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    • 13. 发明专利
    • Face-bonding tool, face-bonding vacuum device, and adhering method using the same
    • 表面粘合工具,表面粘合真空装置及其使用方法
    • JP2007039686A
    • 2007-02-15
    • JP2006205263
    • 2006-07-27
    • Samsung Electronics Co Ltd三星電子株式会社Samsung Electronics Co.,Ltd.
    • KANG HO-MINLEE BYOUNG-HUNBIN KUNKIHWANG JEONG-HOKIM SUNG-MIN
    • C09J5/00C09J5/06C09J133/00C09J183/04G02F1/1333G09F9/00
    • H01L21/67363
    • PROBLEM TO BE SOLVED: To provide a face-bonding tool for adhering an adhesive material to an adherend under a vacuum atmosphere, to provide a face-bonding vacuum device, and an adhering method using the same.
      SOLUTION: This face-bonding tool 100 has a fixation part 120 which comprises a plurality of fixation pockets 122, a first frame 110 which comprises movable parts 140 each positioned under the fixation pocket 122 and approachable to or separable from the fixation pocket 122 and first elastic films 150 each positioned under the movable part 140 and elongated or shrunk by a pressure change for moving the movable part 140, and a second frame 160 which comprises second elastic films 170 each separable from or approachable to the first film 110 and elongated or shrunk by the pressure change on a position corresponding to the fixation pocket 122.
      COPYRIGHT: (C)2007,JPO&INPIT
    • 要解决的问题:提供一种用于在真空气氛下将粘合剂材料粘合到被粘物上的面粘合工具,以提供面粘合真空装置及使用其的粘合方法。 解决方案:该面粘合工具100具有固定部分120,该固定部分120包括多个固定凹坑122,第一框架110,其包括每个定位在固定凹槽122下方的可移动部分140,并且可接近或可从固定凹槽 122和第一弹性膜150,每个第一弹性膜150位于可移动部分140的下方并通过用于移动可移动部分140的压力变化而伸长或收缩;以及第二框架160,其包括第二弹性膜170,第二弹性膜170可分离或接近于第一膜110, 通过在与固定口袋122相对应的位置处的压力变化而伸长或收缩。(C)2007,JPO&INPIT
    • 17. 发明专利
    • Pluggable optical transceiver module assembly
    • 可插拔的光收发器模块组件
    • JP2006079100A
    • 2006-03-23
    • JP2005263539
    • 2005-09-12
    • Samsung Electronics Co Ltd三星電子株式会社Samsung Electronics Co.,Ltd.
    • KIM SUNG-MINKWON JIN-WOOK
    • G02B6/42G02B6/36
    • G02B6/4246G02B6/4292
    • PROBLEM TO BE SOLVED: To provide a pluggable optical transceiver module which can be unplugged from a cage even in a state where an optical fiber connector is inserted, and to provide a pluggable optical transceiver module assembly using the same.
      SOLUTION: The pluggable optical transceiver module assembly 100 comprises a bail clip 400 for providing a latching part 428 to be locked by a locking member 525 of the cage 500, and an optical transceiver module 110 with a connector part 200 having a housing part for housing an external connector. The bail clip 400 comprises a main body 410 penetrating through 1st and 2nd ends of the connector part 200, and a lock pin 420 which is supported by the 1st end part of the main body 410 and is made to project or sink in the 2nd end; and a bail 430 which is supported by the 1st end part of the main body 410 at one end and latched on the 1st end of the connector part 200 in a lever shape, and makes the latching part 428 project by use of restoring force of the lock pin 420 by applying force to the other end to sink the latching part 428 and removing the applied force.
      COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:提供即使在插入光纤连接器的状态下也可以从保持架中拔出的可插拔光收发器模块,并且提供一种使用其的可插拔光收发模块组件。 解决方案:可插拔光收发器模块组件100包括用于提供由保持架500的锁定构件525锁定的闩锁部分428的拨号夹子400和具有连接器部件200的光收发器模块110,连接器部件200具有壳体 用于容纳外部连接器的部件。 吊卡400包括穿过连接器部件200的第一端和第二端的主体410,以及由主体410的第一端部支撑并被制成在第二端部上或底部的锁定销420 ; 以及吊杆430,其一端被主体410的第一端部支撑并且以杠杆形状锁定在连接器部件200的第一端上,并且通过使用闩锁部件428的恢复力而突出 锁定销420通过向另一端施加力而使锁定部分428沉降并去除所施加的力。 版权所有(C)2006,JPO&NCIPI
    • 18. 发明专利
    • Gate-all-around semiconductor element and method of fabricating the same
    • GATE全面的半导体元件及其制造方法
    • JP2005354065A
    • 2005-12-22
    • JP2005167769
    • 2005-06-08
    • Samsung Electronics Co Ltd三星電子株式会社Samsung Electronics Co.,Ltd.
    • YUN EUN-JUNGKIM SUNG-MINLEE SUNG-YOUNG
    • H01L29/786H01L21/336H01L29/423H01L29/78
    • H01L29/66553H01L29/42376H01L29/42392H01L29/66484H01L29/7831
    • PROBLEM TO BE SOLVED: To provide a gate-all-around semiconductor element and a method of fabricating the same.
      SOLUTION: A pair of pillars that include the source/drain regions is formed by steps of: providing a mono-crystalline silicon substrate, etching the substrate to form a pair of spaced-apart trenches such that a wall of the mono-crystalline silicon stands between the trenches, filling the trenches with insulative material, implanting impurities into the wall of mono-crystalline silicon, and forming an opening in the wall such that a portion of the wall remains as a pillar, wherein a sacrificial layer is formed at the bottom of the opening, a channel region is formed to adapt to the sacrificial layer between the pillars, the sacrificial layer is removed, and the gate oxide and gate electrode are formed around the channel region, employing one or more sidewall spacers to define the effective width of the channel region and minimize parasitic capacitance between the source/drain regions and gate electrode.
      COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:提供一种全栅半导体元件及其制造方法。 解决方案:包括源极/漏极区域的一对支柱由以下步骤形成:提供单晶硅衬底,蚀刻衬底以形成一对间隔开的沟槽,使得单 - 晶体硅位于沟槽之间,用绝缘材料填充沟槽,将杂质注入单晶硅的壁中,并在壁中形成开口,使得壁的一部分保持为柱状,其中形成牺牲层 在开口的底部,形成通道区域以适应柱之间的牺牲层,去除牺牲层,并且栅极氧化物和栅电极围绕沟道区形成,采用一个或多个侧壁间隔物来限定 沟道区域的有效宽度,并使源极/漏极区域和栅电极之间的寄生电容最小化。 版权所有(C)2006,JPO&NCIPI