wiring board at a predetermined temperature.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决的问题：提供一种制造布线板连接体的方法，通过采用耐热性低的布线板降低布线板连接体的制造成本，并提供其中使用的布线体。解决方案：该方法包括在包括第一布线板8的第一电极的连接区域中形成含有热固性树脂和固化剂之一的第一粘合剂层103的第一粘合层形成步骤，第二粘合剂层在包括第二布线板10的第二电极11b，12b的连接区域中形成包括另一个热固性树脂和固化剂的第二粘合剂层102的形成步骤;将第一布线板和第二布线板通过使第一电极与第二电极相对并使第一粘合剂层与第二粘合剂层面接触，以及将第一粘合层和第二粘合剂层夹在第一布线板和第二布线板之间的连接步骤，使热固性树脂与固化剂反应，以将第一电极导电到第二电极并结合在一起第一布线板和第二布线板处于预定温度。版权所有（C）2011，JPO＆INPIT

20. 发明专利

JP2011040516A Connection structure for printed circuit board, connection structure for printed circuit board in hard disk drive, and electronic equipment 有权
标题翻译：印刷电路板的连接结构，硬盘驱动器中印刷电路板的连接结构和电子设备
公开(公告)号：JP2011040516A
公开(公告)日：2011-02-24
申请号：JP2009185503
申请日：2009-08-10
申请人： Sumitomo Electric Ind Ltd , Sumitomo Electric Printed Circuit Inc , 住友電工プリントサーキット株式会社 , 住友電気工業株式会社
发明人： NOGUCHI KO , SHIMOMURA TETSUYA , YAMAMOTO MASAMICHI , NAKATSUGI KYOICHIRO
IPC分类号： H05K1/14 , G11B5/60 , G11B21/21 , H05K1/02 , H05K3/36
摘要： PROBLEM TO BE SOLVED: To facilitate forming a transmission line of a signal wire into a multiline, by connecting a plurality of printed circuit boards via an anisotropic conductive adhesive, and to form a high band by reducing an impedance when transmitting a high-frequency digital signal or the like, to reduce a transmission loss, and further by preventing effectively a crosstalk or the like between wires.
SOLUTION: This connection structure for the printed circuit boards is constituted to connect the first printed circuit board 21 provided with at least two or more of the signal wires 31, 32, and the second printed circuit board 22 provided respectively with at least two or more of branch wires 41a, 41b, 42a, 42b for forming the respective signal lines into the multilines, via the anisotropic conductive adhesive 24, an end of each branch wire corresponding to each signal wire is provided with connection electrodes 34, 35 including connection parts 34a, 34b, 35a, 35b opposed to the connection electrodes, and a short-circuiting part 34c of short-circuiting the connection parts, and the short-circuiting part is arranged in a position evacuated from the connection parts.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了便于将信号线的传输线形成多线，通过经由各向异性导电粘合剂连接多个印刷电路板，并且在传输高电平时通过减小阻抗来形成高带频率数字信号等，以减少传输损耗，并且进一步通过有效地防止电线之间的串扰等。解决方案：印刷电路板的该连接结构被构成为连接设置有至少两个或更多个信号线31,32和第二印刷电路板22的第一印刷电路板21，该第二印刷电路板至少分别设置两条或多条分支线41a，41b，42a，42b，用于通过各向异性导电粘合剂24将各信号线形成多线，每个分支线的与各信号线相对应的端部设有连接电极34,35，连接电极34,35包括与连接电极相对的连接部34a，34b，35a，35b以及连接部短路的短路部34c和短路部配置在从连接部抽出的位置。版权所有（C）2011，JPO＆INPIT

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